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    • 4. 发明授权
    • Method of making activated carbon composites from supported
crosslinkable resins
    • 由负载的可交联树脂制备活性炭复合材料的方法
    • US5776385A
    • 1998-07-07
    • US806892
    • 1997-02-25
    • Kishor P. GadkareeJoseph F. Mach
    • Kishor P. GadkareeJoseph F. Mach
    • B01J20/20C04B35/83C01B31/00
    • B01J20/20C04B35/83
    • A method for making an activated carbon composite which involves providing a crosslinkable resin and a support material which is wettable by the resin. The support material can be cotton, chopped wood, sisal, non-fugitive material, and combinations of these. The support is contacted with the resin; and the resin and support material are dried. The resin and support material are then shaped, the resin is cured, and the resin and any carbonizable material are carbonized. The carbon is then activated to produce the product composite. An activated carbon composite produced by the above described method in which the carbon is in the form of a continuous structure reinforced by and uniformly distributed throughout non-fugitive support material.
    • 一种制备活性炭复合物的方法,其包括提供可交联树脂和可被树脂润湿的载体材料。 支撑材料可以是棉花,切碎的木材,剑麻,非易失性材料,以及它们的组合。 支撑体与树脂接触; 并干燥树脂和载体材料。 然后树脂和支撑材料成型,树脂固化,并且树脂和任何可碳化的材料被碳化。 然后将碳活化以产生产物复合物。 通过上述方法制备的活性炭复合材料,其中碳是连续结构形式,并且通过非逸散性支撑材料均匀分布并均匀分布。
    • 5. 发明申请
    • GLASS-BASED SOI STRUCTURES
    • 基于玻璃的SOI结构
    • US20100213582A9
    • 2010-08-26
    • US12328030
    • 2008-12-04
    • James G. CouillardKishor P. GadkareeJoseph F. Mach
    • James G. CouillardKishor P. GadkareeJoseph F. Mach
    • H01L29/12H01L29/02
    • H01L21/76254H01L21/2007
    • Semiconductor-on-insulator (SOI) structures, including large area SOI structures, are provided which have one or more regions composed of a layer (15) of a substantially single-crystal semiconductor (e.g., doped silicon) attached to a support substrate (20) composed of an oxide glass or an oxide glass-ceramic. The oxide glass or oxide glass-ceramic is preferably transparent and preferably has a strain point of less than 1000° C., a resistivity at 250° C. that is less than or equal to 1016 Ω-cm, and contains positive ions (e.g., alkali or alkaline-earth ions) which can move within the glass or glass-ceramic in response to an electric field at elevated temperatures (e.g., 300-1000° C.). The bond strength between the semiconductor layer (15) and the support substrate (20) is preferably at least 8 joules/meter2. The semiconductor layer (15) can include a hybrid region (16) in which the semiconductor material has reacted with oxygen ions originating from the glass or glass-ceramic. The support substrate (20) preferably includes a depletion region (23) which has a reduced concentration of the mobile positive ions.
    • 提供了包括大面积SOI结构的绝缘体上半导体(SOI)结构,其具有一个或多个由连接到支撑衬底的基本上单晶半导体(例如,掺杂硅)的层(15)组成的区域 20)由氧化物玻璃或氧化物玻璃陶瓷构成。 氧化物玻璃或氧化物玻璃 - 陶瓷优选是透明的,并且优选具有小于1000℃的应变点,250℃下的电阻率小于或等于1016&OHgr·-cm,并且包含正离子( 例如碱金属或碱土离子),其可以响应于在升高的温度(例如,300-1000℃)下的电场而在玻璃或玻璃陶瓷内移动。 半导体层(15)和支撑衬底(20)之间的结合强度优选为至少8焦耳/米2。 半导体层(15)可以包括混合区域(16),其中半导体材料已经与源自玻璃或玻璃陶瓷的氧离子反应。 支撑衬底(20)优选地包括具有降低的可移动正离子浓度的耗尽区(23)。
    • 9. 发明授权
    • Glass-based SOI structures
    • 基于玻璃的SOI结构
    • US07605053B2
    • 2009-10-20
    • US12082211
    • 2008-04-09
    • James G. CouillardKishor P. GadkareeJoseph F. Mach
    • James G. CouillardKishor P. GadkareeJoseph F. Mach
    • H01L21/46H01L21/30
    • H01L21/76254H01L21/2007
    • Semiconductor-on-insulator (SOI) structures, including large area SOI structures, are provided which have one or more regions composed of a layer of a substantially single-crystal semiconductor (e.g., doped silicon) attached to a support substrate composed of an oxide glass or an oxide glass-ceramic. The oxide glass or oxide glass-ceramic is preferably transparent and preferably has a strain point of less than 1000° C., a resistivity at 250° C. that is less than or equal to 1016 Ω-cm, and contains positive ions (e.g., alkali or alkaline-earth ions) which can move within the glass or glass-ceramic in response to an electric field at elevated temperatures (e.g., 300-1000° C.). The bond strength between the semiconductor layer and the support substrate is preferably at least 8 joules/meter2. The semiconductor layer can include a hybrid region in which the semiconductor material has reacted with oxygen ions originating from the glass or glass-ceramic. The support substrate preferably includes a depletion region which has a reduced concentration of the mobile positive ions.
    • 提供了包括大面积SOI结构的半导体绝缘体(SOI)结构,其具有一个或多个由连接到由氧化物构成的支撑衬底上的基本单晶半导体层(例如,掺杂硅)组成的区域 玻璃或氧化物玻璃陶瓷。 氧化物玻璃或氧化物玻璃陶瓷优选是透明的,并且优选具有小于1000℃的应变点,小于或等于1016Ω·cm的250℃下的电阻率,并且包含正离子(例如 ,碱金属或碱土离子),其可在玻璃或玻璃陶瓷中响应于高温下的电场(例如,300-1000℃)而移动。 半导体层和支撑衬底之间的结合强度优选为至少8焦耳/米2。 半导体层可以包括其中半导体材料已经与源自玻璃或玻璃陶瓷的氧离子反应的混合区域。 支撑衬底优选地包括具有降低的可移动正离子浓度的耗尽区。
    • 10. 发明申请
    • GLASS-BASED SOI STRUCTURES
    • 基于玻璃的SOI结构
    • US20090085176A1
    • 2009-04-02
    • US12328030
    • 2008-12-04
    • James G. CouillardKishor P. GadkareeJoseph F. Mach
    • James G. CouillardKishor P. GadkareeJoseph F. Mach
    • H01L29/12H01L29/02
    • H01L21/76254H01L21/2007
    • Semiconductor-on-insulator (SOI) structures, including large area SOI structures, are provided which have one or more regions composed of a layer (15) of a substantially single-crystal semiconductor (e.g., doped silicon) attached to a support substrate (20) composed of an oxide glass or an oxide glass-ceramic. The oxide glass or oxide glass-ceramic is preferably transparent and preferably has a strain point of less than 1000° C., a resistivity at 250° C. that is less than or equal to 1016 Ω-cm, and contains positive ions (e.g., alkali or alkaline-earth ions) which can move within the glass or glass-ceramic in response to an electric field at elevated temperatures (e.g., 300-1000° C.). The bond strength between the semiconductor layer (15) and the support substrate (20) is preferably at least 8 joules/meter2. The semiconductor layer (15) can include a hybrid region (16) in which the semiconductor material has reacted with oxygen ions originating from the glass or glass-ceramic. The support substrate (20) preferably includes a depletion region (23) which has a reduced concentration of the mobile positive ions.
    • 提供了包括大面积SOI结构的绝缘体上半导体(SOI)结构,其具有一个或多个由连接到支撑衬底的基本上单晶半导体(例如,掺杂硅)的层(15)组成的区域 20)由氧化物玻璃或氧化物玻璃陶瓷构成。 氧化物玻璃或氧化物玻璃陶瓷优选是透明的,并且优选具有小于1000℃的应变点,小于或等于1016Ω·cm的250℃下的电阻率,并且包含正离子(例如 ,碱金属或碱土离子),其可在玻璃或玻璃陶瓷中响应于高温下的电场(例如,300-1000℃)而移动。 半导体层(15)和支撑衬底(20)之间的结合强度优选为至少8焦耳/米2。 半导体层(15)可以包括混合区域(16),其中半导体材料已经与源自玻璃或玻璃陶瓷的氧离子反应。 支撑衬底(20)优选地包括具有降低的可移动正离子浓度的耗尽区(23)。