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1. 发明授权

US06975010B2 MEMS structure having a blocked-sacrificial layer support/anchor and a fabrication method of the same 失效
标题翻译：具有封闭牺牲层支撑/锚的MEMS结构及其制造方法
公开(公告)号：US06975010B2
公开(公告)日：2005-12-13
申请号：US10320679
申请日：2002-12-17
申请人： Eun-sung Lee , Moon-chul Lee , Hyun-ok Kim
发明人： Eun-sung Lee , Moon-chul Lee , Hyun-ok Kim
IPC分类号： B81C1/00 , B81B3/00 , H01L29/82
CPC分类号： B81B3/0078 , B81B2203/0307 , B81C2201/0109
摘要： A fabrication method for a MEMS structure, the MEMS structure including a fixing portion fixed to the substrate and a floating portion floating above the substrate. A sacrificial layer deposited on the substrate is patterned to have a groove forming a space surrounding the area corresponding to the area in which the fixing portion is to be formed. If the MEMS structure is deposited on the sacrificial layer, a sidewall is formed inside the space and the fixing portion and the floating portion are formed on the sacrificial layer. If the sacrificial layer is removed using an etchant, the sacrificial layer at the bottom of the fixing portion is protected from the etchant by the sidewall and accordingly, the sacrificial layer except the area surrounded by the sidewall is removed. Therefore, only the sacrificial layer under the floating portion is removed. Because the connecting portion is fabricated to have the same thickness as the fixing portion and the floating portion, a strong/durable MEMS structure is provided. Additionally, the boundary between the fixing portion and the floating portion can be precisely determined, and adjustment of the length of the floating portion can be precisely controlled.
摘要翻译：一种用于MEMS结构的制造方法，所述MEMS结构包括固定到所述基板的固定部分和浮置在所述基板上方的浮动部分。沉积在基板上的牺牲层被图案化以具有形成围绕与要形成固定部分的区域相对应的区域的空间的凹槽。如果MEMS结构沉积在牺牲层上，则在空间内形成侧壁，并且在牺牲层上形成固定部分和浮动部分。如果使用蚀刻剂去除牺牲层，则固定部分底部的牺牲层被侧壁保护而不受蚀刻剂的影响，因此除去由侧壁包围的区域之外的牺牲层。因此，只有在浮动部分下面的牺牲层被去除。由于连接部分被制造成具有与固定部分和浮动部分相同的厚度，所以提供了强/耐久的MEMS结构。此外，可以精确地确定固定部分和浮动部分之间的边界，并且可以精确地控制浮动部分的长度的调节。

2. 发明授权

US06720201B2 MEMS device and fabrication method thereof 失效
公开(公告)号：US06720201B2
公开(公告)日：2004-04-13
申请号：US10384495
申请日：2003-03-10
申请人： Eun-sung Lee , Chung-woo Kim , In-sang Song , Jong-seok Kim , Moon-chul Lee
发明人： Eun-sung Lee , Chung-woo Kim , In-sang Song , Jong-seok Kim , Moon-chul Lee
IPC分类号： H01L2100
CPC分类号： B81B3/0078 , B81B2201/014 , B81B2203/0118 , B81B2203/0307 , B81B2203/04 , B81C2201/0107 , B81C2201/014 , H01H59/0009
摘要： A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.

3. 发明授权

US07408434B2 Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package 有权
标题翻译：嵌入基板的电感器，其制造方法，微器件封装以及用于微器件封装的帽的制造方法
公开(公告)号：US07408434B2
公开(公告)日：2008-08-05
申请号：US11400637
申请日：2006-04-10
申请人： Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
发明人： Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
IPC分类号： H01F5/00 , H01L23/02
CPC分类号： H01F17/0006 , H01F41/041 , H01F2017/0046 , H01L27/08 , Y10T29/4902 , Y10T29/4906 , Y10T29/49064 , Y10T29/49073 , Y10T29/49155 , Y10T29/49165
摘要： An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.
摘要翻译：嵌入基板的电感器，包括基板，通过在形成在基板上的螺旋孔中填充金属而形成的线圈电极，形成在基板上的绝缘层，以及形成在绝缘层上的外部连接焊盘，以连接到线圈电极。电感器嵌入式基板可以通过在其底表面上形成空腔而用作微器件封装的帽。

4. 发明授权

US07172916B2 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate 失效
标题翻译：将微机电系统真空安装在基板上的方法和装置
公开(公告)号：US07172916B2
公开(公告)日：2007-02-06
申请号：US10701552
申请日：2003-11-06
申请人： Kyu-dong Jung , Chan-Bong Jun , Hyung Choi , Seok-jin Kang , Seog-woo Hong , Seok-whan Chung , Moon-chul Lee , Eun-sung Lee
发明人： Kyu-dong Jung , Chan-Bong Jun , Hyung Choi , Seok-jin Kang , Seog-woo Hong , Seok-whan Chung , Moon-chul Lee , Eun-sung Lee
IPC分类号： H01L21/00
CPC分类号： B81C1/00285
摘要： A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.
摘要翻译：用于真空安装至少一个微机电系统（MEMS）在基板上的方法和装置包括用于将惰性气体注入真空室的气体注入部分; 用于对准半导体衬底和盖的衬底对准部分，所述盖具有形成在其中的空腔和附着到腔的内表面的吸气剂; 用于将半导体衬底和盖结合在一起的接合部分; 以及控制部分，用于控制衬底对准部分以对准半导体和盖子，用于控制气体注入部分以将惰性气体注入真空室中，并且用于控制接合部分将半导体衬底和盖子结合在一起，之后注入惰性气体。

5. 发明授权

US07411261B2 MEMS device and fabrication method thereof 失效
标题翻译： MEMS器件及其制造方法
公开(公告)号：US07411261B2
公开(公告)日：2008-08-12
申请号：US10773312
申请日：2004-02-09
申请人： Eun-sung Lee , Chung-woo Kim , In-sang Song , Jong-seok Kim , Moon-chul Lee
发明人： Eun-sung Lee , Chung-woo Kim , In-sang Song , Jong-seok Kim , Moon-chul Lee
IPC分类号： H01L29/84
CPC分类号： B81B3/0078 , B81B2201/014 , B81B2203/0118 , B81B2203/0307 , B81B2203/04 , B81C2201/0107 , B81C2201/014 , H01H59/0009
摘要： A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.
摘要翻译：一种用于制造具有固定到基板上的固定部件，连接部件，驱动部件，驱动电极和接触部件的MEMS器件的方法，包括在所述基板上图形化所述驱动电极; 在所述基板上形成绝缘层; 图案化绝缘层并蚀刻绝缘层的固定区域和接触区域; 在衬底上形成金属层; 平坦化金属层直到绝缘层露出; 在所述基板上形成牺牲层; 图案化牺牲层以形成露出固定区域中绝缘层和金属层的一部分的开口; 在所述牺牲层上形成MEMS结构层以部分地填充所述开口，从而在其中形成侧壁; 并且通过蚀刻选择性地去除牺牲层的一部分，使得牺牲层的一部分保留在固定区域中。

6. 发明申请

US20060290457A1 Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package 有权
标题翻译：嵌入基板的电感器，其制造方法，微器件封装以及用于微器件封装的帽的制造方法
公开(公告)号：US20060290457A1
公开(公告)日：2006-12-28
申请号：US11400637
申请日：2006-04-10
申请人： Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
发明人： Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
IPC分类号： H01F5/00
CPC分类号： H01F17/0006 , H01F41/041 , H01F2017/0046 , H01L27/08 , Y10T29/4902 , Y10T29/4906 , Y10T29/49064 , Y10T29/49073 , Y10T29/49155 , Y10T29/49165
摘要： An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.
摘要翻译：嵌入基板的电感器，包括基板，通过在形成在基板上的螺旋孔中填充金属而形成的线圈电极，形成在基板上的绝缘层，以及形成在绝缘层上的外部连接焊盘，以连接到线圈电极。电感器嵌入式基板可以通过在其底表面上形成空腔而用作微器件封装的帽。

7. 发明授权

US07963021B2 Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package 有权
标题翻译：嵌入基板的电感器，其制造方法，微器件封装以及用于微器件封装的帽的制造方法
公开(公告)号：US07963021B2
公开(公告)日：2011-06-21
申请号：US12028420
申请日：2008-02-08
申请人： Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
发明人： Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
IPC分类号： H01F7/06
CPC分类号： H01F17/0006 , H01F41/041 , H01F2017/0046 , H01L27/08 , Y10T29/4902 , Y10T29/4906 , Y10T29/49064 , Y10T29/49073 , Y10T29/49155 , Y10T29/49165
摘要： An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.
摘要翻译：嵌入基板的电感器，包括基板，通过在形成在基板上的螺旋孔中填充金属而形成的线圈电极，形成在基板上的绝缘层，以及形成在绝缘层上的外部连接焊盘，以连接到线圈电极。电感器嵌入式基板可以通过在其底表面上形成空腔而用作微器件封装的帽。

8. 发明申请

US20080213966A1 INDUCTOR EMBEDDED IN SUBSTRATE, MANUFACTURING METHOD THEREOF, MICRO DEVICE PACKAGE, AND MANUFACTURING METHOD OF CAP FOR MICRO DEVICE PACKAGE 有权
标题翻译：嵌入基板中的电感器，其制造方法，微型器件封装以及用于微型器件封装的封装的制造方法
公开(公告)号：US20080213966A1
公开(公告)日：2008-09-04
申请号：US12028420
申请日：2008-02-08
申请人： Moon-chul LEE , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
发明人： Moon-chul LEE , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
IPC分类号： H01L21/62
CPC分类号： H01F17/0006 , H01F41/041 , H01F2017/0046 , H01L27/08 , Y10T29/4902 , Y10T29/4906 , Y10T29/49064 , Y10T29/49073 , Y10T29/49155 , Y10T29/49165
摘要： An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.
摘要翻译：嵌入基板的电感器，包括基板，通过在形成在基板上的螺旋孔中填充金属而形成的线圈电极，形成在基板上的绝缘层，以及形成在绝缘层上的外部连接焊盘，以连接到线圈电极。电感器嵌入式基板可以通过在其底表面上形成空腔而用作微器件封装的帽。

9. 发明授权

US07649672B2 MEMS structure and method of fabricating the same 有权
标题翻译： MEMS结构及其制造方法
公开(公告)号：US07649672B2
公开(公告)日：2010-01-19
申请号：US11582964
申请日：2006-10-19
申请人： Young-tack Hong , Jong-seok Kim , In-sang Song , Sang-wook Kwon , Seung-jin Oh , Eun-sung Lee , Seung-tae Choi
发明人： Young-tack Hong , Jong-seok Kim , In-sang Song , Sang-wook Kwon , Seung-jin Oh , Eun-sung Lee , Seung-tae Choi
IPC分类号： G02B26/00
CPC分类号： G02B26/0841 , B81B2201/016 , B81C1/00571 , H01H1/0036 , H01H1/58 , H01H59/0009 , H01H2001/0052
摘要： A MEMS structure includes an element substrate, an electrode pad formed on the element substrate, a MEMS activated element formed on the element substrate, and having an electrode-connecting layer, and a connecting line to electrically connect the electrode pad and the electrode-connecting layer.
摘要翻译： MEMS结构包括元件基板，形成在元件基板上的电极焊盘，形成在元件基板上的MEMS激活元件，并具有电极连接层，以及连接线，用于将电极焊盘和电极连接层。

10. 发明申请

US20070012899A1 Phosphate dispersant, paste composition and dispersion method using the same 审中-公开
标题翻译：磷酸盐分散剂，糊剂组合物和使用其的分散方法
公开(公告)号：US20070012899A1
公开(公告)日：2007-01-18
申请号：US11319448
申请日：2005-12-29
申请人： Eun-sung Lee , Jae-young Choi , Seon-mi Yoon , Seul-ki Kim , Jun-hee Kim , Jong-gab Baek
发明人： Eun-sung Lee , Jae-young Choi , Seon-mi Yoon , Seul-ki Kim , Jun-hee Kim , Jong-gab Baek
IPC分类号： H01B1/12
CPC分类号： H01G4/0085 , H01G4/30
摘要： A phosphate dispersant which can improve the efficiency of dispersing nickel metal powder by effectively adsorbing on the surface of the metal powder and preventing aggregation thereof, and a paste composition and a dispersion method using the same are provided. A multilayer ceramic capacitor (MLCC) is also provided. The phosphate dispersant can achieve the optimal dispersion efficiency by strongly adsorbing on the surface of the nickel metal powder. An improvement in the dispersion efficiency as such can consequently suppress aggregation of the nickel metal powder during the preparation of a conductive paste composition containing a nickel metal powder, and therefore a larger amount of the nickel metal powder can be used in the paste composition. The increased amount of nickel metal powder allows producing an internal nickel electrode having improved electric properties and mechanical properties during the production of MLCCs.
摘要翻译：一种磷酸盐分散剂，其可以通过有效吸附金属粉末的表面并防止其聚集而提高分散镍金属粉末的效率，以及糊料组合物和使用其的分散方法。还提供了多层陶瓷电容器（MLCC）。磷酸盐分散剂可以通过强烈吸附在镍金属粉末的表面上达到最佳的分散效率。因此，在制备含有镍金属粉末的导电性糊料组合物时，分散效率的改善因此可以抑制镍金属粉末的聚集，因此可以在糊料组合物中使用更多量的镍金属粉末。镍金属粉末的增加量允许制造在生产MLCC期间具有改善的电性能和机械性能的内部镍电极。

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