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1. 发明授权

US09218898B2 Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste 有权
标题翻译：导电浆料和电子器件以及包括使用导电糊形成的电极的太阳能电池
公开(公告)号：US09218898B2
公开(公告)日：2015-12-22
申请号：US13534799
申请日：2012-06-27
申请人： Eun Sung Lee , Suk Jun Kim , Se Yun Kim , Jin Man Park , Sang Soo Jee
发明人： Eun Sung Lee , Suk Jun Kim , Se Yun Kim , Jin Man Park , Sang Soo Jee
IPC分类号： H01B1/02 , H01B1/22 , H01L31/0224
CPC分类号： H01B1/22 , H01L31/022425 , Y02E10/50
摘要： A conductive paste including a conductive powder, a metallic glass including aluminum (Al) and a first element which forms a solid solution with the aluminum (Al), and an organic vehicle.
摘要翻译：包括导电粉末，包括铝（Al）的金属玻璃和与铝（Al）形成固溶体的第一元素的导电浆料和有机载体。

2. 发明授权

US09039940B2 Conductive paste and electronic device, and solar cell including an electrode formed using the conductive paste 有权
标题翻译：导电浆料和电子器件，以及包括使用导电糊形成的电极的太阳能电池
公开(公告)号：US09039940B2
公开(公告)日：2015-05-26
申请号：US13416260
申请日：2012-03-09
申请人： Suk Jun Kim , Eun Sung Lee , Se Yun Kim , Sang Soo Jee , Jeong Na Heo
发明人： Suk Jun Kim , Eun Sung Lee , Se Yun Kim , Sang Soo Jee , Jeong Na Heo
IPC分类号： H01B1/02 , H01L31/0224 , H01B1/22
CPC分类号： H01L31/022425 , H01B1/22 , Y02E10/50
摘要： A conductive paste may include a conductive component and an organic vehicle. The conductive component may include an amorphous metal. The amorphous metal may have a lower resistivity after a crystallization process than before the crystallization process, and at least one of a weight gain of about 4 mg/cm2 or less and a thickness increase of about 30 μm or less after being heated in a process furnace at a firing temperature.
摘要翻译：导电膏可以包括导电组分和有机载体。导电组分可以包括无定形金属。无定形金属在结晶过程之后可能具有比结晶过程之前更低的电阻率，并且在过程中加热后，重量增加约4mg / cm 2或更小，厚度增加约30μm或更小的至少之一炉在烧制温度。

3. 发明申请

US20120240994A1 CONDUCTIVE PASTE AND ELECTRONIC DEVICE, AND SOLAR CELL INCLUDING AN ELECTRODE FORMED USING THE CONDUCTIVE PASTE 有权
标题翻译：导电胶和电子装置，以及包括使用导电胶制成的电极的太阳能电池
公开(公告)号：US20120240994A1
公开(公告)日：2012-09-27
申请号：US13416260
申请日：2012-03-09
申请人： Suk Jun Kim , Eun Sung Lee , Se Yun Kim , Sang Soo Jee , Jeong Na Heo
发明人： Suk Jun Kim , Eun Sung Lee , Se Yun Kim , Sang Soo Jee , Jeong Na Heo
IPC分类号： H01L31/0224 , H01B1/02
CPC分类号： H01L31/022425 , H01B1/22 , Y02E10/50
摘要： A conductive paste may include a conductive component and an organic vehicle. The conductive component may include an amorphous metal. The amorphous metal may have a lower resistivity after a crystallization process than before the crystallization process, and at least one of a weight gain of about 4 mg/cm2 or less and a thickness increase of about 30 μm or less after being heated in a process furnace at a firing temperature.
摘要翻译：导电膏可以包括导电组分和有机载体。导电组分可以包括无定形金属。无定形金属在结晶过程之后可能具有比结晶过程之前更低的电阻率，并且在过程中加热后，重量增加约4mg / cm 2或更小，厚度增加约30μm或更小的至少之一炉在烧制温度。

4. 发明申请

US20130004716A1 PASTE, METHOD OF PREPARING SAME, AND ELECTRONIC DEVICE 审中-公开
标题翻译：糊剂，其制备方法和电子设备
公开(公告)号：US20130004716A1
公开(公告)日：2013-01-03
申请号：US13477500
申请日：2012-05-22
申请人： Haeng Deog Koh , Eun Sung Lee , Sang Soo Jee , Jeong Na Heo , Suk Jun Kim , Se Yun Kim , Yun-Hyuk Choi
发明人： Haeng Deog Koh , Eun Sung Lee , Sang Soo Jee , Jeong Na Heo , Suk Jun Kim , Se Yun Kim , Yun-Hyuk Choi
IPC分类号： H01B1/12 , B32B3/26 , H01B1/02
CPC分类号： H01B1/22 , Y10T428/24479
摘要： A paste may include a functional water-soluble material, a surfactant surrounding the functional water-soluble material to form a reverse micelle structure, a binder, and a liposoluble organic solvent, and an electronic device including at least one of a pattern and an electrode may be formed using the paste.
摘要翻译：糊剂可以包括功能性水溶性材料，围绕功能性水溶性材料的表面活性剂以形成反胶束结构，粘合剂和脂溶性有机溶剂，以及包括图案和电极中的至少一种的电子器件可以使用糊料形成。

5. 发明授权

US09263166B2 Shell activated sintering of core-shell particles 有权
标题翻译：壳壳活化烧结核 - 壳颗粒
公开(公告)号：US09263166B2
公开(公告)日：2016-02-16
申请号：US13919175
申请日：2013-06-17
申请人： Carol Anne Handwerker , Suk Jun Kim , Eric A. Stach
发明人： Carol Anne Handwerker , Suk Jun Kim , Eric A. Stach
IPC分类号： H01G7/00 , H01B1/02 , B22F1/00 , B22F1/02 , B22F3/12 , C22C1/04 , B82Y30/00
CPC分类号： H01B1/02 , B22F1/0018 , B22F1/025 , B22F3/12 , B82Y30/00 , C22C1/0425 , Y10T428/12014
摘要： A sintered structure and method for forming it are disclosed. The method includes obtaining core-shell particles having a core material and a shell material, forming the particles into a powder compact, and annealing the powder compact at an annealing temperature. The shell material is a metal that diffuses faster than the core material at the annealing temperature and diffuses to the contacts between the core-shell particles during annealing to form sintered interfaces between the core-shell particles. The sintered structure can have discontinuous regions of shell material between the sintered interfaces. The core material can be a metal, semiconductor or ceramic. The core material can be copper and the shell material can be silver. The sintered interfaces can be almost purely shell material. The annealing temperature can be significantly lower than the temperature needed to form interfaces between particles of the core material without the shell material.
摘要翻译：公开了一种烧结结构及其形成方法。该方法包括获得具有芯材料和壳材料的核 - 壳颗粒，将颗粒形成粉末压块，并在退火温度下对粉末压块进行退火。外壳材料是在退火温度下比核心材料更快地扩散的金属，并且在退火期间扩散到核 - 壳颗粒之间的接触处以在核 - 壳颗粒之间形成烧结界面。烧结结构可以在烧结界面之间具有壳材料的不连续区域。核心材料可以是金属，半导体或陶瓷。核心材料可以是铜，壳材料可以是银。烧结界面几乎可以是纯外壳材料。退火温度可以显着低于在没有壳材料的情况下在芯材料的颗粒之间形成界面所需的温度。

6. 发明申请

US20140370322A1 SHELL ACTIVATED SINTERING OF CORE-SHELL PARTICLES 有权
标题翻译：壳体激活烧结颗粒
公开(公告)号：US20140370322A1
公开(公告)日：2014-12-18
申请号：US13919175
申请日：2013-06-17
申请人： Carol Anne Handwerker , Suk Jun Kim , Eric A. Stach
发明人： Carol Anne Handwerker , Suk Jun Kim , Eric A. Stach
IPC分类号： H01B1/02
CPC分类号： H01B1/02 , B22F1/0018 , B22F1/025 , B22F3/12 , B82Y30/00 , C22C1/0425 , Y10T428/12014
摘要： A sintered structure and method for forming it are disclosed. The method includes obtaining core-shell particles having a core material and a shell material, forming the particles into a powder compact, and annealing the powder compact at an annealing temperature. The shell material is a metal that diffuses faster than the core material at the annealing temperature and diffuses to the contacts between the core-shell particles during annealing to form sintered interfaces between the core-shell particles. The sintered structure can have discontinuous regions of shell material between the sintered interfaces. The core material can be a metal, semiconductor or ceramic. The core material can be copper and the shell material can be silver. The sintered interfaces can be almost purely shell material. The annealing temperature can be significantly lower than the temperature needed to form interfaces between particles of the core material without the shell material.
摘要翻译：公开了一种烧结结构及其形成方法。该方法包括获得具有芯材料和壳材料的核 - 壳颗粒，将颗粒形成粉末压块，并在退火温度下对粉末压块进行退火。外壳材料是在退火温度下比核心材料更快地扩散的金属，并且在退火期间扩散到核 - 壳颗粒之间的接触处以在核 - 壳颗粒之间形成烧结界面。烧结结构可以在烧结界面之间具有壳材料的不连续区域。核心材料可以是金属，半导体或陶瓷。核心材料可以是铜，壳材料可以是银。烧结界面几乎可以是纯外壳材料。退火温度可以显着低于在没有壳材料的情况下在芯材料的颗粒之间形成界面所需的温度。

7. 发明申请

US20110318213A1 SHELL ACTIVATED SINTERING OF CORE-SHELL PARTICLES 审中-公开
标题翻译：壳体激活烧结颗粒
公开(公告)号：US20110318213A1
公开(公告)日：2011-12-29
申请号：US12877132
申请日：2010-09-08
申请人： Carol Anne Handwerker , Suk Jun Kim , Eric A. Stach
发明人： Carol Anne Handwerker , Suk Jun Kim , Eric A. Stach
IPC分类号： B22F3/12 , B22F1/00
CPC分类号： H01B1/02 , B22F1/0018 , B22F1/025 , B22F3/12 , B82Y30/00 , C22C1/0425 , Y10T428/12014
摘要： A sintered structure and method for forming it are disclosed. The method includes obtaining core-shell particles having a core material and a shell material, forming the particles into a powder compact, and annealing the powder compact at an annealing temperature. The shell material is a metal that diffuses faster than the core material at the annealing temperature and diffuses to the contacts between the core-shell particles during annealing to form sintered interfaces between the core-shell particles. The sintered structure can have discontinuous regions of shell material between the sintered interfaces. The core material can be a metal, semiconductor or ceramic. The core material can be copper and the shell material can be silver. The sintered interfaces can be almost purely shell material. The annealing temperature can be significantly lower than the temperature needed to form interfaces between particles of the core material without the shell material.
摘要翻译：公开了一种烧结结构及其形成方法。该方法包括获得具有芯材料和壳材料的核 - 壳颗粒，将颗粒形成粉末压块，并在退火温度下对粉末压块进行退火。外壳材料是在退火温度下比核心材料更快地扩散的金属，并且在退火期间扩散到核 - 壳颗粒之间的接触处以在核 - 壳颗粒之间形成烧结界面。烧结结构可以在烧结界面之间具有壳材料的不连续区域。核心材料可以是金属，半导体或陶瓷。核心材料可以是铜，壳材料可以是银。烧结界面几乎可以是纯外壳材料。退火温度可以显着低于在没有壳材料的情况下在芯材料的颗粒之间形成界面所需的温度。

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