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1. 发明申请

US20070148978A1 Slurry compositions, methods of polishing polysilicon layers using the slurry compositions and methods of manufacturing semiconductor devices using the slurry compositions 审中-公开
标题翻译：浆料组合物，使用浆料组合物研磨多晶硅层的方法和使用该浆料组合物制造半导体器件的方法
公开(公告)号：US20070148978A1
公开(公告)日：2007-06-28
申请号：US11642582
申请日：2006-12-21
申请人： Eui-Jin Han , Nam-Soo Kim , Kyoung-Moon Kang , Dong-Jun Lee , Hyo-Sun Lee
发明人： Eui-Jin Han , Nam-Soo Kim , Kyoung-Moon Kang , Dong-Jun Lee , Hyo-Sun Lee
IPC分类号： C09K13/00 , C03C15/00 , C23F1/00 , B44C1/22
CPC分类号： C09K3/1454 , B24B37/044 , C09G1/02 , H01L21/3212
摘要： A slurry composition, a method of polishing polysilicon layers using the slurry composition, and a method of manufacturing a semiconductor device using the same, wherein the slurry composition includes an abrasive in an amount of about 1 to about 20 percent by weight of the slurry composition, a non-ionic surfactant in an amount of about 0.005 to about 1 percent by weight of the slurry composition, and a solvent having a basic compound.
摘要翻译：浆料组合物，使用该浆料组合物研磨多晶硅层的方法以及使用该浆料组合物制造半导体器件的方法，其中所述浆料组合物包含的量为所述浆料组合物的约1至约20重量％，约0.005至约1重量％的非离子表面活性剂，以及具有碱性化合物的溶剂。

2. 发明授权

US07442111B2 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting 失效
标题翻译：抛光垫，压板，监测方法，制造方法和检测方法
公开(公告)号：US07442111B2
公开(公告)日：2008-10-28
申请号：US11797713
申请日：2007-05-07
申请人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
发明人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
IPC分类号： B24B19/00
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
摘要翻译：抛光垫，压板，监控方法，制造方法以及使用伪窗口区域进行检测的方法，其中伪窗口区域的厚度小于抛光层的厚度，厚度大于零。

3. 发明授权

US07229337B2 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting 失效
标题翻译：抛光垫，压板，监测方法，制造方法和检测方法
公开(公告)号：US07229337B2
公开(公告)日：2007-06-12
申请号：US10726637
申请日：2003-12-04
申请人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
发明人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
IPC分类号： B24B19/00
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
摘要翻译：抛光垫，压板，监控方法，制造方法以及使用伪窗口区域进行检测的方法，其中伪窗口区域的厚度小于抛光层的厚度，厚度大于零。

4. 发明申请

US20070037486A1 Polishing pad, method of manufacturing the polishing pad, and chemical mechanical polishing apparatus comprising the polishing pad 审中-公开
标题翻译：研磨垫，抛光垫的制造方法以及包含该抛光垫的化学机械抛光装置
公开(公告)号：US20070037486A1
公开(公告)日：2007-02-15
申请号：US11500512
申请日：2006-08-08
申请人： Kyoung-Moon Kang , Bong-Su Ahn , Dong-Jun Lee , Nam-Soo Kim , Jae-Hyun So
发明人： Kyoung-Moon Kang , Bong-Su Ahn , Dong-Jun Lee , Nam-Soo Kim , Jae-Hyun So
IPC分类号： B24B51/00 , B24B7/30 , B24B29/00
CPC分类号： B24B37/26 , B24D7/14
摘要： A polishing pad of a CMP apparatus has a plurality of pores. A characteristic associated with the pores, such as average size or pore density, varies substantially from region to region of the pad across the pad in a diametral direction of the pad. The polishing pad can be designed and manufactured using sample pads whose pore characteristics differ from each other. CMP test processes are performed in which the sample pads are used to polish test wafers, and the rates at which the test wafers are polished are measured and stored in a database. The polishing pad is fabricated using data from the database so that a chemical mechanical polishing apparatus employing the pad will polish wafers with a high degree of uniformity. The database can be used to select sample pads from a stockpile. Sections of the sample pads are cut out, respectively, and fastened to one another.
摘要翻译： CMP设备的抛光垫具有多个孔。与孔相关的特征，例如平均尺寸或孔密度，在焊盘的沿直径方向穿过焊盘的区域与区域之间显着变化。可以使用其孔特性彼此不同的样品垫来设计和制造抛光垫。进行CMP测试过程，其中使用样品垫来抛光测试晶片，并测量抛光测试晶片的速率并将其存储在数据库中。使用来自数据库的数据制造抛光垫，使得使用该垫的化学机械抛光装置将以高度均匀度抛光晶片。数据库可用于从库存中选择样品垫。样品垫的切片分别切割并彼此紧固。

5. 发明授权

US07578727B2 Conditioner device for conditioning polishing pad and chemical mechanical polishing apparatus including the same 有权
标题翻译：用于调理抛光垫的调节装置和包括其的化学机械抛光装置
公开(公告)号：US07578727B2
公开(公告)日：2009-08-25
申请号：US11466425
申请日：2006-08-22
申请人： Sung-Tae Moon , Dong-Jun Lee , Kyoung-Moon Kang , Nam-Soo Kim , Bong-Su Ahn
发明人： Sung-Tae Moon , Dong-Jun Lee , Kyoung-Moon Kang , Nam-Soo Kim , Bong-Su Ahn
IPC分类号： B24B53/00
CPC分类号： B24B53/017 , B24B53/14
摘要： The present invention relates to a conditioner device for polishing pad and a chemical mechanical polishing (CMP) apparatus having the same. The conditioner device of the present invention comprises a rotable support plate including a support plate surface comprising a center area located about the rotational axis of the support plate, a mid area surrounding the center area, and a peripheral area surrounding the mid area, a plurality of conditioning zones located within a portion of the mid area of the support plate surface. A plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support plate surface. A plurality of passages defined by the conditioning zones within which a slurry flows, the passages occupying a portion of the mid area which is not occupied by the conditioning zones, the center area and the peripheral area.
摘要翻译：本发明涉及一种用于抛光垫的调节装置和具有该抛光垫的化学机械抛光（CMP）装置。本发明的调节装置包括可旋转的支撑板，其包括支撑板表面，该支撑板表面包括围绕支撑板的旋转轴线的中心区域，围绕中心区域的中间区域和围绕中间区域的周边区域，多个位于支撑板表面的中部区域的一部分内的调理区。多个坚硬颗粒密集地布置在调理区内并附着在支撑板表面上。由浆料流过的调节区限定的多个通道，通道占据中部区域的未被调节区域，中心区域和周边区域占据的部分。

6. 发明申请

US20060060568A1 Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions 失效
标题翻译：浆料组合物，制备浆料组合物的方法，以及使用浆料组合物抛光物体的方法
公开(公告)号：US20060060568A1
公开(公告)日：2006-03-23
申请号：US11205029
申请日：2005-08-17
申请人： Jae-Hyun So , Sung-Taek Moon , Dong-Jun Lee , Nam-Soo Kim , Bong-Su Ahn , Kyoung-Moon Kang
发明人： Jae-Hyun So , Sung-Taek Moon , Dong-Jun Lee , Nam-Soo Kim , Bong-Su Ahn , Kyoung-Moon Kang
IPC分类号： C09K13/00 , C03C15/00 , B44C1/22 , H01L21/461
CPC分类号： H01L21/7684 , C09G1/02 , C09K3/1463 , H01L21/3212
摘要： A slurry composition includes an acidic aqueous solution and one or both of, an amphoteric surfactant and a glycol compound. Examples of the amphoteric surfactant include a betaine compound and an amino acid compound, and examples of the amino acid compound include lysine, proline and arginine. Examples of the glycol compound include diethylene glycol, ethylene glycol and polyethylene glycol.
摘要翻译：浆料组合物包括酸性水溶液和两性表面活性剂和二醇化合物中的一种或两种。两性表面活性剂的实例包括甜菜碱化合物和氨基酸化合物，氨基酸化合物的实例包括赖氨酸，脯氨酸和精氨酸。二醇化合物的实例包括二甘醇，乙二醇和聚乙二醇。

7. 发明授权

US08007676B2 Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions 有权
标题翻译：浆料组合物，制备浆料组合物的方法，以及使用浆料组合物抛光物体的方法
公开(公告)号：US08007676B2
公开(公告)日：2011-08-30
申请号：US12128675
申请日：2008-05-29
申请人： Jae-Hyun So , Sung-Taek Moon , Dong-Jun Lee , Nam-Soo Kim , Bong-Su Ahn , Kyoung-Moon Kang
发明人： Jae-Hyun So , Sung-Taek Moon , Dong-Jun Lee , Nam-Soo Kim , Bong-Su Ahn , Kyoung-Moon Kang
IPC分类号： C03C15/00
CPC分类号： H01L21/7684 , C09G1/02 , C09K3/1463 , H01L21/3212
摘要： A slurry composition includes an acidic aqueous solution and one or both of, an amphoteric surfactant and a glycol compound. Examples of the amphoteric surfactant include a betaine compound and an amino acid compound, and examples of the amino acid compound include lysine, proline and arginine. Examples of the glycol compound include diethylene glycol, ethylene glycol and polyethylene glycol.
摘要翻译：浆料组合物包括酸性水溶液和两性表面活性剂和二醇化合物中的一种或两种。两性表面活性剂的实例包括甜菜碱化合物和氨基酸化合物，氨基酸化合物的实例包括赖氨酸，脯氨酸和精氨酸。二醇化合物的实例包括二甘醇，乙二醇和聚乙二醇。

8. 发明授权

US07288212B2 Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition 有权
标题翻译：添加剂组合物，包含其的浆料组合物以及使用该浆料组合物抛光物体的方法
公开(公告)号：US07288212B2
公开(公告)日：2007-10-30
申请号：US10293918
申请日：2002-11-14
申请人： Nam-Soo Kim , Sang-Mun Chon , Young-Sam Lim , Kyoung-Moon Kang , Sei-Cheol Lee , Jae-Hyun So , Dong-Jun Lee
发明人： Nam-Soo Kim , Sang-Mun Chon , Young-Sam Lim , Kyoung-Moon Kang , Sei-Cheol Lee , Jae-Hyun So , Dong-Jun Lee
IPC分类号： C09K13/00 , C09K13/04 , H01L21/302
CPC分类号： H01L21/31053 , C08L101/02 , C09G1/02
摘要： An additive composition for a slurry contains a first salt of polymeric acid including a first polymeric acid having a first weight average molecular weight and a first base material, and a second salt of polymeric acid including a second polymeric acid having a second weight average molecular weight and a second base material. A slurry composition is prepared by mixing the additive composition, a polishing particle composition, and water. When implementing a chemical mechanical polishing using the slurry composition, a favorable polishing selectivity is realized.
摘要翻译：用于浆料的添加剂组合物包含聚合酸的第一盐，其包含具有第一重均分子量和第一基础材料的第一聚合酸和包含第二聚合酸的第二盐，所述第二聚合酸具有第二重均分子量和第二基材。通过混合添加剂组合物，抛光颗粒组合物和水来制备浆料组合物。当使用浆料组合物进行化学机械抛光时，实现了良好的抛光选择性。

9. 发明授权

US07858527B2 Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition 有权
标题翻译：添加剂组合物，包含其的浆料组合物以及使用该浆料组合物抛光物体的方法
公开(公告)号：US07858527B2
公开(公告)日：2010-12-28
申请号：US11861490
申请日：2007-09-26
申请人： Nam-Soo Kim , Sang-Mun Chon , Young-Sam Lim , Kyoung-Moon Kang , Sei-Cheol Lee , Jae-Hyun So , Dong-Jun Lee
发明人： Nam-Soo Kim , Sang-Mun Chon , Young-Sam Lim , Kyoung-Moon Kang , Sei-Cheol Lee , Jae-Hyun So , Dong-Jun Lee
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/31053 , C08L101/02 , C09G1/02
摘要： An additive composition for a slurry contains a first salt of polymeric acid including a first polymeric acid having a first weight average molecular weight and a first base material, and a second salt of polymeric acid including a second polymeric acid having a second weight average molecular weight and a second base material. A slurry composition is prepared by mixing the additive composition, a polishing particle composition, and water. When implementing a chemical mechanical polishing using the slurry composition, a favorable polishing selectivity is realized.
摘要翻译：用于浆料的添加剂组合物包含聚合酸的第一盐，其包含具有第一重均分子量和第一基础材料的第一聚合酸和包含第二聚合酸的第二盐，所述第二聚合酸具有第二重均分子量和第二基材。通过混合添加剂组合物，抛光颗粒组合物和水来制备浆料组合物。当使用浆料组合物进行化学机械抛光时，实现了良好的抛光选择性。

10. 发明授权

US07662022B2 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting 失效
标题翻译：抛光垫，压板，监测方法，制造方法和检测方法
公开(公告)号：US07662022B2
公开(公告)日：2010-02-16
申请号：US12232521
申请日：2008-09-18
申请人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
发明人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
IPC分类号： B24B19/00
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
摘要翻译：抛光垫，压板，监测方法，制造方法以及使用伪窗口区域进行检测的方法，其中伪窗口区域的厚度小于抛光层的厚度，厚度大于零。

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