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1. 发明授权

US07835065B2 Optical packages and methods for aligning optical packages 有权
标题翻译：用于对准光学封装的光学封装和方法
公开(公告)号：US07835065B2
公开(公告)日：2010-11-16
申请号：US12200661
申请日：2008-08-28
申请人： Etienne Almoric , Jacques Gollier , Lawrence Hughes , Garrett Andrew Piech
发明人： Etienne Almoric , Jacques Gollier , Lawrence Hughes , Garrett Andrew Piech
IPC分类号： G02F1/35 , G02F2/02 , H01S3/08
CPC分类号： G02B6/4214 , G01B11/272 , G02F1/377 , G02F2001/3546 , H01S5/005 , H01S5/0071 , H01S5/0092
摘要： An optical package includes a semiconductor laser, a wavelength conversion device and a MEMS-actuated mirror oriented on a base module to form a folded optical pathway between an output of the semiconductor laser and an input of the wavelength conversion device. An optical assembly is located in a mechanical positioning device and the mechanical positioning device is disposed on the base module along the optical pathway such that the beam of the semiconductor laser passes through the optical assembly, is reflected by the MEMS-actuated mirror back through the optical assembly and into the waveguide portion of the wavelength conversion device. The MEMS-actuated mirror is operable to scan the beam of the semiconductor laser over the input of the wavelength conversion device. The optical assembly may be adjusted along the optical pathway with the mechanical positioning device to focus the beam into the waveguide portion of the wavelength conversion device.
摘要翻译：光学封装包括半导体激光器，波长转换器件和面向基底模块的MEMS致动镜，以在半导体激光器的输出端与波长转换器件的输入端之间形成折叠光路。光学组件位于机械定位装置中，并且机械定位装置沿着光学路径设置在基座模块上，使得半导体激光器的光束通过光学组件，被MEMS致动的反射镜反射回通过光学组件并进入波长转换装置的波导部分。 MEMS致动反射镜可操作以通过波长转换装置的输入来扫描半导体激光束的光束。光学组件可以利用机械定位装置沿光学路径调节，以将光束聚焦到波长转换装置的波导部分中。

2. 发明申请

US20060226928A1 Ball coax interconnect 审中-公开
标题翻译：球同轴互连
公开(公告)号：US20060226928A1
公开(公告)日：2006-10-12
申请号：US11101882
申请日：2005-04-08
申请人： Larry Henning , Lawrence Hughes , Karen Matthews , Deepukumar Nair
发明人： Larry Henning , Lawrence Hughes , Karen Matthews , Deepukumar Nair
IPC分类号： H01P5/02 , H01P1/00
CPC分类号： H05K1/025 , H01L2223/6622 , H01P3/06 , H01P5/085 , H05K1/0222 , H05K3/3436 , H05K2201/09618 , H05K2201/09809
摘要： A pseudo-coaxial vertical transition (10) includes a substrate (16). A bump array is disposed in a substantially concentric bump pattern upon the substrate (16) for simulating a pseudo-coaxial vertical electromagnetic wave propagation. The bump array is formed from a centrally disposed bump (32) having a predetermined bump diameter, and a plurality of at least five ground bumps (36) substantially equi-distant and circularly disposed about the centrally disposed bump (32). The predetermined bump diameter and a bump spacing of the centrally disposed bump are determined in relation to the plurality of ground bumps and a dielectric constant of air for providing a characteristic impedance.
摘要翻译：伪同轴垂直过渡（10）包括衬底（16）。凸块阵列以基本同心的凸起图案设置在基板（16）上，用于模拟伪同轴垂直电磁波传播。凸块阵列由具有预定凸块直径的中心设置的凸块（32）形成，并且多个至少五个接地凸块（36）围绕中心设置的凸块（32）基本上相等且圆形地设置。相对于多个接地凸起和用于提供特性阻抗的空气的介电常数来确定中心设置的凸起的预定凸起直径和凸起间距。

3. 发明授权

US5365108A Metal matrix composite semiconductor power switch assembly 失效
标题翻译：金属基复合半导体电源开关总成
公开(公告)号：US5365108A
公开(公告)日：1994-11-15
申请号：US979088
申请日：1992-11-19
申请人： W. Kyle Anderson , Richard J. Hoppe , William J. Durako, Jr. , Mark Metzler , Lawrence Hughes , Stephen E. Jackson
发明人： W. Kyle Anderson , Richard J. Hoppe , William J. Durako, Jr. , Mark Metzler , Lawrence Hughes , Stephen E. Jackson
IPC分类号： H01L23/057 , H01L23/373 , H01L23/49 , H01L23/02 , H01L23/12
CPC分类号： H01L24/49 , H01L23/057 , H01L23/3733 , H01L2224/48091 , H01L2224/48247 , H01L2224/4911 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/16195 , H01L2924/19107
摘要： A power semiconductor assembly, particularly a semiconductor switch assembly which has a number of discrete emitter connection pads, comprised of a metal matrix composite housing and a copper or aluminum post with a cross-sectional area sufficiently large to carry the rated current providing a single-point, external connection to all emitter pads. The post passes through and is supported by an insulating ceramic insert such as aluminum oxide in the wall of the metal matrix composite housing. The post is hollowed out in the region where it passes through the ceramic insert in order to reduce the mechanical stress between the post and the insulating insert as a result of the mismatch in their thermal expansion coefficients. Buses on either side of the semiconductor die provide surfaces for connection from the post to the discrete emitter connection pads on the die.
摘要翻译：功率半导体组件，特别是具有多个分立的发射器连接焊盘的半导体开关组件，其包括金属基体复合壳体和具有足够大的横截面积的铜或铝柱，以承载额定电流，点，外部连接到所有发射极焊盘。柱穿过并由金属基体复合壳体的壁中的绝缘陶瓷插入物例如氧化铝支撑。该柱在其通过陶瓷插入件的区域中被挖空，以便由于它们的热膨胀系数不匹配而减小柱和绝缘插入件之间的机械应力。在半导体管芯的任一侧上的公共汽车提供用于从管柱连接到管芯上的分立发射器连接焊盘的表面。

4. 发明申请

US20070201797A1 Glass-based micropositioning systems and methods 有权
标题翻译：玻璃微定位系统和方法
公开(公告)号：US20070201797A1
公开(公告)日：2007-08-30
申请号：US11365391
申请日：2006-02-28
申请人： Richard Grzybowski , Brewster Hemenway , Lawrence Hughes , Stephan Logunov , Kamjula Reddy , Joseph Schroeder , James Sutherland
发明人： Richard Grzybowski , Brewster Hemenway , Lawrence Hughes , Stephan Logunov , Kamjula Reddy , Joseph Schroeder , James Sutherland
IPC分类号： G02B6/42
CPC分类号： G02B6/423 , B29D11/00384 , G02B6/30 , G02B6/3636 , G02B6/3656 , G02B6/4226 , G02B6/4227 , G02B6/4231 , G02B6/4234 , G02B6/4239
摘要： Glass-based micropositioning systems and methods are disclosed. The micropositioning systems and methods utilize microbumps (40) formed in a glass substrate (12 or 100). The microbumps are formed by subjecting a portion of the glass substrate to localized heating, which results in local rapid expansion of glass where the heat was applied. The height and shape of the microbumps depend on the type of glass substrate and the amount and form of heat delivered to the substrate. The microbumps allow for active or passive micropositioning of optical elements, including planar waveguides and optical fibers. Optical assemblies formed using microbump micropositioners are also disclosed.
摘要翻译：公开了玻璃基微定位系统和方法。微定位系统和方法利用形成在玻璃基板（12或100）中的微胶片（40）。通过对玻璃基板的一部分进行局部加热来形成微胶囊，这导致玻璃的加热局部快速膨胀。微丸的高度和形状取决于玻璃基板的类型和输送到基底的热量和形式。微胶片允许包括平面波导和光纤在内的光学元件的主动或被动微定位。还公开了使用微型微量定位器形成的光学组件。

5. 发明申请

US20050100073A1 Cladding-pumped quasi 3-level fiber laser/amplifier 审中-公开
标题翻译：包层泵浦准3级光纤激光器/放大器
公开(公告)号：US20050100073A1
公开(公告)日：2005-05-12
申请号：US10705032
申请日：2003-11-10
申请人： Lawrence Hughes , Xingsheng Liu , Donnell Walton , Chung-En Zah , Luis Zenteno
发明人： Lawrence Hughes , Xingsheng Liu , Donnell Walton , Chung-En Zah , Luis Zenteno
IPC分类号： H01S3/067 , H01S3/094 , H01S3/0941 , H01S3/091
CPC分类号： H01S3/06708 , H01S3/067 , H01S3/06716 , H01S3/094 , H01S3/094007 , H01S3/09415 , H01S5/2036
摘要： An optically active fiber (30) is disclosed for making a fiber laser (18) or an amplifier (16) for optically pumping by a broad area laser diode for operation in the 1.5 micron band. This double-clad structured active fiber (30) has a core (34), doped with an optically excitable erbium ion having a quasi-three-level transition. The core (3) has a core refractive index and a core cross-sectional area. An inner cladding (32) surrounds the core (34). The inner cladding (32) has an inner cladding refractive index less than the core refractive index, an inner cladding cross-sectional area between 2 and 25 times greater than that of the core cross-sectional area, and an aspect ratio greater than 1.5:1. An outer cladding (36) surrounds the inner cladding (32) and has an outer cladding refractive index less than the inner cladding refractive index.
摘要翻译：公开了一种用于制造光纤激光器（18）或放大器（16）的光学有源光纤（30），用于通过广域激光二极管光学泵浦以在1.5微米波段内操作。这种双包层结构的有源光纤（30）具有掺杂有具有准三电平转换的光学可激发的铒离子的芯（34）。芯（3）具有芯折射率和芯横截面积。内包层（32）围绕芯部（34）。内包层（32）的内包层折射率小于纤芯折射率，内包层横截面积比芯横截面积大2至25倍，纵横比大于1.5： 1。外包层（36）围绕内包层（32）并且具有小于内包层折射率的外包层折射率。

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