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1. 发明授权

US07651902B2 Hybrid substrates and methods for forming such hybrid substrates 失效
标题翻译：混合基板和形成这种混合基板的方法
公开(公告)号：US07651902B2
公开(公告)日：2010-01-26
申请号：US11737989
申请日：2007-04-20
申请人： Ethan Harrison Cannon , Toshiharu Furukawa , John Gerard Gaudiello , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger, III , Jack Allan Mandelman , William Robert Tonti
发明人： Ethan Harrison Cannon , Toshiharu Furukawa , John Gerard Gaudiello , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger, III , Jack Allan Mandelman , William Robert Tonti
IPC分类号： H01L21/338 , H01L23/62
CPC分类号： H01L21/76243 , H01L21/76251 , H01L21/823807 , H01L21/823878 , H01L21/84 , H01L27/1203 , H01L27/1207
摘要： Hybrid substrates characterized by semiconductor islands of different crystal orientations and methods of forming such hybrid substrates. The methods involve using a SIMOX process to form an insulating layer. The insulating layer may divide the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.
摘要翻译：以不同晶体取向的半导体岛为特征的混合基板和形成这种混合基板的方法。该方法涉及使用SIMOX工艺来形成绝缘层。绝缘层可以将不同晶体取向中的至少一个的岛分成相互排列的器件和体区。身体区域可以相对于装置区域电浮动。

2. 发明申请

US20080258181A1 Hybrid Substrates and Methods for Forming Such Hybrid Substrates 失效
标题翻译：混合底物和形成这种杂交基质的方法
公开(公告)号：US20080258181A1
公开(公告)日：2008-10-23
申请号：US11737989
申请日：2007-04-20
申请人： Ethan Harrison Cannon , Toshiharu Furukawa , John Gerard Gaudiello , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger , Jack Allan Mandelman , William Robert Tonti
发明人： Ethan Harrison Cannon , Toshiharu Furukawa , John Gerard Gaudiello , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger , Jack Allan Mandelman , William Robert Tonti
IPC分类号： H01L27/092 , H01L21/8238
CPC分类号： H01L21/76243 , H01L21/76251 , H01L21/823807 , H01L21/823878 , H01L21/84 , H01L27/1203 , H01L27/1207
摘要： Hybrid substrates characterized by semiconductor islands of different crystal orientations and methods of forming such hybrid substrates. The methods involve using a SIMOX process to form an insulating layer. The insulating layer may divide the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.
摘要翻译：以不同晶体取向的半导体岛为特征的混合基板和形成这种混合基板的方法。该方法涉及使用SIMOX工艺来形成绝缘层。绝缘层可以将不同晶体取向中的至少一个的岛分成相互排列的器件和体区。身体区域可以相对于装置区域电浮动。

3. 发明授权

US07750406B2 Design structure incorporating a hybrid substrate 失效
标题翻译：结合混合基板的设计结构
公开(公告)号：US07750406B2
公开(公告)日：2010-07-06
申请号：US11877871
申请日：2007-10-24
申请人： Ethan Harrison Cannon , Toshiharu Furukawa , John Gerard Gaudiello , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger, III , Jack Allan Mandelman , William Robert Tonti
发明人： Ethan Harrison Cannon , Toshiharu Furukawa , John Gerard Gaudiello , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger, III , Jack Allan Mandelman , William Robert Tonti
IPC分类号： H01L23/62 , H01L29/94
CPC分类号： H01L21/76264
摘要： Design structure embodied in a machine readable medium for designing, manufacturing, or testing a design in which the design structure includes devices formed in a hybrid substrate characterized by semiconductor islands of different crystal orientations. An insulating layer divides the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.
摘要翻译：设计结构体现在机器可读介质中，用于设计，制造或测试设计，其中设计结构包括以混合衬底形成的器件，其特征在于具有不同晶体取向的半导体岛。绝缘层将至少一个不同晶体取向的岛分成相互排列的器件和体区。身体区域可以相对于装置区域电浮动。

4. 发明申请

US20080258222A1 Design Structure Incorporating a Hybrid Substrate 失效
标题翻译：混合基板的设计结构
公开(公告)号：US20080258222A1
公开(公告)日：2008-10-23
申请号：US11877871
申请日：2007-10-24
申请人： Ethan Harrison Cannon , Toshiharu Furukawa , John Gerard Gaudiello , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger , Jack Allan Mandelman , William Robert Tonti
发明人： Ethan Harrison Cannon , Toshiharu Furukawa , John Gerard Gaudiello , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger , Jack Allan Mandelman , William Robert Tonti
IPC分类号： H01L27/12
CPC分类号： H01L21/76264
摘要： Design structure embodied in a machine readable medium for designing, manufacturing, or testing a design in which the design structure includes devices formed in a hybrid substrate characterized by semiconductor islands of different crystal orientations. An insulating layer divides the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.
摘要翻译：设计结构体现在机器可读介质中，用于设计，制造或测试设计，其中设计结构包括以混合衬底形成的器件，其特征在于具有不同晶体取向的半导体岛。绝缘层将至少一个不同晶体取向的岛分成相互排列的器件和体区。身体区域可以相对于装置区域电浮动。

5. 发明授权

US06759597B1 Wire bonding to dual metal covered pad surfaces 失效
标题翻译：引线键合到双金属覆盖垫表面
公开(公告)号：US06759597B1
公开(公告)日：2004-07-06
申请号：US09017338
申请日：1998-02-02
申请人： Lawrence Richard Cutting , John Gerard Gaudiello , Luis Jesus Matienzo , Nikhil Mohan Murdeshwar
发明人： Lawrence Richard Cutting , John Gerard Gaudiello , Luis Jesus Matienzo , Nikhil Mohan Murdeshwar
IPC分类号： H05K116
CPC分类号： H01L24/85 , H01L23/49811 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/4847 , H01L2224/48644 , H01L2224/48744 , H01L2224/48844 , H01L2224/85203 , H01L2224/85205 , H01L2224/85444 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/1579 , H01L2924/15798 , H01L2924/20105 , H01L2924/20752 , H01L2924/20753 , H05K3/244 , H05K3/328 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , H01L2924/00014 , H01L2924/00
摘要： Wire bonds are made to palladium coated bonded pads on organic dielectric substrates at temperatures below 200° C. A layer of palladium thicker than 14 micro-inches is covered with a thin flash of gold. Palladium coated over copper pads is protected from copper diffusion by a thin nickel layer positioned between the two. Subsequent baking for 1 hour at 185° C. drives off hydrogen molecules provided the gold is less than 200 Å thick. A bonding wire, preferably of gold is then successfully bonded to the pad using conventional bonding equipment at temperatures below 200° C.
摘要翻译：在低于200℃的温度下，将引线键合到有机电介质基底上的钯涂覆的键合焊盘。厚度大于14微英寸的钯层被薄闪闪的金覆盖。通过位于两者之间的薄镍层来保护涂覆在铜焊盘上的钯不被铜扩散。随后在185℃下烘烤1小时，如果金小于200埃，则驱除氢分子。然后使用常规粘合设备在200℃以下的温度下将优选为金的接合线成功地粘合到垫上。

6. 发明授权

US6042889A Method for electrolessly depositing a metal onto a substrate using mediator ions 失效
标题翻译：使用介质离子将金属无电沉积到基底上的方法
公开(公告)号：US6042889A
公开(公告)日：2000-03-28
申请号：US202536
申请日：1994-02-28
申请人： Gerald Lee Ballard , John Gerard Gaudiello
发明人： Gerald Lee Ballard , John Gerard Gaudiello
IPC分类号： H05K1/09 , C23C18/40 , C23C18/48 , H01L23/14 , H05K3/24 , B05D3/04
CPC分类号： H05K3/244 , C23C18/40 , H05K3/24 , Y10S428/936 , Y10T428/12535 , Y10T428/12903
摘要： An electroless metal plating bath composition, a corresponding method for electrolessly depositing a metal onto a substrate surface, as well as the resulting, metallized substrate, are disclosed. The inventive bath composition includes water, a soluble source of the metal ions it is desired to chemically reduce at, and deposit onto, the substrate surface of interest, and a complexing agent for the metal ions. In addition, the bath composition includes a soluble source of any one or more of a select group of what are termed mediator ions, which group includes palladium (Pd), platinum (Pt), silver (Ag), ruthenium (Ru), iridium (Ir), osmium (Os) and rhodium (Rh) ions, as well as a complexing agent for the mediator ions. Moreover, the bath composition includes a chemical reducing agent, which primarily serves to chemically reduce the mediator ions at the substrate surface of interest. Significantly, by using an appropriate ratio of the concentration of the metal ions in solution to the concentration of the mediator ions in solution, and depending upon which mediator ions are used, the inventive bath composition serves to electrolessly deposit the metal of interest onto the substrate surface of interest, with the resulting deposited metal containing less than or equal to about 3.0 atomic percent, or less than or equal to about 2.0 atomic percent, or even less than or equal to about 1.0 atomic percent, of the corresponding mediator metal.
摘要翻译：公开了一种无电金属电镀浴组合物，用于将金属无电沉积到衬底表面上的相应方法，以及所得到的金属化衬底。本发明的浴组合物包括水，需要化学还原并沉积到感兴趣的基底表面上的金属离子的可溶性源，以及用于金属离子的络合剂。此外，浴组合物包括任何一种或多种所谓的介体离子的选择组的可溶性源，该组包括钯（Pd），铂（Pt），银（Ag），钌（Ru），铱（Ir），锇（Os）和铑（Rh）离子，以及介体离子的络合剂。此外，浴组合物包括化学还原剂，其主要用于化学还原感兴趣的基底表面处的介体离子。重要的是，通过使用溶液中的金属离子的浓度与溶液中的介体离子的浓度的适当比例，并且取决于使用哪种介体离子，本发明的浴组合物用于将感兴趣的金属无电沉积到衬底上所形成的沉积金属含有相应的介体金属的小于或等于约3.0原子百分比，或小于或等于约2.0原子百分比，或甚至小于或等于约1.0原子百分比。

7. 发明授权

US06519845B1 Wire bonding to dual metal covered pad surfaces 失效
标题翻译：引线键合到双金属覆盖垫表面
公开(公告)号：US06519845B1
公开(公告)日：2003-02-18
申请号：US09481478
申请日：2000-01-11
申请人： Lawrence Richard Cutting , John Gerard Gaudiello , Luis Jesus Matienzo , Nikhil Mohan Murdeshwar
发明人： Lawrence Richard Cutting , John Gerard Gaudiello , Luis Jesus Matienzo , Nikhil Mohan Murdeshwar
IPC分类号： H01R900
CPC分类号： H01L24/85 , H01L23/49811 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/4847 , H01L2224/48644 , H01L2224/48744 , H01L2224/48844 , H01L2224/85203 , H01L2224/85205 , H01L2224/85444 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/1579 , H01L2924/15798 , H01L2924/20105 , H01L2924/20752 , H01L2924/20753 , H05K3/244 , H05K3/328 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , H01L2924/00014 , H01L2924/00
摘要： Wire bonds are made to palladium coated bonded lads on organic dielectric substrates at temperatures below 200° C. A layer of palladium thicker than 14 micro-inches is covered with a thin flash of gold. Palladium coated over copper pads is protected from copper diffusion by a thin nickel layer positioned between the two. Subsequent baking for 1 hour at 185° C. drives off hydrogen molecules provided the gold is less than 200 Å thick. A bonding wire, preferably of gold is then successfully bonded to the pad using conventional bonding equipment at temperatures below 200° C.
摘要翻译：在低于200℃的温度下，在有机电介质基底上将钯键合到钯涂层的粘合层上。厚度超过14微英寸的钯层被薄闪闪的金覆盖。通过位于两者之间的薄镍层来保护涂覆在铜焊盘上的钯不被铜扩散。随后在185℃下烘烤1小时，如果金小于200埃，则驱除氢分子。然后使用常规粘合设备在200℃以下的温度下将优选为金的接合线成功地粘合到垫上。

8. 发明授权

US6162365A Pd etch mask for copper circuitization 失效
标题翻译：用于铜电路的Pd蚀刻掩模
公开(公告)号：US6162365A
公开(公告)日：2000-12-19
申请号：US34936
申请日：1998-03-04
申请人： Ashwinkumar C. Bhatt , John Gerard Gaudiello
发明人： Ashwinkumar C. Bhatt , John Gerard Gaudiello
IPC分类号： H05K3/06 , H05K3/10 , H05K3/24 , H05K3/42 , H01B13/00 , B05D5/12 , C25D5/02 , G03C5/00 , H01K3/10
CPC分类号： H05K3/244 , H05K3/062 , H05K3/108 , H05K3/427 , Y10T29/49165
摘要： A process for making a printed circuit board is provided. The process employs a noble metal as an etch mask for subtractive circuitization and as a seed layer for secondary finishing. In a preferred embodiment of the invention, a dielectric is covered by a conductive layer of metal such as copper, a patterned photoresist is applied, additional copper is deposited on areas not covered by the photoresist, and a palladium etch mask/seed layer is deposited on the copper. The palladium layer remains sufficiently active for deposition of nickel or gold on the circuitry for purposes such as wire bonding.
摘要翻译：提供了制造印刷电路板的工艺。该方法采用贵金属作为减法电路的蚀刻掩模和用于二次精加工的籽晶层。在本发明的优选实施例中，电介质被诸如铜的金属导电层覆盖，施加图案化的光致抗蚀剂，另外的铜沉积在未被光致抗蚀剂覆盖的区域上，并且钯蚀刻掩模/晶种层被沉积在铜上。钯层保持足够的活性以将镍或金沉积在电路上用于诸如引线键合的目的。

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