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    • 1. 发明申请
    • System and Method for Installing and Retaining I/O Connector Without Tools
    • 没有工具安装和保留I / O连接器的系统和方法
    • US20070253175A1
    • 2007-11-01
    • US11774577
    • 2007-07-07
    • Eric AdamsMartin CrippenPat GallarelliMatthew Henry
    • Eric AdamsMartin CrippenPat GallarelliMatthew Henry
    • H05K7/10
    • G02B6/4201G02B6/4261G02B6/428G02B6/4292
    • A system and method for installing and retaining an input/output connector without tools is presented. A user removes a module from a computer system in order to add or remove a transceiver. The module includes a housing and a front bezel, whereby a bezel latch attaches the front bezel to the housing. The user depresses the bezel latch to remove the front bezel from the housing. As a result, a retention beam is exposed on the housing that secures transceivers to a circuit board. The user unlatches the retention beam, inserts a transceiver onto a mounting area, and latches the retention beam. The retention beam applies pressure to the transceiver, which results in a coupling of the transceiver to a circuit board included in the housing. In turn, the user attaches the front bezel to the housing via the bezel latch and reinserts the module into the computer system.
    • 提出了一种没有工具来安装和保留输入/输出连接器的系统和方法。 用户从计算机系统中移除模块,以便添加或删除收发器。 模块包括壳体和前挡板,由此挡板闩将前挡板连接到壳体。 用户按下挡板闩锁以从外壳中卸下前挡板。 结果,保持梁暴露在壳体上,从而将收发器固定到电路板上。 使用者松开保持光束,将收发器插入安装区域,并锁定保持光束。 保持光束对收发器施加压力,这导致收发器与壳体中包括的电路板的耦合。 反过来,用户通过挡板闩将前挡板连接到外壳,并将模块重新插入计算机系统。
    • 7. 发明申请
    • Automatic recirculation airflow damper
    • 自动循环气流阻尼器
    • US20050113015A1
    • 2005-05-26
    • US10717782
    • 2003-11-20
    • Martin CrippenFrancis KucharJason MattesonBrian Trumbo
    • Martin CrippenFrancis KucharJason MattesonBrian Trumbo
    • F24F7/00H05K5/00H05K7/20
    • H05K7/2019
    • An automatic recirculation airflow damper for use in electronic enclosures utilizing multiple air moving devices to cool electronic components within the enclosure. When an air moving device is removed, the damper automatically closes an orifice associated with the absent air moving device, thus preventing the loss of cooling air from the vacated orifice and the subsequent reduction in cooling capacity. In some embodiments, the damper is attached to the enclosure with hinges. In certain embodiments, the damper is configured with elastomeric material such that the interface between the orifice and the damper offers high impedance to airflow while the damper is in a closed position. The automatic recirculation airflow damper reduces electronic thermal failures and therefore increases the reliability of a system equipped with the device.
    • 一种用于电子机箱的自动再循环气流阻尼器,其利用多个空气移动装置来冷却外壳内的电子部件。 当空气移动装置被移除时,阻尼器自动关闭与不存在的空气移动装置相关联的孔口,从而防止来自空出的孔口的冷却空气的损失和随后的冷却能力降低。 在一些实施例中,阻尼器利用铰链连接到外壳。 在某些实施例中,阻尼器由弹性体材料构成,使得孔和阻尼器之间的界面在阻尼器处于关闭位置时提供对气流的高阻抗。 自动再循环气流阻尼器减少了电子热故障,从而提高了配备该装置的系统的可靠性。
    • 8. 发明申请
    • System, method, and apparatus for providing a thermal bypass in electronic equipment
    • 用于在电子设备中提供热旁路的系统,方法和装置
    • US20050247067A1
    • 2005-11-10
    • US10842284
    • 2004-05-10
    • Martin CrippenJason MattesonWilliam Piazza
    • Martin CrippenJason MattesonWilliam Piazza
    • F25B21/02F25D23/12H05K7/20
    • H05K7/20F25B21/02F25B2321/0251
    • A system enclosure uses two heat exchangers and a thermoelectric cooling module to manage heat within the system. An airflow enters the system and is heated by server blades. Portions of the airflow split and travel to various portions of the system enclosure. Some heat is removed from the airflow by passing through the first heat exchanger before circulating around downstream subsystems. The first heat exchanger contacts the cold side of a TEC module, to reduce the temperature of that airflow. The air then enters the network switch module or other subsystem where it is further heated. Thereafter, the second heat exchanger ‘bypasses’ those components by reinserting the upstream heat back into the downstream airflow. The second heat exchanger contacts the hot side of the TEC module. The mixture of all heated air is then expelled from the system enclosure.
    • 系统机箱使用两个热交换器和热电冷却模块来管理系统内的热量。 气流进入系统并由服务器刀片加热。 气流的一部分分流并移动到系统外壳的各个部分。 在下游子系统周围循环之前,通过第一热交换器从气流中除去一些热量。 第一个热交换器接触TEC模块的冷端,以降低气流的温度。 空气然后进入网络交换机模块或进一步加热的其他子系统。 此后,第二热交换器通过将上游热量重新插入下游气流中来绕过这些部件。 第二个热交换器接触TEC模块的热侧。 然后将所有加热空气的混合物从系统外壳排出。