会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • INTEGRATED CIRCUIT DESIGN USING DYNAMIC VOLTAGE SCALING
    • 使用动态电压调节的集成电路设计
    • US20150095863A1
    • 2015-04-02
    • US14503821
    • 2014-10-01
    • Entropic Communications, Inc.
    • Raed MoughabghabBranislav PetrovicMichael Scott
    • G06F17/50
    • G06F17/5081G06F17/505G06F2217/78
    • A method and an apparatus from such method for designing an integrated circuit (IC) that mitigates the effects of process, voltage, and temperature dependent characteristics on the fabrication of advanced IC's but provides high die yields, lower power usage, and faster circuits. Conventional design process takes into account power supply voltage Vdd as a variable that must be considered in a skewed corner analysis. The disclosure teaches that the IC design process can be substantially simplified by essentially factoring out voltage based variations in corner lot analysis for IC designs that include dynamic voltage scaling circuitry, because each fabricated IC die of an IC design having dynamic voltage scaling can individually adjust the applied supply voltage Vdd within a range to offset local process-induced variations in the performance of that specific IC die.
    • 一种用于设计集成电路(IC)的方法和装置,其减轻了对先进IC的制造的过程,电压和温度依赖特性的影响,但是提供了较高的管芯产量,更低的功率使用和更快的电路。 传统的设计过程考虑到电源电压Vdd作为偏斜角分析中必须考虑的变量。 该公开内容教导了通过基本上将基于电压的偏差改变为包括动态电压缩放电路的IC设计的角落批次分析来大大简化IC设计过程,因为具有动态电压缩放的IC设计的每个制造的IC管芯可以单独调整 施加的电源电压Vdd在一定范围内以抵消该特定IC芯片的性能的局部过程引起的变化。