专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4835240A Epoxy resin composition 失效
标题翻译：环氧树脂组合物
公开(公告)号：US4835240A
公开(公告)日：1989-05-30
申请号：US199685
申请日：1988-05-31
申请人： Eiki Togashi , Toshimasa Takata
发明人： Eiki Togashi , Toshimasa Takata
IPC分类号： C07D303/27 , C07D303/24 , C08G59/00 , C08G59/06 , C08G59/20 , C08G59/30 , C08G59/32 , C08G59/62 , C08L63/00
CPC分类号： C07D303/24 , C08G59/3218 , C08G59/621 , Y10S525/93
摘要： An epoxy resin composition comprising a trifunctional epoxy resin derived from a trisphenol having the structure represented by the following general formula ##STR1## wherein R represents a hydrogen atom, an alkyl group or a halogen atom, and a novolak-type phenolic resin. This epoxy resin composition gives a cured product having excellent pliability and a high glass transition temperature. It is especially useful as a semiconductor encapsulating material.

2. 发明授权

US5064881A Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica 失效
标题翻译：环氧树脂组合物和半导体密封材料，包括基于球形二氧化硅
公开(公告)号：US5064881A
公开(公告)日：1991-11-12
申请号：US466033
申请日：1990-01-16
申请人： Eiki Togashi , Hisashi Matsumoto
发明人： Eiki Togashi , Hisashi Matsumoto
IPC分类号： C08K7/18 , C08G59/00 , C08G59/40 , C08G59/62 , C08G59/68 , C08K3/36 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31
CPC分类号： H01B3/40 , C08G59/686 , C08K3/36 , C08L63/00
摘要： Disclosed is an epoxy resin composition comprising, as basic components, (A) an epoxy resin, (B) a phenol-novolak resin, (C) a curing promotor and (D) a filler. Pulverized or spherical silica having specific particle size characteristics is used as the filler (D). Preferably, a halogenated epoxy resin and antimony oxide are further incorporated in this epoxy resin. This epoxy resin composition shows a very small molding shrinkage. If a dialkylurea derivative is used as the curing promotor (C), the stability of the composition at about 100.degree. C. is drastically improved and the flowability of the composition is improved. Accordingly, precision injection molding becomes possible, and the effect of sealing a semiconductor is enhanced.

3. 发明授权

US06231800B1 Method for injection molding for epoxy resin moldings and an injection moldable epoxy resin composition 有权
标题翻译：环氧树脂模制品的注射成型方法和注塑成型环氧树脂组合物
公开(公告)号：US06231800B1
公开(公告)日：2001-05-15
申请号：US09348073
申请日：1999-07-06
申请人： Eiki Togashi , Tsukasa Sakuraba
发明人： Eiki Togashi , Tsukasa Sakuraba
IPC分类号： B29C4500
CPC分类号： B29C45/73 , B29C45/2756 , B29K2063/00 , B29K2101/10 , C08G59/686 , C08L63/00
摘要： Disclosed is a method of injection-molding for epoxy resin moldings wherein an epoxy resin composition is used as starting material, a molding cycle is shortened, a continuous molding operation is possible and a waste portion after curing can be minimized as well as an injection-moldable epoxy resin composition excellent in thermal stability possessing latent-type curing characteristics capable of rapidly promoting curing reaction in a metal mold without being cured in an injection molding machine. The aforesaid method is carried out by charging an epoxy resin composition possessing the latent-type curing characteristics into a mini-sprue metal mold which is composed of a manifold part, a mini-sprue part and an ejector-plate part and wherein a metal mold temperature at the manifold part is so maintained that the epoxy resin composition is molten but curing of the composition is not promoted, and injection-molding the composition.
摘要翻译：公开了一种环氧树脂成型体的注塑成型方法，其中使用环氧树脂组合物作为原料，缩短成型周期，连续成型操作成为可能，固化后的废弃部分能够最小化，可塑性环氧树脂组合物具有优异的热稳定性，具有能够快速促进金属模具中的固化反应而不在注塑机中固化的潜在型固化特性。上述方法通过将具有潜在型的环氧树脂组合物固化特性成为由歧管部件，微型浇口部件和顶板部件构成的微型浇道金属模具，并且其中歧管部件处的金属模具温度保持为环氧树脂组合物熔融但固化的组合物不被促进，并且注塑成型。

4. 发明授权

US5908882A Epoxy resin composition 失效
标题翻译：环氧树脂组合物
公开(公告)号：US5908882A
公开(公告)日：1999-06-01
申请号：US940376
申请日：1997-09-30
申请人： Eiki Togashi , Youhei Suzuki
发明人： Eiki Togashi , Youhei Suzuki
IPC分类号： C08G59/18 , C08G59/20 , C08G59/40 , C08G59/62 , C08G59/68 , C08K3/36 , C08L63/00 , C08L63/02
CPC分类号： C08L63/00 , C08G59/686 , C08K3/36
摘要： Disclosed is an epoxy resin composition which is excellent in thermal stability without being cured in a cylinder of an injection molding machine and is extremely suppressed in the formation of flux on molding.This epoxy resin composition has an important feature residing in the use of a specific silica of the following characteristics as an inorganic filler to be incorporated thereinto whereby excellent technical effects can be achieved such as the composition being injection-moldable and the formation of flux on molding being suppressed extremely:(a) an average particle diameter of not more than 30 .mu.m,(b) 5-30% by weight of a molten or crystalline silica powder having an average particle diameter of not more than 7 .mu.m and a specific surface area of at least 5 m.sup.2 /g in the total silica content,(c) 15-45% by weight of silica having an average particle diameter of not more than 5 .mu.m in the total silica content,(d) the maximum particle diameter of the total silica content of not more than 150 .mu.m, and(e) a silica content of 70-82% by weight in the total composition.An alkylurea derivative is preferably used as the curing accelerator among which dimethylamine adduct of 2,4-tolylene diisocyanate is more preferably used.
摘要翻译：公开了一种环氧树脂组合物，其热稳定性优异，而不会在注射成型机的气缸中固化，并且极大地抑制了成型时助熔剂的形成。该环氧树脂组合物在使用具有以下特性的特定二氧化硅作为无机填料的特征二氧化硅中具有重要的特征，其中可以实现优异的技术效果，例如可注射成型的组合物和在成型时形成助熔剂受到极大的抑制：（a）平均粒径不大于30μm，（b）5-30重量％的平均粒径不大于7μm的熔融或结晶二氧化硅粉末，总硅石含量至少为5m2 / g的表面积，（c）总二氧化硅含量中平均粒径不超过5μm的二氧化硅的15-45％（重量），（d）最大颗粒总二氧化硅含量的直径不超过150μm，（e）总组合物中二氧化硅含量为70-82重量％。优选使用烷基脲衍生物作为固化促进剂，其中更优选使用2,4-甲苯二异氰酸酯的二甲胺加合物。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式