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    • 2. 发明申请
    • Vapor deposition apparatus
    • 蒸镀装置
    • US20060065197A1
    • 2006-03-30
    • US11235188
    • 2005-09-27
    • Eiji YamadaTakayuki YuasaMasahiro ArakiNakao Akutsu
    • Eiji YamadaTakayuki YuasaMasahiro ArakiNakao Akutsu
    • C23C16/00
    • C23C16/455C23C16/54
    • A vapor deposition apparatus of the present invention has a substrate holder having a substrate holding surface for holding a substrate thereon, and a flow channel for supplying a source gas onto the substrate. The flow channel has an upper wall and a lower wall. An aperture portion is provided in the lower wall of the flow channel. The substrate holding surface of the substrate holder fits in the aperture portion while forming a space between the substrate holding surface and the aperture portion. A means for reducing leakage of gas through the space between the aperture portion and the substrate holder is provided. With this structure, since a means for reducing leakage of gas through the space between the aperture portion and the substrate holder is provided, the conductance with respect to outflow of gas increases, which in turn reduces variations in the amount of outflow gas. This results in high yield production of nitride semiconductor devices with a long life and high light-emission efficiency.
    • 本发明的蒸镀装置具有:基板保持具,具有用于保持基板的基板保持面,以及用于将源气体供给到基板上的流路。 流动通道具有上壁和下壁。 开口部设置在流路的下壁。 在衬底保持表面和孔部之间形成空间的同时,衬底保持器的衬底保持表面装配在孔部分中。 提供了一种用于减少气体通过开口部分和衬底保持器之间的空间的泄漏的装置。 利用这种结构,由于提供了用于减少气体通过开口部和基板保持架之间的空气的泄漏的装置,所以相对于气体流出的电导性增加,从而减小流出气体量的变化。 这导致具有长寿命和高发光效率的氮化物半导体器件的高产量生产。
    • 3. 发明授权
    • III-N compound semiconductor device
    • III-N族化合物半导体器件
    • US06455877B1
    • 2002-09-24
    • US09657875
    • 2000-09-08
    • Atsushi OgawaTakayuki YuasaYoshihiro UetaYuhzoh TsudaMasahiro ArakiMototaka Taneya
    • Atsushi OgawaTakayuki YuasaYoshihiro UetaYuhzoh TsudaMasahiro ArakiMototaka Taneya
    • H01L3300
    • H01L33/32H01L33/025H01S5/0421H01S5/0425H01S5/32341
    • A GaN light-emitting device is provided having a low specific contact resistance of an n-type electrode as well as a low threshold voltage or threshold current density. The GaN light-emitting device has an electrode formed on a nitrogen-terminated surface of a GaN substrate. Specifically, the GaN light-emitting device includes the GaN substrate, a plurality of GaN compound semiconductor layers formed on the GaN substrate, and the n-type electrode and a p-type electrode, wherein the semiconductor substrate is of n-type and the n-type electrode is formed on the nitrogen-terminated surface of the semiconductor substrate. The concentration of n-type impurities in the substrate preferably ranges from 1×1017 cm−3 to 1×1021 cm−3. The substrate preferably includes at least a first portion forming the nitrogen-terminated surface and having a first concentration of n-type impurities and a second portion having a second concentration of n-type impurities lower than the first concentration of n-type impurities.
    • 提供具有n型电极的低比接触电阻以及低阈值电压或阈值电流密度的GaN发光器件。 GaN发光器件具有形成在GaN衬底的氮封端表面上的电极。 具体地,GaN发光器件包括GaN衬底,形成在GaN衬底上的多个GaN化合物半导体层,以及n型电极和p型电极,其中半导体衬底为n型, n型电极形成在半导体衬底的氮封端表面上。 衬底中n型杂质的浓度优选为1×10 17 cm -3至1×10 21 cm -3。 基板优选至少包括形成氮封端表面并具有第一浓度的n型杂质的第一部分和具有比第一浓度的n型杂质低的n型杂质的第二浓度的第二部分。