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1. 发明授权

US07429915B2 System and method for detecting unauthorized access to electronic equipment or components 有权
标题翻译：用于检测未经授权的访问电子设备或组件的系统和方法
公开(公告)号：US07429915B2
公开(公告)日：2008-09-30
申请号：US11170881
申请日：2005-06-30
申请人： Edwin D. Cruzado , Kenneth H. Heffner
发明人： Edwin D. Cruzado , Kenneth H. Heffner
IPC分类号： B60R25/10
CPC分类号： G08B13/128
摘要： An improved system and method for protecting sensitive electronic equipment or components against unauthorized access, by detecting and also reacting to unauthorized intrusions into the enclosures for the sensitive electronic equipment or components is disclosed. For example, a protective system for protecting sensitive electronic equipment or components against unauthorized access is disclosed that includes a fiber optic cable mesh or network attached to, or embedded in, the walls of the enclosure for the electronic equipment or components. A continuous signal or burst is applied to the fiber optic cable, which is coupled to an optical signal detection device. Thus, any attempt to remove or penetrate the walls of the enclosure interrupts the signal in the fiber optic cable, and the interruption of the signal is detected by the optical signal detection device. In response to the detection of the interruption of the signal in the fiber optic cable, a process can be initiated to erase, destroy or alter sensitive data contained within the electronic equipment or components. Also, a power source for the protective system is disclosed, which can be self-sustaining and contained within the protected enclosure for the sensitive electronic equipment or components.
摘要翻译：公开了一种改进的系统和方法，用于通过检测并且还对未经授权的入侵敏感电子设备或组件的外壳来保护敏感的电子设备或组件以防止未经授权的访问。例如，公开了一种用于保护敏感的电子设备或组件以防止未经授权的访问的保护系统，其包括附接到或嵌入在电子设备或组件的外壳的壁上的光纤电缆网或网络。连续信号或脉冲串被施加到耦合到光信号检测装置的光纤电缆。因此，任何去除或穿透外壳壁的尝试都会中断光缆中的信号，并且信号的中断由光信号检测装置检测。响应于检测到光纤电缆中的信号的中断，可以开始一个过程来擦除，破坏或改变包含在电子设备或组件内的敏感数据。此外，公开了一种用于保护系统的电源，其可以是自维持的并且包含在用于敏感电子设备或组件的受保护的外壳内。

2. 发明授权

US06319740B1 Multilayer protective coating for integrated circuits and multichip modules and method of applying same 失效
标题翻译：用于集成电路和多芯片模块的多层保护涂层及其应用方法
公开(公告)号：US06319740B1
公开(公告)日：2001-11-20
申请号：US08549349
申请日：1995-10-27
申请人： Kenneth H. Heffner , Curtis W. Anderson
发明人： Kenneth H. Heffner , Curtis W. Anderson
IPC分类号： B05D136
CPC分类号： H01L23/573 , H01L21/56 , H01L23/24 , H01L23/295 , H01L2224/48091 , H01L2224/8592 , H01L2924/00014 , H01L2924/16195 , H01L2924/3025 , H01L2924/00 , H01L2224/45099
摘要： Disclosed is a method of forming a multilayer opaque coating on an integrated circuit or multichip module. First, an opaque coating composition is heated to a molten state and the molten opaque coating composition is applied so as to form an opaque coating that overlies active circuitry on the surface of the integrated circuit or multichip module, to prevent optical and radiation based inspection and reverse engineering of the active circuitry. Further coatings are applied over the opaque coating to shield the active circuitry of the integrated circuit or multichip module from the adverse affects of electromagnetic interference and/or high energy radiation.
摘要翻译：公开了一种在集成电路或多芯片模块上形成多层不透明涂层的方法。首先，将不透明的涂料组合物加热至熔融状态，并施加熔融的不透明涂料组合物以形成覆盖在集成电路或多芯片模块的表面上的有源电路的不透明涂层，以防止基于光学和辐射的检查，有源电路的逆向工程。将其它涂层施加在不透明涂层上以屏蔽集成电路或多芯片模块的有源电路免受电磁干扰和/或高能量辐射的不利影响。

3. 发明授权

US5762711A Coating delicate circuits 失效
标题翻译：涂层精致电路
公开(公告)号：US5762711A
公开(公告)日：1998-06-09
申请号：US751146
申请日：1996-11-15
申请人： Kenneth H. Heffner , Curtis W. Anderson
发明人： Kenneth H. Heffner , Curtis W. Anderson
IPC分类号： B05B7/20 , B05B12/12 , B05B13/02 , H01L21/00 , B05B7/16 , B05B3/00 , B05B15/02 , B05C13/00
CPC分类号： H01L21/6715 , B05B12/124 , B05B13/0242 , H01L23/573 , B05B7/20 , H01L2224/48091 , H01L2224/8592 , H01L27/02 , H01L2924/00014 , H01L2924/09701 , H01L2924/16195
摘要： Protective and security coatings are applied to an integrated circuit by periodically passing the integrated circuit through a flame spray containing molten particles of the coating composition. The integrated circuit is attached to a fixture that is cooled with a coolant that is applied to the integrated circuit. The distance between the flame spray gun and the integrated circuit is controlled so that the particles are molten when they strike the circuit but the circuit heating is minimized. A flame resistant mask retains the integrated circuit on the fixture. The mask is constructed of a low thermally conductive material and the fixture is constructed of a high thermally conducive material.
摘要翻译：通过周期性地使集成电路通过包含涂料组合物的熔融颗粒的火焰喷涂而将保护和安全涂层施加到集成电路。集成电路连接到用施加到集成电路的冷却剂冷却的固定装置。控制火焰喷枪和集成电路之间的距离，使得当它们撞击电路时，颗粒熔融，但电路加热最小化。阻燃面罩将集成电路保持在灯具上。掩模由低导热材料构成，夹具由高导热材料构成。

4. 发明授权

US07758911B2 Microelectronic security coatings 失效
标题翻译：微电子安全涂料
公开(公告)号：US07758911B2
公开(公告)日：2010-07-20
申请号：US10434440
申请日：2003-05-08
申请人： Kenneth H. Heffner
发明人： Kenneth H. Heffner
IPC分类号： B05D5/12
CPC分类号： H01L23/57 , G06F21/87 , G06F2221/2143 , G06K19/073 , G06K19/07372 , H01L2924/0002 , H05K1/0275 , Y10S428/901 , Y10S428/916 , Y10T428/249955 , H01L2924/00
摘要： A security coating on an electronic circuit assembly comprises a mesh coating that may have a unique signature pattern and comprise materials that easily produce an image of the signature so that it is possible to determine if reverse engineering has been attempted. Spaces in the mesh may include electrical components to erase circuit codes to destroy the functionality and value of the protected die if the mesh coated is disturbed. The voids may include compositions to enhance the mesh signature and abrade the circuit if tampering takes place.
摘要翻译：电子电路组件上的安全涂层包括可以具有唯一签名图案的网格涂层，并且包括容易产生签名图像的材料，使得可以确定是否已经尝试逆向工程。网格中的空间可能包括电气部件，以擦除电路代码，以破坏受保护的裸片的功能和价值。如果发生窜改，空隙可以包括用于增强网格签名并磨擦电路的组合物。

5. 发明申请

US20080132118A1 SECURE CONNECTOR WITH INTEGRATED TAMPER SENSORS 有权
标题翻译：安全连接器与集成夯锤传感器
公开(公告)号：US20080132118A1
公开(公告)日：2008-06-05
申请号：US11565390
申请日：2006-11-30
申请人： William J. Dalzell , Scott G. Fleischman , James L. Tucker , Kenneth H. Heffner
发明人： William J. Dalzell , Scott G. Fleischman , James L. Tucker , Kenneth H. Heffner
IPC分类号： H01R13/66
CPC分类号： H01R13/6683 , H01R13/748 , Y10T70/8216
摘要： A secure connector is provided. The secure connector comprises a casing; a tamper sensor disposed inside the casing and configured to detect unauthorized tamper events; and one or more conductors configured to carry signals, the one or more conductors passing through the tamper sensor.
摘要翻译：提供安全连接器。固定连接器包括壳体; 篡改传感器，其设置在所述壳体内并且被配置为检测未授权的窜改事件; 以及配置成承载信号的一个或多个导体，所述一个或多个导体穿过篡改传感器。

6. 发明授权

US08211538B2 Microelectronic security coatings 有权
标题翻译：微电子安全涂料
公开(公告)号：US08211538B2
公开(公告)日：2012-07-03
申请号：US12815775
申请日：2010-06-15
申请人： Kenneth H. Heffner
发明人： Kenneth H. Heffner
IPC分类号： B32B3/24 , B41M3/14 , B44F1/12
CPC分类号： H01L23/57 , G06F21/87 , G06F2221/2143 , G06K19/073 , G06K19/07372 , H01L2924/0002 , H05K1/0275 , Y10S428/901 , Y10S428/916 , Y10T428/249955 , H01L2924/00
摘要： A security coating on an electronic circuit assembly comprises a mesh coating that may have a unique signature pattern and comprise materials that easily produce an image of the signature so that it is possible to determine if reverse engineering has been attempted. Spaces in the mesh may include electrical components to erase circuit codes to destroy the functionality and value of the protected die if the mesh coated is disturbed. The voids may include compositions to enhance the mesh signature and abrade the circuit if tampering takes place.
摘要翻译：电子电路组件上的安全涂层包括可以具有唯一签名图案的网格涂层，并且包括容易产生签名图像的材料，使得可以确定是否已经尝试逆向工程。网格中的空间可能包括电气部件，以擦除电路代码，以破坏受保护的裸片的功能和价值。如果发生窜改，空隙可以包括用于增强网格签名并磨擦电路的组合物。

7. 发明申请

US20100254095A1 MICROELECTRONIC SECURITY COATINGS 有权
标题翻译：微电子安全涂料
公开(公告)号：US20100254095A1
公开(公告)日：2010-10-07
申请号：US12815775
申请日：2010-06-15
申请人： Kenneth H. Heffner
发明人： Kenneth H. Heffner
IPC分类号： H05K7/00 , B41M3/14 , H05K1/09
CPC分类号： H01L23/57 , G06F21/87 , G06F2221/2143 , G06K19/073 , G06K19/07372 , H01L2924/0002 , H05K1/0275 , Y10S428/901 , Y10S428/916 , Y10T428/249955 , H01L2924/00
摘要： A security coating on an electronic circuit assembly comprises a mesh coating that may have a unique signature pattern and comprise materials that easily produce an image of the signature so that it is possible to determine if reverse engineering has been attempted. Spaces in the mesh may include electrical components to erase circuit codes to destroy the functionality and value of the protected die if the mesh coated is disturbed. The voids may include compositions to enhance the mesh signature and abrade the circuit if tampering takes place.
摘要翻译：电子电路组件上的安全涂层包括可以具有唯一签名图案的网格涂层，并且包括容易产生签名图像的材料，使得可以确定是否已经尝试逆向工程。网格中的空间可能包括电气部件，以擦除电路代码，以破坏受保护的裸片的功能和价值。如果发生窜改，空隙可以包括用于增强网格签名并磨擦电路的组合物。

8. 发明授权

US06459488B1 Diffuse reflectance method and apparatus for determining thickness of an infrared translucent layer 失效
标题翻译：用于确定红外半透明层的厚度的漫反射方法和装置
公开(公告)号：US06459488B1
公开(公告)日：2002-10-01
申请号：US09502059
申请日：2000-02-10
申请人： Kenneth H. Heffner
发明人： Kenneth H. Heffner
IPC分类号： G01B902
CPC分类号： G01B11/0675
摘要： A method for producing an interferogram of an infrared translucent layer that is on a reflective substrate, comprising generating parallel infrared interferometer beams by means of an infrared interferometer, converging the parallel infrared interferometer beams into converging infrared interferometer beams, sending the converging infrared interferometer beams onto the infrared translucent layer to produce diffusely reflected infrared interferometer rays from above and below the infrared translucent layer, and making the diffusely reflected infrared interferometer rays into parallel reflected infrared interferometer rays.
摘要翻译：一种用于制造在反射基板上的红外半透明层的干涉图的方法，包括通过红外干涉仪产生平行红外干涉仪光束，将平行红外干涉仪光束会聚到会聚的红外干涉仪光束，将会聚的红外干涉仪光束发射到红外半透明层产生从红外半透明层上下的漫反射红外干涉仪射线，并使漫反射红外干涉仪射线成平行反射红外干涉仪射线。

9. 发明授权

US5877093A Process for coating an integrated circuit device with a molten spray 失效
标题翻译：用熔融喷雾涂覆集成电路装置的方法
公开(公告)号：US5877093A
公开(公告)日：1999-03-02
申请号：US549351
申请日：1995-10-27
申请人： Kenneth H. Heffner , Curtis W. Anderson
发明人： Kenneth H. Heffner , Curtis W. Anderson
IPC分类号： H01L21/56 , H01L23/29
CPC分类号： H01L23/573 , H01L21/56 , H01L23/24 , H01L23/295 , H01L2224/48091 , H01L2224/8592 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/181
摘要： Disclosed is a method of forming a primer coating and an opaque coating on an integrated circuit or multichip module. First a primer coating composition is applied to a surface of the integrated circuit device or multichip module to form a primer coating that increases the resistance of the surface to thermal and mechanical damage that may occur as a result of the application of the opaque coating. An opaque coating composition is then heated to a molten state and the molten opaque coating composition is applied over the primer coating to form an opaque coating that overlies active circuitry on the surface, to prevent optical and radiation based inspection and reverse engineering of the active circuitry.
摘要翻译：公开了一种在集成电路或多芯片模块上形成底漆涂层和不透明涂层的方法。首先，将底漆涂料组合物施加到集成电路器件或多芯片模块的表面以形成底漆涂层，其增加由于施加不透明涂层而可能发生的表面对热和机械损伤的电阻。然后将不透明的涂料组合物加热至熔融状态，并将熔融的不透明涂料组合物施加在底漆涂层上以形成覆盖表面上的有源电路的不透明涂层，以防止基于光学和辐射的检查和有源电路的逆向工程。

10. 发明申请

US20130235544A1 INTEGRATED CIRCUIT STACK 有权
标题翻译：集成电路堆栈
公开(公告)号：US20130235544A1
公开(公告)日：2013-09-12
申请号：US13416404
申请日：2012-03-09
申请人： James L. Tucker , Gary Roosevelt , Kenneth H. Heffner , James Hobbs
发明人： James L. Tucker , Gary Roosevelt , Kenneth H. Heffner , James Hobbs
IPC分类号： H05K1/18 , H05K3/36 , H05K1/11
CPC分类号： H01L23/481 , H01L23/49833 , H01L23/585 , H01L2224/16225 , H01L2224/73253 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , Y10T29/49126 , H01L2924/00
摘要： In some examples, an integrated circuit system includes a plurality of integrated circuit layers. At least one of the integrated circuit layers includes an integrated circuit die, which may not include any through-silicon vias that provide a pathway to an adjacent integrated circuit layer, and an interposer portion, which includes electrically conductive through-vias. The interposer portion may facilitate communication of the integrated circuit die with other integrated circuit layers of the integrated circuit system. In some examples, the stacked integrated circuit system may include more than one integrated circuit die, which may be in the same integrated circuit layer as at least one other integrated circuit die, or may be in a different integrated circuit layer.
摘要翻译：在一些示例中，集成电路系统包括多个集成电路层。集成电路层中的至少一个包括集成电路管芯，其可以不包括提供到相邻集成电路层的通路的任何穿硅通孔，以及包括导电通孔的插入器部分。插入器部分可以促进集成电路管芯与集成电路系统的其它集成电路层的通信。在一些示例中，堆叠集成电路系统可以包括多于一个集成电路管芯，其可以与至少一个其它集成电路管芯在同一集成电路层中，或者可以在不同的集成电路层中。

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