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1. 发明授权

US06774475B2 Vertically stacked memory chips in FBGA packages 失效
标题翻译： FBGA封装中垂直堆叠的存储芯片
公开(公告)号：US06774475B2
公开(公告)日：2004-08-10
申请号：US10056256
申请日：2002-01-24
申请人： Edmund D. Blackshear , William F. Beausoleil , N. James Tomassetti
发明人： Edmund D. Blackshear , William F. Beausoleil , N. James Tomassetti
IPC分类号： H01L2302
CPC分类号： G11C5/04 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2225/1005 , H01L2225/107 , H01L2225/1094 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H05K1/144 , H01L2924/00 , H01L2924/00012
摘要： A method and structure for a memory structure that includes a plurality of substrates stacked one on another is disclosed. The invention includes a plurality of connectors connecting the substrates to one another and a plurality of memory chip packages mounted on the substrates. The connectors have a size sufficient to form a gap between the substrates. The gap is larger than a height of the memory chip packages.
摘要翻译：公开了一种包括多个彼此层叠的基板的存储器结构的方法和结构。本发明包括将基板彼此连接的多个连接器和安装在基板上的多个存储芯片封装。连接器具有足以在基板之间形成间隙的尺寸。该间隙大于存储芯片封装的高度。

2. 发明授权

US06469375B2 High bandwidth 3D memory packaging technique 失效
标题翻译：高带宽3D内存封装技术
公开(公告)号：US06469375B2
公开(公告)日：2002-10-22
申请号：US09796055
申请日：2001-02-28
申请人： William F. Beausoleil , Edmund D. Blackshear , Michael J. Ellsworth, Jr. , William F. Shutler , Norton J. Tomassetti
发明人： William F. Beausoleil , Edmund D. Blackshear , Michael J. Ellsworth, Jr. , William F. Shutler , Norton J. Tomassetti
IPC分类号： H01L2302
CPC分类号： H01L23/5385 , H01L23/5384 , H01L25/0652 , H01L2924/0002 , H01L2924/00
摘要： A three-dimensional memory module in a repetitively used pedestal connector provides signal paths unique and common to the module at its level and signal paths from the level below unique to and common to modules at levels above. In order to provide a unique signal path from a substrate to each memory module, while using identical pedestal connectors at each level, signal lines are skewed from where they enter the bottom surface of the pedestal connector to where they exit the top surface. For example, each input in a line of inputs is connected to a matching line of outputs, but with a shift of one position between input and output.
摘要翻译：重复使用的基座连接器中的三维存储器模块提供了模块在其级别上独特且通用的信号路径，以及从级别以下的模块的独特级别和通用级别的信号路径。为了提供从衬底到每个存储器模块的独特的信号路径，同时在每个级别使用相同的基座连接器，信号线从它们进入基座连接器的底表面到它们离开顶表面的地方偏斜。例如，一行输入中的每个输入连接到匹配的输出行，但是在输入和输出之间移动一个位置。

3. 发明申请

US20130320578A1 METHOD FOR SHAPING A LAMINATE SUBSTRATE 有权
标题翻译：形成层压基板的方法
公开(公告)号：US20130320578A1
公开(公告)日：2013-12-05
申请号：US13488685
申请日：2012-06-05
申请人： Edmund D. Blackshear
发明人： Edmund D. Blackshear
IPC分类号： B29C51/46
CPC分类号： H01L21/4803 , H01L21/6835 , H01L24/81 , H01L2221/68345 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81192 , H01L2924/3511 , H01L2924/014
摘要： A method for shaping a laminate substrate includes characterizing the laminate substrate for warpage characteristics over a range of temperatures. The laminate substrate is placed into a shaping fixture with any necessary correction to obtain a flat laminate substrate chip site area at a chip join temperature. The laminate substrate is shaped at a temperature greater than or equal to a maximum laminate substrate fabrication temperature. The shape of the laminate substrate is retained when it is removed from the shaping fixture.
摘要翻译：层压基板的成型方法包括在温度范围内表征层叠基板的翘曲特性。将层压基板放置在具有任何必要校正的成型夹具中，以在芯片连接温度下获得平坦的层叠基板芯片位置面积。层压基板在大于或等于最大叠层基板制造温度的温度下成形。当从成形夹具中取出时，保持层压基板的形状。

4. 发明申请

US20100164030A1 CHIP CARRIER BEARING LARGE SILICON FOR HIGH PERFORMANCE COMPUTING AND RELATED METHOD 审中-公开
标题翻译：用于高性能计算的芯片承载大尺寸硅和相关方法
公开(公告)号：US20100164030A1
公开(公告)日：2010-07-01
申请号：US12347490
申请日：2008-12-31
申请人： Stefano S. Oggioni , Edmund D. Blackshear , Claudius Feger
发明人： Stefano S. Oggioni , Edmund D. Blackshear , Claudius Feger
IPC分类号： H01L23/08 , H01L31/0232 , H01L21/71
CPC分类号： H01L23/145 , H01L21/563 , H01L23/3121 , H01L23/49827 , H01L23/49894 , H01L2224/73204 , H01L2924/01019 , H01L2924/10253 , H01L2924/15311 , H01L2924/00
摘要： Embodiments of the present invention provide a system and method for manufacturing integrated circuit (IC) chip packages. In one embodiment, the integrated circuit (IC) chip package can include an IC chip and a substrate coupled to the IC chip. The substrate can include a glass fiber re-enforced epoxy core, a plurality copper circuitry containing particle re-enforced epoxy layers symmetrically-oriented to each surface of the glass fiber re-enforced epoxy core, and an outermost amorphous glass layer on each surface of the plurality of layers. The IC chip can be coupled to copper circuitry bonded to one of the outermost amorphous glass layers.
摘要翻译：本发明的实施例提供一种用于制造集成电路（IC）芯片封装的系统和方法。在一个实施例中，集成电路（IC）芯片封装可以包括IC芯片和耦合到IC芯片的衬底。基板可以包括玻璃纤维再强化的环氧树脂芯，多个铜电路，其包含对称地定向到玻璃纤维再强化环氧树脂芯的每个表面的颗粒再强化的环氧树脂层，以及每个表面上的最外面的非晶玻璃层多层。 IC芯片可以耦合到结合到最外面的非晶玻璃层之一的铜电路。

5. 发明授权

US06312972B1 Pre-bond encapsulation of area array terminated chip and wafer scale packages 有权
标题翻译：区域阵列封装芯片和晶片级封装的预绑定封装
公开(公告)号：US06312972B1
公开(公告)日：2001-11-06
申请号：US09370732
申请日：1999-08-09
申请人： Edmund D. Blackshear
发明人： Edmund D. Blackshear
IPC分类号： H01L2144
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/5389 , H01L24/96 , H01L2224/04105 , H01L2224/32225 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/14 , H01L2924/15311 , H01L2924/18162 , H01L2924/3025 , H01L2924/351 , H01L2924/00
摘要： A method of packaging an integrated circuit chip wherein the chip is encapsulated prior to mechanical bonding to a packaging substrate.
摘要翻译：一种封装集成电路芯片的方法，其中芯片在机械结合到封装衬底之前被封装。

6. 发明申请

US20130323345A1 FIXTURE FOR SHAPING A LAMINATE SUBSTRATE 有权
标题翻译：用于形成层压基板的形状
公开(公告)号：US20130323345A1
公开(公告)日：2013-12-05
申请号：US13488693
申请日：2012-06-05
申请人： Edmund D. Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
发明人： Edmund D. Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
IPC分类号： B29C53/18
CPC分类号： H01L24/75 , H01L23/562 , H01L24/81 , H01L2224/16 , H01L2224/75983 , H01L2224/75987 , H01L2224/81024 , H01L2224/81075 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81912 , H01L2224/83192 , H01L2924/10253 , H01L2924/3511 , H01L2924/00 , H01L2924/00014
摘要： A fixture for shaping a laminate substrate includes a trap ring, a base plate and a center button. The base plate includes a recess adapted to receive the laminate substrate. The center button is disposed in an opening in the base plate. The center button may be adjusted to shape the laminate substrate.
摘要翻译：用于成型层压基板的固定装置包括捕获环，基板和中心按钮。基板包括适于接收层压基板的凹部。中心按钮设置在基板的开口中。可以调节中心按钮以使层压基板成形。

7. 发明授权

US09129942B2 Method for shaping a laminate substrate 有权
标题翻译：层压基板成型方法
公开(公告)号：US09129942B2
公开(公告)日：2015-09-08
申请号：US13488685
申请日：2012-06-05
申请人： Edmund D. Blackshear
发明人： Edmund D. Blackshear
IPC分类号： B29C51/46 , H01L21/48 , H01L21/683 , H01L23/00
CPC分类号： H01L21/4803 , H01L21/6835 , H01L24/81 , H01L2221/68345 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81192 , H01L2924/3511 , H01L2924/014
摘要： A method for shaping a laminate substrate includes characterizing the laminate substrate for warpage characteristics over a range of temperatures. The laminate substrate is placed into a shaping fixture with any necessary correction to obtain a flat laminate substrate chip site area at a chip join temperature. The laminate substrate is shaped at a temperature greater than or equal to a maximum laminate substrate fabrication temperature. The shape of the laminate substrate is retained when it is removed from the shaping fixture.
摘要翻译：层压基板的成型方法包括在温度范围内表征层叠基板的翘曲特性。将层压基板放置在具有任何必要校正的成型夹具中，以在芯片连接温度下获得平坦的层叠基板芯片位置面积。层压基板在大于或等于最大叠层基板制造温度的温度下成形。当从成形夹具中取出时，保持层压基板的形状。

8. 发明授权

US09059240B2 Fixture for shaping a laminate substrate 有权
标题翻译：用于成型层压基板的夹具
公开(公告)号：US09059240B2
公开(公告)日：2015-06-16
申请号：US13488693
申请日：2012-06-05
申请人： Edmund D. Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
发明人： Edmund D. Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
IPC分类号： B29C53/18 , H01L23/00
CPC分类号： H01L24/75 , H01L23/562 , H01L24/81 , H01L2224/16 , H01L2224/75983 , H01L2224/75987 , H01L2224/81024 , H01L2224/81075 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81912 , H01L2224/83192 , H01L2924/10253 , H01L2924/3511 , H01L2924/00 , H01L2924/00014
摘要： A fixture for shaping a laminate substrate includes a trap ring, a base plate and a center button. The base plate includes a recess adapted to receive the laminate substrate. The center button is disposed in an opening in the base plate. The center button may be adjusted to shape the laminate substrate.
摘要翻译：用于成型层压基板的固定装置包括捕获环，基板和中心按钮。基板包括适于接收层压基板的凹部。中心按钮设置在基板的开口中。可以调节中心按钮以使层压基板成形。

9. 发明授权

US06507122B2 Pre-bond encapsulation of area array terminated chip and wafer scale packages 有权
标题翻译：区域阵列封装芯片和晶片级封装的预绑定封装
公开(公告)号：US06507122B2
公开(公告)日：2003-01-14
申请号：US09906314
申请日：2001-07-16
申请人： Edmund D. Blackshear
发明人： Edmund D. Blackshear
IPC分类号： H01L2144
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/5389 , H01L24/96 , H01L2224/04105 , H01L2224/32225 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/14 , H01L2924/15311 , H01L2924/18162 , H01L2924/3025 , H01L2924/351 , H01L2924/00
摘要： An integrated circuit chip package wherein the chip is encapsulated prior to mechanical bonding to a packaging substrate. The package provides a continuous adhesive interface between the encapsulated chip and surrounding encapsulant, and the substrate. This structure eliminates discontinuities in flatness and their associated stress states resulting in more reliable package contacts.
摘要翻译：一种集成电路芯片封装，其中芯片在机械结合到封装基板之前被封装。该封装在封装的芯片和周围的密封剂之间提供连续的粘合界面和基底。这种结构消除了平面度的不连续性及其相关的应力状态，导致更可靠的封装接触。

10. 发明授权

US5095699A Stirling type cylinder force amplifier 失效
标题翻译：斯特林型气缸力放大器
公开(公告)号：US5095699A
公开(公告)日：1992-03-17
申请号：US694743
申请日：1991-05-02
申请人： Edmund D. Blackshear
发明人： Edmund D. Blackshear
IPC分类号： F02G1/043
CPC分类号： F02G1/0435 , F02G2253/02
摘要： A mechanical force amplifier is disclosed including a gas-containing cylinder having one fixed end and one movable end determined by the position of an output power piston. A cold temperature zone and a hot temperature zone are maintained along the axis of the cylinder, the cold zone being adjacent the fixed end and the hot zone being adjacent the movable end. The power piston is resiliently urged toward the fixed end so as to compress the gas.A displacement piston is positionable along the axis of the cylinder within the cold zone and the hot zone and is designed to allow the gas to flow around it as the piston is moved. The displacement piston and the power piston are completely uncoupled from movement with each other except through the gas.
摘要翻译：公开了一种机械力放大器，其包括具有一个固定端的气体容纳气缸和由输出动力活塞的位置确定的一个可动端。沿着气缸的轴线保持冷的温度区域和热的温度区域，冷区域邻近固定端部并且热区域邻近活动端部。动力活塞朝向固定端弹性地推压以压缩气体。位移活塞可以在冷区和热区内沿气缸的轴线定位，并被设计成允许气体随着活塞的移动而流过其周围。位移活塞和动力活塞完全脱离了彼此运动，除了通过气体。

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