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1. 发明授权

US10401285B2 Apparatus for measuring surface properties of polishing pad 有权
公开(公告)号：US10401285B2
公开(公告)日：2019-09-03
申请号：US14024405
申请日：2013-09-11
申请人： EBARA CORPORATION , Kyushu Institute of Technology
发明人： Hisanori Matsuo , Keiichi Kimura , Keisuke Suzuki , Panart Khajornrungruang , Takashi Kushida
IPC分类号： G01B11/30 , G01N21/47 , B24B37/005
摘要： The present invention relates to an apparatus for measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The apparatus for measuring surface properties of a polishing pad includes a laser beam source configured to emit a laser beam, and a photodetector configured to detect scattered light that is reflected and scattered by the polishing pad, an optical Fourier transform being performed on the detected scattered light to produce an intensity distribution corresponding to a spatial wavelength spectrum based on surface topography of the polishing pad. The laser beam is applied to the polishing pad at such an incident angle that the laser beam does not reach a bottom portion of a pore formed in the surface of the polishing pad.

2. 发明授权

US10478936B2 Method and apparatus for measuring surface properties of polishing pad 有权
公开(公告)号：US10478936B2
公开(公告)日：2019-11-19
申请号：US14974898
申请日：2015-12-18
申请人： EBARA CORPORATION , Kyushu Institute of Technology
发明人： Hisanori Matsuo , Yoshihiro Mochizuki , Keisuke Suzuki , Takahiro Tajiri , Panart Khajornrungruang
IPC分类号： B24B37/005 , B24B49/12 , G01N21/55 , G01N21/47
摘要： A polishing pad surface property measuring method which can measure surface properties of a polishing pad that reflect CMP performance by applying a laser beam to the polishing pad at a plurality of incident angles is disclosed. The method includes applying a laser beam to a surface of the polishing pad, and receiving light reflected by the surface of the polishing pad and performing Fourier transform on the received light to determine surface properties of the polishing pad. The laser beam is applied to the polishing pad at a plurality of incident angles.

3. 发明授权

US09669515B2 Polishing apparatus 有权
公开(公告)号：US09669515B2
公开(公告)日：2017-06-06
申请号：US14645372
申请日：2015-03-11
申请人： EBARA CORPORATION , Kyushu Institute of Technology
发明人： Hisanori Matsuo , Yoshihiro Mochizuki , Keisuke Suzuki , Takahiro Tajiri , Souichirou Ichioka
IPC分类号： H01L21/00 , B24B49/12 , B24B53/017 , H01L21/321
CPC分类号： B24B49/12 , B24B53/017 , H01L21/3212
摘要： A polishing apparatus having a polishing pad surface property measuring device that is capable of measuring surface properties of a polishing pad in a state where a liquid film exists on the polishing pad is disclosed. The polishing apparatus includes a dam configured to dam a liquid on the polishing pad to form a liquid film having a thickness equal to or greater than a prescribed value in at least part of an area on the polishing pad, a light emitter having a light emission end disposed in the liquid film formed by the dam and configured to emit a laser beam onto the polishing pad, a light receiver disposed in the liquid film formed by the dam and configured to receive light scattered by and bounced off the polishing pad at a plurality of angles due to surface properties of the polishing pad after the laser beam is emitted from the light emitter, and a processor configured to perform Fourier transform on the light received by the light receiver into a predetermined wavelength corresponding to a reflection intensity distribution and to determine a feature quantity of the surface properties of the pad.

4. 发明授权

US08932883B2 Method of measuring surface properties of polishing pad 有权
标题翻译：测量抛光垫表面性能的方法
公开(公告)号：US08932883B2
公开(公告)日：2015-01-13
申请号：US14024373
申请日：2013-09-11
申请人： Ebara Corporation , Kyushu Institute of Technology
发明人： Hisanori Matsuo , Keiichi Kimura , Keisuke Suzuki , Panart Khajornrungruang , Takashi Kushida
IPC分类号： H01L21/00 , G01N21/47 , H01L21/306 , H01L21/66
CPC分类号： G01N21/4738 , B24B37/20 , B24B49/12 , H01L21/30625 , H01L22/10
摘要： The present invention relates to a method of measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The method of measuring surface properties of a polishing pad includes applying a laser beam to the polishing pad, detecting scattered light that is reflected and scattered by the polishing pad with a photodetector and performing an optical Fourier transform on the detected scattered light to produce an intensity distribution corresponding to a spatial wavelength spectrum based on surface topography of the polishing pad, and calculating a numerical value representing surface properties of the polishing pad based on the intensity distribution corresponding to two different prescribed spatial wavelength ranges.
摘要翻译：本发明涉及一种测量抛光垫的表面性质的方法，该抛光垫测量用于抛光诸如半导体晶片的衬底的抛光垫的表面形貌或表面状况等表面性质。测量抛光垫的表面特性的方法包括：将激光束施加到抛光垫上，用光电检测器检测由抛光垫反射和散射的散射光，并对检测到的散射光进行光学傅里叶变换，产生强度分布对应于基于抛光垫的表面形貌的空间波长光谱，并且基于对应于两个不同的规定空间波长范围的强度分布来计算表示抛光垫的表面性质的数值。

5. 发明授权

US10195712B2 Polishing method and polishing apparatus 有权
公开(公告)号：US10195712B2
公开(公告)日：2019-02-05
申请号：US15697047
申请日：2017-09-06
申请人： EBARA CORPORATION
发明人： Toru Maruyama , Hisanori Matsuo , Yasuyuki Motoshima
IPC分类号： B24B37/015 , B24B49/14 , B24B55/02 , G01J5/02 , G01J5/00
摘要： A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

6. 发明授权

US09242339B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US09242339B2
公开(公告)日：2016-01-26
申请号：US14203494
申请日：2014-03-10
申请人： EBARA CORPORATION
发明人： Hisanori Matsuo , Yoshihiro Mochizuki , Chikako Takatoh , Tadashi Obo
IPC分类号： B24B37/00 , B24B37/005 , B24B49/12 , B24B57/02
CPC分类号： B24B37/005 , B24B49/12 , B24B57/02
摘要： A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus includes a polishing liquid supply nozzle for supplying a polishing liquid onto the polishing pad, a polishing liquid storage mechanism disposed on the polishing pad for storing the polishing liquid on the polishing pad by damming the polishing liquid, and a polishing liquid sensor for measuring a physical quantity representing the freshness of the polishing liquid stored by the polishing liquid storage mechanism. The polishing apparatus further includes a freshness measuring instrument for calculating the freshness of the stored polishing liquid from the physical quantity measured by the polishing liquid sensor, and a freshness controller for controlling supply conditions of the polishing liquid or storage state of the polishing liquid, based on the freshness of the polishing liquid that is determined by the freshness measuring instrument.
摘要翻译：抛光装置通过将基板压靠在研磨台上的抛光垫上来抛光基板的表面。抛光装置包括：抛光液供给喷嘴，用于将抛光液体提供到抛光垫上;抛光液体存储机构，设置在抛光垫上，用于通过阻止抛光液将抛光液储存在抛光垫上;抛光液体传感器，测量表示由研磨液储存机构储存的研磨液的新鲜度的物理量。抛光装置还包括：新鲜度测量装置，用于根据由抛光液体传感器测量的物理量计算储存的抛光液的新鲜度;以及新鲜度控制器，用于控制抛光液的供应条件或抛光液的储存状态在由新鲜度测量仪器确定的抛光液的新鲜度上。

7. 发明授权

US11897080B2 Polishing apparatus 有权
公开(公告)号：US11897080B2
公开(公告)日：2024-02-13
申请号：US17065787
申请日：2020-10-08
申请人： EBARA CORPORATION
发明人： Masashi Kabasawa , Yasuyuki Motoshima , Hisanori Matsuo , Keisuke Kamiki
IPC分类号： B24B37/015 , B24B37/20 , B24B37/013
CPC分类号： B24B37/015 , B24B37/013 , B24B37/20
摘要： There is disclosed a polishing apparatus which can regulate a surface temperature of the polishing pad without causing a defect such as a scratch on a substrate such as a wafer. The polishing apparatus includes: a non-contact type pad-temperature regulating device; a pad-temperature measuring device. The pad-temperature measuring device is arranged adjacent to the pad-temperature regulating device and on a downstream side of the pad-temperature regulating device in a rotation direction of a polishing table.

8. 发明授权

US10369675B2 CMP apparatus having polishing pad surface property measuring device 有权
公开(公告)号：US10369675B2
公开(公告)日：2019-08-06
申请号：US15541456
申请日：2016-01-07
申请人： EBARA CORPORATION
发明人： Hisanori Matsuo
IPC分类号： B24B37/00 , B24B37/04 , B24B49/12 , B24B49/18 , B24B53/00 , B24B53/02 , B24B37/005 , B24B53/017
摘要： The present invention relates to a CMP apparatus having a polishing pad surface property measuring device for measuring surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The CMP apparatus includes a polishing pad surface property measuring device (30) configured to apply a laser beam to a surface of a polishing pad (2) and to receive reflected light from the polishing pad to obtain reflection intensity in each reflection angle, a processor (40) configured to perform a Fourier transform on a reflection intensity distribution obtained by the measuring device to obtain a spatial wavelength spectrum of the surface of the polishing pad and to obtain surface properties of the polishing pad by numerical analysis, a dressing control unit (23) configured to determine dressing conditions of the polishing pad (2) by a closed loop control based on the surface properties of the polishing pad obtained by the processor, and a dressing apparatus (20) configured to dress the polishing pad based on the dressing conditions determined by the dressing control unit.

9. 发明授权

US09782870B2 Polishing method and polishing apparatus 有权
公开(公告)号：US09782870B2
公开(公告)日：2017-10-10
申请号：US14465792
申请日：2014-08-21
申请人： EBARA CORPORATION
发明人： Toru Maruyama , Hisanori Matsuo , Yasuyuki Motoshima
IPC分类号： B24B37/015 , B24B49/14 , G01J5/02 , G01J5/00
CPC分类号： B24B37/015 , B24B49/14 , B24B55/02 , G01J5/025 , G01J2005/0085
摘要： A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

10. 发明授权

US11926018B2 Apparatus for polishing and method of polishing 有权
公开(公告)号：US11926018B2
公开(公告)日：2024-03-12
申请号：US17314573
申请日：2021-05-07
申请人： EBARA CORPORATION
发明人： Masayoshi Ito , Hisanori Matsuo , Itsuki Kobata , Takuya Moriura
IPC分类号： B24B57/02 , B24B37/005 , B24B37/04 , B24B37/10 , B24B37/32
CPC分类号： B24B57/02 , B24B37/005 , B24B37/042 , B24B37/107 , B24B37/32
摘要： There is provided an apparatus for polishing, comprising a polishing table configured to support and rotate a polishing pad; a holder configured to hold an object and press the object against the polishing pad; a polishing solution supply device provided with a contact member and configured to supply a polishing solution to an opening in a bottom face of the contact member in a state that the contact member comes into contact with or is adjacent to the polishing pad, thereby spreading the polishing solution on the polishing pad, the polishing solution supply device causing at least part of used polishing solution returned by rotation of the polishing pad to be dammed up by the contact member and setting the contact member either in a direction of keeping the dammed up polishing solution on the polishing pad or in a direction of discharging the dammed up polishing solution, according to an angle of the polishing solution supply device with respect to a radial direction of the polishing pad; an arm linked with the polishing solution supply device; a rotating mechanism configured to rotate the polishing solution supply device with respect to the arm; and a controller configured to control the rotating mechanism to change the angle of the polishing solution supply device with respect to the radial direction of the polishing pad and thereby control a discharge amount of the polishing solution by the contact member of the polishing solution supply device.

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