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1. 发明申请

US20210129398A1 MATERIAL COMPOSITES 有权
公开(公告)号：US20210129398A1
公开(公告)日：2021-05-06
申请号：US17084438
申请日：2020-10-29
申请人： EMS-Chemie AG
发明人： Etienne AEPLI , Botho HOFFMANN
IPC分类号： B29C45/14 , B29C45/00
摘要： A composite containing directly adjoining and firmly bonded sections (I) and (II) of the following type: (I) section, formed from a thermoplastic moulding compound FM-1 containing at least one polyamide (A) and optionally fillers and reinforcing materials (C) and additives (D); (II) section, formed from a thermoplastic moulding compound containing at least one olefinic and/or vinyl aromatic polymer (E) and optionally fillers and reinforcing agents (F), plasticisers (G) and additives (H); wherein the moulding compound FM-1 or FM-2 contains 0.1 to 5.0 percent by weight of polyethyleneimine (B) or a copolymer or derivative thereof and a method for producing such composites.

2. 发明公开

US20240010836A1 POLYAMIDE PARTS WITH LOW FUEL PERMEATION 审中-公开
公开(公告)号：US20240010836A1
公开(公告)日：2024-01-11
申请号：US18345735
申请日：2023-06-30
申请人： Ems-Chemie AG
发明人： Doris ABT , Botho HOFFMANN
IPC分类号： C08L77/02 , C08K5/00 , C08K7/14 , C08J5/04 , C08J5/10 , F02M37/00
CPC分类号： C08L77/02 , C08K5/005 , C08K7/14 , C08J5/043 , C08J5/10 , F02M37/0017 , C08L2201/08 , C08L2203/30 , C08K2201/004 , C08J2377/02 , C08J2477/06
摘要： Use of a part comprising at least a portion of a polyamide moulding composition said portion for direct contact with fuel,
wherein the polyamide moulding composition consists of the following components in the following proportions:

(A) 30-90% by weight of at least one polyamide;
(B) 10-70% by weight of fibers with non-circular cross-section;
(C) 0-10% by weight of at least one stabiliser;
(D) 0-10% by weight of additives different from (B) and (C),

wherein the sum of (A)-(D) makes up 100% of the portion.

3. 发明申请

US20210395517A1 POLYAMIDE MOLDING COMPOUND WITH LOW DIELECTRIC LOSS FACTOR 有权
公开(公告)号：US20210395517A1
公开(公告)日：2021-12-23
申请号：US17348481
申请日：2021-06-15
申请人： EMS-CHEMIE AG
发明人： Doris ABT , Georg STOEPPELMANN , Botho HOFFMANN
IPC分类号： C08L71/12
摘要： The present invention relates to a thermoplastic molding composition comprising: A mixture of at least one polyamide A1, at least one polyphenylene ether A2 and optionally a compatibilizer A3 and optionally an olefinic and/or vinylaromatic polymer A4; B 10 to 60% by weight of glass filler, the glass composition of which comprises at least 10% by weight of boron oxide and at most 15% by weight for the sum of magnesium oxide and calcium oxide; C 1 to 8% by weight of LDS additive; D 0 to 5% by weight of additives other than components A, B and C; wherein 80 to 100% by weight of mixture A consists of a mixture M of components A1, A2 and A3 and 0 to 20% by weight of component A4, in each case based on the sum of components M and A4, and wherein the sum of components M and A4 gives 100% by weight of mixture A, and wherein 36 to 92% by weight of mixture M is of component A2, from 8 to 60% by weight of component A1 and from 0 to 4% by weight of component A3, based in each case on the sum of components A1 to A3, and the sum of components A1 to A3 being 100% by weight of the mixture M, and the sum of components A to D being 100% by weight of the molding composition.

4. 发明公开

US20230312922A1 POLYAMIDE MOLDING MATERIAL WITH HIGH FRACTURE STRENGTH AND MOLDED PARTS PRODUCED THEREFROM 审中-公开
公开(公告)号：US20230312922A1
公开(公告)日：2023-10-05
申请号：US18191076
申请日：2023-03-28
申请人： EMS-CHEMIE AG
发明人： Etienne AEPLI , Botho HOFFMANN
IPC分类号： C08L77/06 , C08L77/02 , C08K13/02
CPC分类号： C08L77/06 , C08L77/02 , C08K13/02 , C08L2205/025 , C08K5/0041
摘要： The present invention relates to a polyamide molding material with high fracture energy and molded parts produced therefrom which are particularly suitable for visible parts for automotive parts or for electronic devices. The polyamide molding material has, in addition to excellent fracture energy, a likewise excellent piano lacquer finish and a high rubbing resistance.

5. 发明申请

US20220195186A1 FILLED POLYAMIDE MOULDING COMPOUNDS, MOULDED ARTICLES PRODUCED THEREFROM, AND USE OF THE FILLED POLYAMIDE MOULDING COMPOUNDS 有权
公开(公告)号：US20220195186A1
公开(公告)日：2022-06-23
申请号：US17551371
申请日：2021-12-15
申请人： EMS-CHEMIE AG
发明人： Arda ALKAN , Andri CADALBERT , Andreas BAYER , Botho HOFFMANN
IPC分类号： C08L77/06
摘要： The present invention relates to filled polyamide moulding compounds with a high heat-ageing resistance which, besides a specific polyamide mixture, also comprise at least one filler, at least one unsubstituted or substituted metallocene and optionally at least one additive. The invention also relates to the use of these polyamide moulding compounds to produce moulded articles.

6. 发明申请

US20210189125A1 POLYAMIDE MOLDING COMPOUNDS FOR APPLICATIONS RESISTANT TO HYPOCHLORITE 有权
公开(公告)号：US20210189125A1
公开(公告)日：2021-06-24
申请号：US17129507
申请日：2020-12-21
申请人： EMS-CHEMIE AG
发明人： Arda ALKAN , Thomas WIEDEMANN , Andri CADALBERT , Manfred HEWEL , Botho HOFFMANN
IPC分类号： C08L77/08 , C08K7/14 , C08K5/134
摘要： The present invention relates to the use of a polyamide molding compound for application purposes in which a high resistance to hypochlorous acid is decisive. The molding compound is thus used in accordance with the invention for molds that are suitable for contact with aqueous solutions containing hypochlorous acid.

7. 发明申请

US20210189124A1 POLYAMIDE MOLDING COMPOUNDS FOR HYPOCHLORITE-RESISTANT APPLICATIONS 有权
公开(公告)号：US20210189124A1
公开(公告)日：2021-06-24
申请号：US17129606
申请日：2020-12-21
申请人： EMS-CHEMIE AG
发明人： Arda ALKAN , Thomas WIEDEMANN , Andri CADALBERT , Manfred HEWEL , Botho HOFFMANN
IPC分类号： C08L77/06
摘要： The present invention relates to the use of a polyamide molding compound for application purposes in which high resistance to hypochlorous acid is crucial. The molding compound is thus used according to the invention for molded bodies suitable for being in contact with aqueous, hypochlorous acid-containing solutions.

8. 发明申请

US20220204764A1 POLYAMIDE COMPOUNDS, MOLDS PRODUCED THEREFROM AND USE OF THE POLYAMIDE COMPOUNDS 有权
公开(公告)号：US20220204764A1
公开(公告)日：2022-06-30
申请号：US17551547
申请日：2021-12-15
申请人： EMS-CHEMIE AG
发明人： Arda ALKAN , Andri CADALBERT , Andreas BAYER , Botho HOFFMANN
IPC分类号： C08L77/06 , C08G69/26
摘要： The present invention relates to polyamide compounds having high heat aging resistance which, in addition to a specific polyamide, comprise at least one unsubstituted or substituted metallocene, optionally at least one impact modifier and optionally at least one additive. The invention also relates to the use of said polyamide compounds for the production of molds.

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