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1. 发明申请

US20150290766A1 SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工设备
公开(公告)号：US20150290766A1
公开(公告)日：2015-10-15
申请号：US14682661
申请日：2015-04-09
申请人： Ebara Corporation
发明人： Mitsunori SUGIYAMA , Masafumi INOUE
IPC分类号： B24B53/007
CPC分类号： B24B53/007
摘要： The CMP apparatus is provided with a polishing unit 3; a cleaning unit 4; a load/unload unit for transferring substrates to the polishing unit 3 and receiving substrates from the cleaning unit 4; a wafer transporting unit; and a control section 5 for controlling the timing of loading wafers into the CMP apparatus. The control section 5 creates a time table correlating treatment ending times or scheduled treatment ending times in polishing sections, cleaning sections and transporting sections for each plurality of wafers to be loaded into the CMP apparatus and controls the timing of loading the plurality of wafers into the CMP apparatus on the basis of the time table, so that a standby state does not occur in a period from when the wafers are loaded into the CMP apparatus to when cleaning treatment is completed.
摘要翻译： CMP装置设置有抛光单元3; 清洁单元4; 用于将基板传送到抛光单元3并从清洁单元4接收基板的装载/卸载单元; 晶片输送单元; 以及控制部分5，用于控制将晶片装载到CMP装置中的定时。控制部分5创建将要装载到CMP装置中的每个多个晶片的抛光部分，清洁部分和传送部分中的处理结束时间或预定处理结束时间相关联的时间表，并且控制将多个晶片装载到 CMP装置，使得在将晶片装载到CMP装置中到清洁处理完成之间的时间段内不发生待机状态。

2. 发明申请

US20150198947A1 FAILURE DETECTION APPARATUS FOR SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工设备故障检测装置及基板处理装置
公开(公告)号：US20150198947A1
公开(公告)日：2015-07-16
申请号：US14597214
申请日：2015-01-14
申请人： EBARA CORPORATION
发明人： Mitsunori SUGIYAMA , Masafumi INOUE
IPC分类号： G05B19/418
CPC分类号： G05B19/41875 , G05B23/0235 , G05B2219/31443 , G05B2219/45031
摘要： The present invention improves the accuracy of detecting abnormality in a substrate processing apparatus. A failure detection apparatus 520 is provided with a data acquisition part 522 used to collect data detected by sensors 270-1 to 270-a, 370-1 to 370-b and 470-1 to 470-c disposed in a CMP apparatus. In addition, the failure detection apparatus 520 is provided with a determination part 524 used to read recipe data from a recipe storage part 512, to compare the recipe data thus read with the data collected by a data acquisition part 522, thereby determining that abnormality is present in the CMP apparatus if the two data items differ.
摘要翻译：本发明提高了检测基板处理装置的异常的精度。故障检测装置520具备数据采集部522，用于收集设置在CMP装置中的传感器270-1〜270-a，370-1〜370-b，470-1〜470-c检测到的数据。此外，故障检测装置520具有用于从配方存储部512读取配方数据的判定部524，将由此读取的配方数据与由数据获取部522收集的数据进行比较，从而确定异常为如果两个数据项不同，则存在于CMP装置中。

3. 发明申请

US20190118332A1 POLISHING APPARATUS AND POLISHING METHOD 审中-公开
公开(公告)号：US20190118332A1
公开(公告)日：2019-04-25
申请号：US16162914
申请日：2018-10-17
申请人： EBARA CORPORATION
发明人： Mitsunori SUGIYAMA , Taro TAKAHASHI , Yoichi KOBAYASHI
IPC分类号： B24B37/013 , B24B37/12 , B24B49/12 , B24B57/02
摘要： A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An end point detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance.

4. 发明申请

US20150192921A1 CONTROL DEVICE FOR SUBSTRATE TREATMENT APPARATUS, SUBSTRATE TREATMENT APPARATUS, AND DISPLAY CONTROL DEVICE 有权
标题翻译：用于基板处理装置的控制装置，基板处理装置和显示控制装置
公开(公告)号：US20150192921A1
公开(公告)日：2015-07-09
申请号：US14590931
申请日：2015-01-06
申请人： EBARA CORPORATION
发明人： Mitsunori SUGIYAMA
IPC分类号： G05B19/418
CPC分类号： G05B19/418 , G05B2219/45031 , Y02P90/02
摘要： The present invention efficiently executes a plurality of functions of a substrate treatment apparatus. A control device 5 includes: a plurality of software applications (interface-related APSW 510 and control-related APSW 520) configured to execute each function of treatments concerning a CMP apparatus; and a shared memory 540 which stores information that is used in the plurality of software applications therein. The plurality of software applications include a task monitoring software application 530 which monitors whether abnormality has occurred in the plurality of software applications or not. The task monitoring software application 530 restarts the software application in which the abnormality has occurred, when the abnormality has occurred in any of the plurality of software applications, and makes the other software applications continue the respective processes.
摘要翻译：本发明有效地执行基板处理装置的多个功能。控制装置5包括：多个软件应用程序（接口相关的APSW 510和控制相关的APSW 520），被配置为执行关于CMP装置的各种处理功能; 以及共享存储器540，其存储在其中的多个软件应用中使用的信息。多个软件应用程序包括监视多个软件应用程序中是否发生异常的任务监视软件应用程序530。任务监视软件应用程序530在多个软件应用中的任何一个中发生异常时，重新开始发生异常的软件应用程序，并使其他软件应用程序继续进行各自的处理。

5. 发明申请

US20190171193A1 DESIGN METHOD OF SEMICONDUCTOR MANUFACTURING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM STORING A PROGRAM OF CAUSING COMPUTER TO EXECUTE DESIGN METHOD OF SEMICONDUCTOR MANUFACTURING APPARATUS 审中-公开
公开(公告)号：US20190171193A1
公开(公告)日：2019-06-06
申请号：US16207678
申请日：2018-12-03
申请人： Ebara Corporation
发明人： Ryuichiro MITANI , Mitsunori SUGIYAMA , Akihiko OGAWA
IPC分类号： G05B19/418 , G06F17/50
摘要： A design method of a semiconductor manufacturing apparatus which can satisfy a specification required by a user is disclosed. The design method of the semiconductor manufacturing apparatus includes creating a program setting file; creating a program installer from the program setting file; operating a processing unit of the semiconductor manufacturing apparatus; specifying a sensor corresponding to the processing unit based on the operation of the processing unit; creating a sensor setting file storing information obtained by specifying the sensor; comparing a content of a requirement specification and a content of the sensor setting file to confirm a consistency between the content of the requirement specification and the content of the sensor setting file; and introducing a program into a memory of a controller by the program installer when the content of the requirement specification and the content of the sensor setting file are consistent with each other.

6. 发明申请

US20180129189A1 CONTROL DEVICE FOR SUBSTRATE TREATMENT APPARATUS, SUBSTRATE TREATMENT APPARATUS, AND DISPLAY CONTROL DEVICE 审中-公开
公开(公告)号：US20180129189A1
公开(公告)日：2018-05-10
申请号：US15863569
申请日：2018-01-05
申请人： EBARA CORPORATION
发明人： Mitsunori SUGIYAMA
IPC分类号： G05B19/418
CPC分类号： G05B19/418 , G05B2219/45031 , Y02P90/02
摘要： The present invention efficiently executes a plurality of functions of a substrate treatment apparatus. A control device 5 includes: a plurality of software applications (interface-related APSW 510 and control-related APSW 520) configured to execute each function of treatments concerning a CMP apparatus; and a shared memory 540 which stores information that is used in the plurality of software applications therein. The plurality of software applications include a task monitoring software application 530 which monitors whether abnormality has occurred in the plurality of software applications or not. The task monitoring software application 530 restarts the software application in which the abnormality has occurred, when the abnormality has occurred in any of the plurality of software applications, and makes the other software applications continue the respective processes.

7. 发明申请

US20150290767A1 SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：基板加工设备
公开(公告)号：US20150290767A1
公开(公告)日：2015-10-15
申请号：US14682774
申请日：2015-04-09
申请人： Ebara Corporation
发明人： Mitsunori SUGIYAMA , Kunimasa MATSUSHITA
IPC分类号： B24B53/007
CPC分类号： B24B53/007 , B24B27/0023 , B24B27/0069 , B24B27/0076 , B24B49/00 , B24B51/00 , H01L21/67219
摘要： A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to the polishing section or the cleaning section to which the test mode is set.
摘要翻译： CMP装置包括抛光单元3，清洁单元4，装载/卸载单元2，传送单元和被配置为控制传送单元中的基板的传送的控制部5。当抛光单元包括多个抛光部分时，或者清洁单元包括多个清洁部分时，控制部分5可以设置操作抛光部分或清洁部分的测试模式以进行一些多次抛光部分或多个清洁部分中的一些使得将基板转移到未设置测试模式的抛光部分或清洁部分，并且使得与基板相对于抛光部分的不同的测试基板或清洁测试模式设置的部分。

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