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1. 发明授权

US09216442B2 Gas-liquid separator and polishing apparatus 有权
标题翻译：气液分离器和抛光装置
公开(公告)号：US09216442B2
公开(公告)日：2015-12-22
申请号：US13789733
申请日：2013-03-08
申请人： EBARA CORPORATION
发明人： Hideo Aizawa , Tadakazu Sone , Masao Umemoto
IPC分类号： B04C3/00 , B08B3/14 , B01D19/00 , B24B57/02
CPC分类号： B08B3/14 , B01D19/0057 , B04C2003/006 , B24B57/02
摘要： A gas-liquid separator separates gas-liquid two-phase flow into a gas and a liquid. The gas-liquid separator includes: a container having a bottom and a side portion, the bottom having a liquid discharge outlet and the side portion having a gas discharge outlet; a gas-liquid introduction pipe for introducing a gas-liquid two-phase flow into the container, the gas-liquid introduction pipe extending downward from above the container and having a lower end located in an interior of the container, the gas discharge outlet of the container being located above the lower end of the gas-liquid introduction pipe; and a guide device disposed in the gas-liquid introduction pipe and configured so as to impart a swirling motion to the gas-liquid two-phase flow in the gas-liquid introduction pipe.
摘要翻译：气液分离器将气液两相流分离成气体和液体。气液分离器包括：具有底部和侧部的容器，底部具有液体排出口，侧部具有气体排出口; 用于将气液两相流引入容器的气液引入管，气液导入管从容器的上方向下方延伸，下端位于容器的内部，气体排出口所述容器位于所述气液导入管的下端的上方; 以及引导装置，其设置在所述气液导入管中，并且构成为对所述气液导入管内的气液二相流赋予旋转运动。

2. 发明授权

US09764446B2 Rotary joint and polishing apparatus 有权
公开(公告)号：US09764446B2
公开(公告)日：2017-09-19
申请号：US14682477
申请日：2015-04-09
申请人： EBARA CORPORATION
发明人： Hideo Aizawa , Tadakazu Sone , Masao Umemoto , Ryuichi Kosuge
IPC分类号： B24B57/02 , B24B37/10
CPC分类号： B24B57/02 , B24B37/10 , B24B37/107
摘要： The invention suppresses generation of noises attributable to rotation of a rotary joint. A rotary joint includes a rotating body that rotates on a rotating axis A, a housing disposed so as to surround the rotating body, and at least one bearing disposed between the rotating body and the housing and adapted to support rotation of the rotating body. The rotary joint supplies fluids through fluid connection ports formed in the housing and fluid passages formed inside the rotating body to a polishing table having attached thereto a polishing pad for polishing a substrate or a holding portion that is adapted to hold the substrate while pressing the substrate against the polishing pad. At least one elastic member is interposed at least either between the rotating body and the at least one bearing or between the housing and the at least one bearing.

3. 发明授权

US09174324B2 Polishing apparatus with polishing head cover 有权
标题翻译：抛光装置带抛光头盖
公开(公告)号：US09174324B2
公开(公告)日：2015-11-03
申请号：US14167941
申请日：2014-01-29
申请人： EBARA CORPORATION
发明人： Masao Umemoto , Tadakazu Sone , Ryuichi Kosuge , Hideo Aizawa
IPC分类号： B24B37/34 , B24B37/10 , B24B53/017
CPC分类号： B24B37/34 , B24B37/105 , B24B53/017
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor. The polishing apparatus includes a polishing table configured to hold a polishing tool having a polishing surface, a polishing head having a top ring configured to press a substrate against the polishing surface, and a polishing head cover configured to cover the polishing head. The polishing apparatus further includes a first cleaning liquid supply mechanism configured to supply a cleaning liquid to an outer surface of the polishing head cover, and a second cleaning liquid supply mechanism configured to supply a cleaning liquid to an inner surface of the polishing head cover.
摘要翻译：抛光装置用于抛光诸如半导体的衬底。抛光装置包括：抛光台，其被配置为保持具有抛光表面的抛光工具;抛光头，其具有被配置为将基板压靠在抛光表面上的顶环;以及抛光头盖，其构造成覆盖抛光头。抛光装置还包括：第一清洗液供给机构，其构造成将清洗液供给到研磨头盖的外表面;第二清洗液供给机构，其构造成将清洗液供给到研磨头罩的内表面。

4. 发明授权

US09522453B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US09522453B2
公开(公告)日：2016-12-20
申请号：US14792062
申请日：2015-07-06
申请人： EBARA CORPORATION
发明人： Hideo Aizawa , Masao Umemoto , Tadakazu Sone , Ryuichi Kosuge
IPC分类号： B24B37/015 , B24B37/10 , B24B37/04
CPC分类号： B24B37/015 , B24B37/04 , B24B37/107
摘要： A polishing apparatus which can continue stable operation of the apparatus without generating torsional vibration in a rotary joint and without generating an abnormal sound at an engagement part between a cooling water pipe and a polishing table is disclosed. The polishing apparatus includes a rotary joint fixed to a rotating part of the polishing table or a rotating part of the top ring to supply a fluid into the polishing table or the top ring and discharge the fluid from the polishing table or the top ring, and a rotation-prevention mechanism which connects the rotary joint with an apparatus frame to prevent the rotary joint from being rotated. The rotation-prevention mechanism includes a link mechanism having at least one spherical plain bearing.
摘要翻译：公开了一种可以在不在旋转接头中产生扭转振动并且在冷却水管和抛光台之间的接合部分处不产生异常声音的情况下继续稳定操作设备的抛光装置。抛光装置包括固定到抛光台的旋转部分或顶环的旋转部分的旋转接头，以将流体供应到抛光台或顶环中并从抛光台或顶环排出流体，以及旋转防止机构，其将旋转接头与装置框架连接以防止旋转接头旋转。旋转防止机构包括具有至少一个球面滑动轴承的连杆机构。

5. 发明授权

US09409277B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US09409277B2
公开(公告)日：2016-08-09
申请号：US14067723
申请日：2013-10-30
申请人： EBARA CORPORATION
发明人： Masao Umemoto , Tadakazu Sone , Hideo Aizawa , Ryuichi Kosuge , Masaaki Eriguchi
IPC分类号： B24B53/017 , B24B37/04
CPC分类号： B24B53/017 , B24B37/04
摘要： A polishing apparatus includes: a rotatable polishing table for supporting a polishing pad having a polishing surface; a top ring head having a top ring; a top ring head cover surrounding the top ring head; a dresser head having a dresser configured to dress the polishing surface; a dresser head cover surrounding the dresser head; a spray nozzle configured to spray a cleaning liquid onto an upper surface of the top ring and an outer surface of the top ring head cover when the top ring is in the substrate transfer position; and a spray nozzle configured to spray a cleaning liquid onto an outer surface of the dresser head cover when the dresser is in the retreated position.
摘要翻译：抛光装置包括：可旋转抛光台，用于支撑具有抛光表面的抛光垫; 具有顶环的顶环头; 围绕顶环头部的顶环头盖; 修整器头部具有修整器，该修整器构造成用来装饰抛光表面; 围绕梳妆台头的梳妆台头罩; 喷嘴，其构造成当所述顶环处于所述基板转移位置时，将清洗液喷射到所述顶环的上表面和所述顶环头盖的外表面; 以及喷雾喷嘴，其构造成当所述修整器处于退避位置时将清洁液体喷射到所述修整器盖罩的外表面上。

6. 发明申请

US20150017889A1 POLISHING APPARATUS 审中-公开
标题翻译：抛光装置
公开(公告)号：US20150017889A1
公开(公告)日：2015-01-15
申请号：US14325830
申请日：2014-07-08
申请人： EBARA CORPORATION
发明人： Masao Umemoto , Ryuichi Kosuge , Hiroshi Shimomoto , Hideo Aizawa
IPC分类号： B24B37/34 , B24B37/32 , B24B55/00
CPC分类号： B24B37/34 , B08B1/002 , B24B37/32 , H01L21/67046
摘要： A polishing apparatus which can remove slurry which has entered into a gap between an elastic membrane for pressing a substrate such as a wafer and a retaining ring is disclosed. The polishing apparatus includes a top ring which has an elastic membrane configured to form a pressure chamber for pressing the substrate against a polishing pad, and a retaining ring disposed around the elastic membrane and configured to press the polishing pad, a top ring rotating device configured to rotate the top ring about an axis of the top ring, and a cleaning brush configured to be brought into contact with a peripheral portion of a lower surface and an outer circumferential surface of the elastic membrane.
摘要翻译：公开了一种抛光装置，其可以去除进入用于挤压诸如晶片的基板的弹性膜和保持环之间的间隙中的浆料。抛光装置包括：顶环，其具有弹性膜，其构造成形成用于将基板压靠在抛光垫上的压力室;以及保持环，其设置在弹性膜周围并构造成按压抛光垫;顶环旋转装置，围绕顶环的轴线旋转顶环;以及清洁刷，其构造成与弹性膜的下表面和外周表面的周边部分接触。

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