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1. 发明申请

US20180208816A1 Hot Melt Silicone and Curable Hot Melt Composition 审中-公开
公开(公告)号：US20180208816A1
公开(公告)日：2018-07-26
申请号：US15320513
申请日：2015-06-16
申请人： Dow Corning Toray Co., Ltd.
发明人： Haruna Yamazaki , Makoto Yoshitake , Ryosuke Yamazaki
IPC分类号： C09J183/04 , C08L83/04 , C08G77/12 , C08G77/16 , C08K5/56 , C08K5/5419 , C08K3/22
CPC分类号： C09J183/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/80 , C08K3/22 , C08K5/5419 , C08K5/56 , C08L83/00 , C08L83/04 , C09D183/04 , C09J11/00
摘要： A hot melt silicone that is non-flowable at 25° C. and that has a melt viscosity at 100° C. of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25° C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.

2. 发明授权

US10604612B2 Curable organopolysiloxane composition, semiconductor sealant comprising same, and semiconductor device 有权
公开(公告)号：US10604612B2
公开(公告)日：2020-03-31
申请号：US15539204
申请日：2015-12-17
申请人： Dow Corning Toray Co., Ltd.
发明人： Toyohiko Fujisawa , Nohno Toda , Ryosuke Yamazaki
IPC分类号： C08F299/08 , C08K5/14 , C08G77/20 , C08L83/04 , C09J151/08 , C08F283/12 , H01L33/56 , C08G77/16 , C08G77/12 , H01L33/60 , H01L33/50 , C08G77/14
摘要： Disclosed is a curable organopolysiloxane composition, comprising: (A) a curing reactive organopolysiloxane component formed by curing or semi-curing and reacting at least two or more types of organopolysiloxanes in the presence of one or more types of catalysts; and (B) a peroxide. The composition is a non-fluid at 25° C., and the melt viscosity at 100° C. is 8000 Pa·s or lower. A sealing agent comprising the curable organopolysiloxane composition and a cured product of the curable organopolysiloxane composition are also disclosed, along with a method of molding a cured product and a semiconductor device comprising the cured product.

3. 发明申请

US20150183960A1 Reactive Silicone Composition, Reactive Thermoplastic Article, Cured Product, And Optical Semiconductor Device 审中-公开
标题翻译：活性硅酮组合物，活性热塑性制品，固化产品和光学半导体器件
公开(公告)号：US20150183960A1
公开(公告)日：2015-07-02
申请号：US14407093
申请日：2013-06-18
申请人： Dow Corning Toray Co., Ltd.
发明人： Ryosuke Yamazaki , Haruna Yamazaki , Makoto Yoshitake
IPC分类号： C08K7/18 , H01L33/60 , C08K3/22 , C08K7/14 , C08K3/36
CPC分类号： C08K7/18 , C08G77/12 , C08G77/20 , C08G77/80 , C08K3/22 , C08K3/36 , C08K7/14 , C08K2003/2241 , C08L83/04 , H01L33/486 , H01L33/60 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要： The present invention relates to a reactive silicone composition comprising: (A) an alkenyl group-containing organopolysiloxane represented by the average unit formula; (B) an alkenyl group-containing organopolysiloxane represented by the general formula; (C) a silicon atom-bonded hydrogen atom-containing organopolysiloxane represented by the general formula; (D) a hydrosilylation reaction catalyst; (E) a white pigment; and (F) non-spherical silica, spherical silica or glass fibers, a reactive thermoplastic article obtained by the composition to reaction under specified conditions, a cured product obtained by heating the article, and an optical semiconductor device having the cured product. The reactive silicone composition is a solid at an ordinary temperature and gives a reactive thermoplastic article that is fluidized at elevated temperatures. The reactive thermoplastic article is once fluidized upon heating and then gives a cured product. The cured product exhibits little reduction in mechanical strength or discoloration caused by heat or light and has high light reflectance. And the optical semiconductor device exhibits high luminous efficiency and causes little thermal degradation or photodegradation of a light reflection material.
摘要翻译：本发明涉及一种反应性有机硅组合物，其包含：（A）由平均单元式表示的含烯基的有机基聚硅氧烷; （B）由通式表示的含烯基的有机聚硅氧烷; （C）由通式表示的与硅原子键合的含氢原子的有机聚硅氧烷; （D）氢化硅烷化反应催化剂; （E）白色颜料; 和（F）非球形二氧化硅，球形二氧化硅或玻璃纤维，通过组合物在特定条件下反应获得的反应性热塑性制品，通过加热制品获得的固化产物和具有固化产物的光学半导体装置。反应性硅氧烷组合物在常温下为固体，得到在升高的温度下流化的活性热塑性制品。反应性热塑性制品在加热后一度流化，然后得到固化产物。固化产物的机械强度或由热或光引起的变色几乎不降低并且具有高的光反射率。并且光学半导体器件表现出高的发光效率，并且导致光反射材料的热降解或光降解很少。

4. 发明授权

US11384268B2 Curable silicone composition for die bonding use 有权
公开(公告)号：US11384268B2
公开(公告)日：2022-07-12
申请号：US16619343
申请日：2018-06-19
申请人： Dow Corning Toray Co., Ltd.
发明人： Ryosuke Yamazaki , Shinichi Yamamoto
IPC分类号： C08G77/12 , C09J183/04 , C08G77/08 , C08K3/36 , C08K5/5435
摘要： A curable silicone composition for die bonding use contains at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two siloxane units each represented by the formula: RHSiO (wherein R represents a monovalent hydrocarbon group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond) per molecule, (C) a platinum-group metal-based catalyst for hydrosilylation reactions, (D) a hydrosilylation reaction inhibitor and (E) an adhesiveness-imparting agent, wherein the scorch time (ts1), which is defined in JIS K 6300-2, at a die bonding temperature is 20 to 60 seconds, and the 90% vulcanization time [tc(90)] with respect to the maximum torque value during the vulcanization time of 600 seconds is 300 to 500 seconds. The curable silicone composition for die bonding use according to the present invention can adhere a semiconductor chip to a support strongly.

5. 发明授权

US10927278B2 Curable organopolysiloxane composition and semiconductor device 有权
公开(公告)号：US10927278B2
公开(公告)日：2021-02-23
申请号：US16488291
申请日：2018-02-02
申请人： Dow Corning Toray Co., Ltd.
发明人： Ryosuke Yamazaki , Kazuhiro Nishijima , Tomohiro Iimura , Manabu Sutoh
IPC分类号： C09J183/04 , H01L33/48 , H01L23/00
摘要： The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d. In the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0

6. 发明授权

US09045641B2 Curable silicone composition, cured product thereof, and optical semiconductor device 有权
标题翻译：可固化硅酮组合物，其固化产物和光学半导体装置
公开(公告)号：US09045641B2
公开(公告)日：2015-06-02
申请号：US14375977
申请日：2013-02-01
申请人： Dow Corning Toray Co., Ltd.
发明人： Makoto Yoshitake , Ryosuke Yamazaki
IPC分类号： H01L33/00 , C08K5/549 , C08L83/14 , C08G77/04 , C08L83/04 , H01L33/60 , H01L33/62 , C08K3/22 , C08K3/36 , C08G77/12 , C08G77/20 , C08G77/38 , H01L33/56 , C08G77/00
CPC分类号： C08L83/14 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/38 , C08G77/70 , C08G77/80 , C08K3/22 , C08K3/36 , C08L83/04 , C08L2205/02 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is 20 to 70 mole %; (E) an organopolysiloxane represented by an average unit formula; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, has excellent dimensional stability, and is capable of good attachment by a sealing agent used for an optical semiconductor device.
摘要翻译：可固化的有机硅组合物包括：（A）由平均单元式表示的有机聚硅氧烷; （B）具有10个或更少硅原子的有机聚硅氧烷，其中所有硅原子键合的有机基团的30至60摩尔％为具有2至6个碳原子的烯基; （C）由通式表示的有机聚硅氧烷; （D）分子中具有至少2个硅原子键合的氢原子的有机聚硅氧烷，其中，该成分中所有与硅原子键合的有机基团中的苯基含量为20〜70摩尔％（E）由平均单元式表示的有机聚硅氧烷; （F）氢化硅烷化反应催化剂; （G）白色颜料; 和（H）除了白色颜料以外的无机填料，具有优异的成型性，能够形成通过热和光几乎不变色和降低机械强度的固化产物，具有高的光反射率，具有优异的尺寸稳定性，并且能够良好用于光学半导体器件的密封剂附着。

7. 发明授权

US10479910B2 Primer composition, adhering method, and electric/electronic part 有权
公开(公告)号：US10479910B2
公开(公告)日：2019-11-19
申请号：US15553407
申请日：2016-02-23
申请人： Dow Corning Toray Co., Ltd.
发明人： Ryosuke Yamazaki , Hiroaki Yoshida , Shin Yoshida
IPC分类号： C08L83/10 , C09D183/10 , C09D5/00 , C09D7/40
摘要： A primer composition is provided. The primer composition comprises: (A) an organosiloxane block copolymer represented by the average unit formula: (R12SiO2/2)a(R2SiO3/2)b, wherein each R1 and R2 is independently an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, “a” is a number in the range of 0.40 to 0.90, “b” is a number in the range of 0.10 to 0.60, and “a+b”=1.00, and having 0.5 to 35.0 mol % of silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups, in which resinous siloxane blocks are connected by linear siloxane blocks; (B) a curing catalyst; and (C) an organic solvent. The primer composition improves the adhesion of silicone-cured products to base materials of optical semiconductor elements, package materials, substrates etc., and can suppress peeling or cracking caused by heat cycles.

8. 发明授权

US09048406B2 Curable silicone composition, cured product thereof, and optical semiconductor device 有权
标题翻译：可固化硅酮组合物，其固化产物和光学半导体装置
公开(公告)号：US09048406B2
公开(公告)日：2015-06-02
申请号：US14375989
申请日：2013-02-01
申请人： Dow Corning Toray Co., Ltd.
发明人： Ryosuke Yamazaki , Makoto Yoshitake
IPC分类号： H01L33/60 , C08K5/549 , C08L83/04 , C08G77/04 , C08G77/12 , C08G77/20 , C08G77/00
CPC分类号： H01L33/60 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/80 , C08K3/22 , C08K5/549 , C08K5/56 , C08K2003/2237 , C08L83/00 , C08L83/04 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is at least 20 mole %; (E) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is less than 20 mole %; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, has excellent dimensional stability, and is capable of good attachment by a sealing agent used for an optical semiconductor device.
摘要翻译：可固化的有机硅组合物包括：（A）由平均单元式表示的有机聚硅氧烷; （B）具有10个或更少硅原子的有机聚硅氧烷，其中所有硅原子键合的有机基团的30至60摩尔％为具有2至6个碳原子的烯基; （C）由通式表示的有机聚硅氧烷; （D）分子中具有至少2个硅原子键合的氢原子的有机聚硅氧烷，其中该组分中所有与硅原子键合的有机基团中的苯基含量为至少20摩尔％。（E）在分子中具有至少2个硅原子键合的氢原子的有机聚硅氧烷，其中该组分中所有与硅原子键合的有机基团中的苯基含量小于20摩尔％; （F）氢化硅烷化反应催化剂; （G）白色颜料; 和（H）除了白色颜料以外的无机填料，具有优异的成型性，能够形成通过热和光几乎不变色和降低机械强度的固化产物，具有高的光反射率，具有优异的尺寸稳定性，并且能够良好用于光学半导体器件的密封剂附着。

9. 发明申请

US20150001569A1 Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device 有权
标题翻译：可固化硅酮组合物，其固化产物和光半导体器件
公开(公告)号：US20150001569A1
公开(公告)日：2015-01-01
申请号：US14375977
申请日：2013-02-01
申请人： Dow Corning Toray Co., Ltd.
发明人： Makoto Yoshitake , Ryosuke Yamazaki
IPC分类号： C08L83/14 , H01L33/62 , H01L33/60
CPC分类号： C08L83/14 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/38 , C08G77/70 , C08G77/80 , C08K3/22 , C08K3/36 , C08L83/04 , C08L2205/02 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is 20 to 70 mole %; (E) an organopolysiloxane represented by an average unit formula; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, has excellent dimensional stability, and is capable of good attachment by a sealing agent used for an optical semiconductor device.
摘要翻译：可固化的有机硅组合物包括：（A）由平均单元式表示的有机聚硅氧烷; （B）具有10个或更少硅原子的有机聚硅氧烷，其中所有硅原子键合的有机基团的30至60摩尔％为具有2至6个碳原子的烯基; （C）由通式表示的有机聚硅氧烷; （D）分子中具有至少2个硅原子键合的氢原子的有机聚硅氧烷，其中，该成分中所有与硅原子键合的有机基团中的苯基含量为20〜70摩尔％（E）由平均单元式表示的有机聚硅氧烷; （F）氢化硅烷化反应催化剂; （G）白色颜料; 和（H）除了白色颜料以外的无机填料，具有优异的成型性，能够形成通过热和光几乎不变色和降低机械强度的固化产物，具有高的光反射率，具有优异的尺寸稳定性，并且能够良好用于光学半导体器件的密封剂附着。

10. 发明授权

US11136437B2 Curable particulate silicone composition, semiconductor member comprising curable particulate silicone composition, and method for molding semiconductor member 有权
公开(公告)号：US11136437B2
公开(公告)日：2021-10-05
申请号：US16324018
申请日：2017-08-04
申请人： Dow Corning Toray Co., Ltd.
发明人： Ryosuke Yamazaki
IPC分类号： C08L83/04 , H01L23/29 , C08G77/00 , C08K3/00 , C08J5/00 , H01L23/31 , H01L21/56 , B29C45/00 , B29C45/14 , C08K3/22 , C08K3/36 , B29K83/00 , B29K509/02 , B29L31/34
摘要： Provided is a curable particulate silicone composition that is hot-meltable, has excellent handling workability, curing properties, and gap fill properties when melted, and gives a cured product having excellent flexibility and resilience from room temperature to high temperatures of about 150° C. Also provided are pellets or the like formed by molding the curable particulate silicone composition. The curable particulate silicone composition comprises: (A) hot-meltable silicone particles that have a softening point of 30° C. or higher and have a hydrosilylatable group and/or a radical reactive group; (B) an inorganic filler (particulates) that is substantially free of coarse particles having an average particle diameter of 10.0 μm or larger; and (C) a curing agent. When cured, the composition gives a cured product having a storage modulus of 2000 Mpa or lower at 25° C. and of 100 Mpa or lower at 150° C.

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