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    • 1. 发明授权
    • Decouplers for active devices
    • 有源器件的去耦器
    • US5730429A
    • 1998-03-24
    • US145430
    • 1993-10-29
    • Douglas E. IversLane R. MillerLynn C. YanyoCharles M. Nobles, Jr.
    • Douglas E. IversLane R. MillerLynn C. YanyoCharles M. Nobles, Jr.
    • F16F1/36F16F1/40F16F7/10F16F13/04F16F13/10F16F15/00F16F15/02F16F15/08
    • F16F1/40F16F1/3605F16F13/04F16F13/10F16F15/02F16F15/08F16F7/1005
    • A system (20) which includes a frequency-dependent decoupler (21) arranged in a series-spring relationship with an actuator (26) for supplying active forces to cancel vibration. The system (20) also includes a spring (28) for providing a primary load path. The system (20) is responsive to at least one sensor (32, 34, 36 or 38) and is controlled via controller (30). The decoupler (26) has greater frequency dependency than the spring (28) and allows the actuator (26) to be effectively decoupled at low frequency, yet coupled at high frequency. This frequency dependent coupling allows the system (20)to accommodate transient static and low frequency loads and motions by allowing motion across the decoupler (21). However, at high frequency, the decoupler (21) becomes stiffer and couples the actuator (26) with the moving members (22) and (24) such that motion across the decoupler (26) is minimized and the actuator (26) becomes more effective at high frequency attenuation. Alternate embodiments of the decoupler (21) include elastomer decouplers (21b), friction decouplers (21c), glass-transition decouplers (21d), and fluid decouplers (21e),(21f),(21g), and (21h).
    • 一种系统(20),其包括与致动器(26)以串联弹簧关系布置的用于提供主动力以消除振动的频率依赖解耦器(21)。 系统(20)还包括用于提供主负载路径的弹簧(28)。 系统(20)响应于至少一个传感器(32,34,36或38)并通过控制器(30)进行控制。 解耦器(26)具有比弹簧(28)更大的频率依赖性,并允许致动器(26)在低频率下被有效地解耦,但是以高频耦合。 该频率相关耦合允许系统(20)通过允许跨越解耦器(21)的运动来适应瞬时静态和低频负载和运动。 然而,在高频下,解耦器(21)变得较硬,并且使致动器(26)与移动构件(22)和(24)联接,使得横跨解耦器(26)的运动最小化并且致动器(26)变得更多 在高频衰减时有效。 解耦器(21)的替代实施例包括弹性体分离器(21b),摩擦分离器(21c),玻璃 - 过渡分离器(21d)和流体分离器(21e),(21f),(21g)和(21h)。
    • 6. 发明授权
    • Joint including a field responsive material and method
    • 联合包括现场响应材料和方法
    • US06667679B2
    • 2003-12-23
    • US09839448
    • 2001-04-20
    • J. David CarlsonLynn C. Yanyo
    • J. David CarlsonLynn C. Yanyo
    • H01F720
    • F16B5/0084F16B2001/0035
    • A temporary joint that includes a first discrete member having a first edge and a first movable coupling means; and a second discrete member having a second edge and a second movable coupling means. When it is necessary to form a joint between the first and second discrete members, the first and second edges are moved into abutment to define a binding edge. Then, the first and second movable coupling means are moved toward the binding edge; and the temporary joint is formed when the first and second movable coupling means are proximate the binding edge. The joint is broken by moving the first and second coupling means away from the binding edge. The first coupling means is comprised of a volume of a field responsive material and the second coupling means is a field producing means such as a magnet. A rigid joint is produced when the field producing supplies a field across the field responsive material.
    • 一种临时接头,包括具有第一边缘的第一分立构件和第一可移动联接装置; 以及具有第二边缘和第二可移动联接装置的第二分立构件。 当需要在第一和第二分立构件之间形成接头时,第一和第二边缘被移动成邻接以限定装订边缘。 然后,第一和第二可移动联接装置朝向装订边缘移动; 并且当第一和第二可移动联接装置靠近装订边缘时形成临时接合部。 通过使第一和第二联接装置移动离开装订边缘来破坏接头。 第一耦合装置由体积的场响应材料组成,第二耦合装置是诸如磁体的场产生装置。 当现场生产提供现场响应材料的场地时,产生刚性接头。
    • 8. 发明授权
    • Method for metal bonding
    • 金属接合方法
    • US5139601A
    • 1992-08-18
    • US507224
    • 1990-04-11
    • Stephen R. Holmes-FarleyLynn C. YanyoAnna M. Thuer
    • Stephen R. Holmes-FarleyLynn C. YanyoAnna M. Thuer
    • B32B7/12C09J5/02
    • B32B7/12C09J5/02C09J2205/306
    • A method for bonding a metal substrate to a similar or dissimilar substrate by first applying a primer coating to the surface of the metal substrate and then bonding the primed metal substrate to the other substrate. At least part of the primer coating is composed of a uniform, ultra-thin film that is formed by immersing, prior to bonding, the metal substrate in a solution that has undergone substantially no polymer growth. The solution contains at least one hydrolyzable metal alkoxide of a polymer network-forming cation, water, a solvent and a base. The metal substrate is allowed to react with the solution for a time sufficient to form in situ an ultra-thin film on the metal substrate.
    • 一种通过首先在金属基板的表面上施加底涂层,然后将底漆金属基板粘合到另一个基板上来将金属基板粘合到相似或不同的基板上的方法。 底漆涂层的至少一部分由均匀的超薄膜组成,该薄膜通过在金属基材在已经经历基本上没有聚合物生长的溶液中之前浸渍形成。 溶液含有至少一种可形成聚合物网络的阳离子的水解性金属醇盐,水,溶剂和碱。 允许金属基材与溶液反应一段时间,足以在金属基材上原位形成超薄膜。