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    • 4. 发明申请
    • High-frequency drum-style slip-ring modules
    • 高频鼓式滑环组件
    • US20080284584A1
    • 2008-11-20
    • US11803483
    • 2007-05-15
    • Donnie S. ColemanJack T. Galyean
    • Donnie S. ColemanJack T. Galyean
    • H05K1/02
    • H01R39/08
    • A drum-style slip-ring module (100) is used in a contact-type communication system. The module utilizes PCB construction to construct a plurality of stacked electrically-conductive rings (102) and a plurality of dielectric layers (104) electrically isolating the conductive rings. Each of the dielectric layers includes a centrally-located aperture (107). The module also includes a cylindrical ground plane (108) positioned in the centrally-located aperture. The module is configured to provide electrical connection to each of the rings at an exterior surface of the module. Each group of feed line vias can be designed as impedance-controlled transmission lines with connections to each ring group. The construction described in this invention can create slip-ring transmission line structures with bandwidth from DC to 5 GHz or higher, allowing the slip-ring to be used to transfer multi-gigabit digital data streams.
    • 滚筒式滑环模块(100)用于接触型通信系统。 该模块利用PCB结构来构造多个层叠的导电环(102)和电绝缘导电环的多个电介质层(104)。 每个电介质层包括位于中心的孔(107)。 模块还包括定位在居中的孔中的圆柱形接地平面(108)。 模块被配置为在模块的外表面处提供与每个环的电连接。 每组馈线通孔可以设计为具有与每个环组的连接的阻抗控制传输线。 本发明中描述的结构可以产生带宽从DC到5GHz或更高的滑环传输线结构,允许滑环用于传输多吉比特数字数据流。
    • 5. 发明授权
    • High-frequency drum-style slip-ring modules
    • 高频鼓式滑环组件
    • US07559767B2
    • 2009-07-14
    • US11803483
    • 2007-05-15
    • Donnie S. ColemanJack T. Galyean
    • Donnie S. ColemanJack T. Galyean
    • H01R39/00
    • H01R39/08
    • A drum-style slip-ring module (100) is used in a contact-type communication system. The module utilizes PCB construction to construct a plurality of stacked electrically-conductive rings (102) and a plurality of dielectric layers (104) electrically isolating the conductive rings. Each of the dielectric layers includes a centrally-located aperture (107). The module also includes a cylindrical ground plane (108) positioned in the centrally-located aperture. The module is configured to provide electrical connection to each of the rings at an exterior surface of the module. Each group of feed line vias can be designed as impedance-controlled transmission lines with connections to each ring group. The construction described in this invention can create slip-ring transmission line structures with bandwidth from DC to 5 GHz or higher, allowing the slip-ring to be used to transfer multi-gigabit digital data streams.
    • 滚筒式滑环模块(100)用于接触型通信系统。 该模块利用PCB结构来构造多个层叠的导电环(102)和电绝缘导电环的多个电介质层(104)。 每个电介质层包括位于中心的孔(107)。 模块还包括定位在居中的孔中的圆柱形接地平面(108)。 模块被配置为在模块的外表面处提供与每个环的电连接。 每组馈线通孔可以设计为具有与每个环组的连接的阻抗控制传输线。 本发明中描述的结构可以产生带宽从DC到5GHz或更高的滑环传输线结构,允许滑环用于传输多吉比特数字数据流。
    • 8. 发明授权
    • Broadband high-frequency slip-ring system
    • 宽带高频滑环系统
    • US07142071B2
    • 2006-11-28
    • US11192910
    • 2005-07-29
    • Donnie S. Coleman
    • Donnie S. Coleman
    • H01P1/06
    • H01R39/10H01P1/06H01R12/523H01R35/025H01R39/08H01R39/24H01R39/64
    • A velocity compensated contacting ring system includes a first dielectric material, a plurality of concentric spaced conductive rings and a first ground plane. The first dielectric material includes a first side and a second side. The plurality of concentric spaced conductive rings are located on the first side of the first dielectric material. The conductive rings include an inner ring and an outer ring. The first ground plane is located on the second side of the first dielectric material. A width of the inner ring is greater than a width of the outer ring and the widths of the inner and outer rings are selected to substantially equalize electrical lengths of the inner and outer rings.
    • 速度补偿接触环系统包括第一电介质材料,多个同心间隔的导电环和第一接地平面。 第一电介质材料包括第一侧和第二侧。 多个同心隔开的导电环位于第一介电材料的第一侧上。 导电环包括内环和外环。 第一接地平面位于第一电介质材料的第二侧。 内环的宽度大于外圈的宽度,并且内圈和外圈的宽度被选择为基本上均衡内圈和外圈的电长度。