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    • 1. 发明授权
    • Schottky junction source/drain transistor and method of making
    • 肖特基结源极/漏极晶体管及其制造方法
    • US08697529B2
    • 2014-04-15
    • US13508731
    • 2011-09-28
    • Dongping WuJun LuoYinghua PiaoZhiwei ZhuShili ZhangWei Zhang
    • Dongping WuJun LuoYinghua PiaoZhiwei ZhuShili ZhangWei Zhang
    • H01L21/336H01L21/338
    • H01L29/7839H01L29/6653H01L29/66848
    • A method of making a transistor, comprising: providing a semiconductor substrate; forming a gate stack over the semiconductor substrate; forming an insulating layer over the semiconductor substrate; forming a depleting layer over the insulating layer; etching the depleting layer and the insulating layer; forming a metal layer over the semiconductor substrate; performing thermal annealing; and removing the metal layer. As advantages of the present invention, an upper outside part of each of the sidewalls include a material that can react with the metal layer, so that metal on two sides of the sidewalls is absorbed during the annealing process, preventing the metal from diffusing toward the semiconductor layer, and ensuring that the formed Schottky junctions can be ultra-thin and uniform, and have controllable and suppressed lateral growth.
    • 一种制造晶体管的方法,包括:提供半导体衬底; 在所述半导体衬底上形成栅叠层; 在半导体衬底上形成绝缘层; 在绝缘层上形成耗尽层; 蚀刻耗尽层和绝缘层; 在所述半导体衬底上形成金属层; 进行热退火; 并去除金属层。 作为本发明的优点,每个侧壁的上部外侧部分包括能够与金属层反应的材料,从而在退火过程中吸收侧壁两侧的金属,从而防止金属朝向 半导体层,并且确保形成的肖特基结可以是超薄和均匀的,并且具有可控和抑制的横向生长。
    • 2. 发明申请
    • METHOD FOR MAKING TRANSISTORS
    • 制造晶体管的方法
    • US20130270615A1
    • 2013-10-17
    • US13508731
    • 2011-09-28
    • Dongping WuJun LuoYinghua PiaoZhiwei ZhuShili ZhangWei Zhang
    • Dongping WuJun LuoYinghua PiaoZhiwei ZhuShili ZhangWei Zhang
    • H01L29/78H01L29/66
    • H01L29/7839H01L29/6653H01L29/66848
    • A method of making a transistor, comprising: providing a semiconductor substrate; forming a gate stack over the semiconductor substrate; forming an insulating layer over the semiconductor substrate; forming a depleting layer over the insulating layer; etching the depleting layer and the insulating layer; forming a metal layer over the semiconductor substrate; performing thermal annealing; and removing the metal layer. As advantages of the present invention, an upper outside part of each of the sidewalls include a material that can react with the metal layer, so that metal on two sides of the sidewalls is absorbed during the annealing process, preventing the metal from diffusing toward the semiconductor layer, and ensuring that the formed Schottky junctions can be ultra-thin and uniform, and have controllable and suppressed lateral growth.
    • 一种制造晶体管的方法,包括:提供半导体衬底; 在所述半导体衬底上形成栅叠层; 在半导体衬底上形成绝缘层; 在绝缘层上形成耗尽层; 蚀刻耗尽层和绝缘层; 在所述半导体衬底上形成金属层; 进行热退火; 并去除金属层。 作为本发明的优点,每个侧壁的上部外侧部分包括能够与金属层反应的材料,从而在退火过程中吸收侧壁两侧的金属,从而防止金属朝向 半导体层,并且确保形成的肖特基结可以是超薄和均匀的,并且具有可控和抑制的横向生长。
    • 3. 发明申请
    • METHOD FOR MAKING FIELD EFFECT TRANSISTOR
    • 制作场效应晶体管的方法
    • US20130295732A1
    • 2013-11-07
    • US13390328
    • 2011-09-28
    • Dongping WuYinghua PiaoZhiwei ZhuShili ZhangWei Zhang
    • Dongping WuYinghua PiaoZhiwei ZhuShili ZhangWei Zhang
    • H01L29/66
    • H01L29/66477H01L21/26513H01L21/2658H01L21/324H01L29/517H01L29/6659
    • The present invention provides a method for making a field effect transistor, comprising of the following steps: providing a silicon substrate with a first type, forming a shallow trench by photolithography and etching processes, and forming silicon dioxide shallow trench isolations inside the shallow trench; forming by deposition a high-K gate dielectric layer and a metal gate electrode layer on the substrate and the shallow trench isolations; forming a gate structure by photolithography and etching processes; forming source/drain extension regions by ion implantation of dopants of a second type; depositing an insulating layer to form sidewalls tightly adhered to the sides of the gate; forming source/drain regions and PN junction interfaces between the source/drain region and the silicon substrate by ion implantation of dopants of the second type; and performing microwave annealing to activate implanted ions. The novel process of making a field effect transistor in the present invention can achieve impurity activation in the source/drain area at a low temperature and can reduce the influence of source/drain annealing on high-K gate dielectric and metal gate electrode.
    • 本发明提供一种制造场效应晶体管的方法,包括以下步骤:提供具有第一类型的硅衬底,通过光刻和蚀刻工艺形成浅沟槽,以及在浅沟槽内形成二氧化硅浅沟槽隔离; 通过在衬底上沉积高K栅介质层和金属栅电极层并形成浅沟槽隔离; 通过光刻和蚀刻工艺形成栅极结构; 通过第二类掺杂剂的离子注入形成源/漏扩展区; 沉积绝缘层以形成紧密地粘附到栅极侧面的侧壁; 通过第二类掺杂剂的离子注入在源极/漏极区域和硅衬底之间形成源极/漏极区域和PN结界面; 并进行微波退火以激活注入的离子。 在本发明中制造场效应晶体管的新颖方法可以在低温下在源极/漏极区域实现杂质活化,并且可以减少源极/漏极退火对高K栅极电介质和金属栅电极的影响。