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1. 发明申请

US20090035939A1 FABRICATION METHOD TO MINIMIZE BALLAST LAYER DEFECTS 审中-公开
标题翻译：最小化BALLAST层缺陷的制造方法
公开(公告)号：US20090035939A1
公开(公告)日：2009-02-05
申请号：US11830985
申请日：2007-07-31
申请人： Steven Young , William Dauksher , Emmett Howard , Donald Weston
发明人： Steven Young , William Dauksher , Emmett Howard , Donald Weston
IPC分类号： H01L21/44
CPC分类号： H01J9/025 , H01J1/304 , H01J2201/3195
摘要： A method for minimizing fabrication defects in ballast contact to a conductor in monolithically integrated semiconductor devices includes forming a sloping sidewall (318, 424) in both an insulating layer (106, 718) overlying a conductive layer (104, 714) by etching with a an RF biased fluorine based chemistry and an RF biased chlorine based chemistry, respectively, as defined by a single resist layer (108) having a sloped sidewall (212). A ballast layer (526, 726) is deposited on the structure (100, 700) and metal contacts (632, 634, 636, 638, 722) are disposed on the ballast layer (526, 722).
摘要翻译：一种用于使在单片集成半导体器件中的导体的镇流器接触中的制造缺陷最小化的方法包括：在覆盖导电层（104,714）的绝缘层（106,78）中形成倾斜侧壁（318,424）分别由具有倾斜侧壁（212）的单个抗蚀剂层（108）限定的RF偏置氟基化学和RF偏置氯基化学。沉积在结构（100,700）上的压载层（526,726），并且金属触点（632,634,636,638,722）设置在镇流器层（526,722）上。

2. 发明申请

US20070099336A1 Plasma etch process for defining catalyst pads on nanoemissive displays 失效
标题翻译：用于在纳米显示器上定义催化剂垫的等离子体蚀刻工艺
公开(公告)号：US20070099336A1
公开(公告)日：2007-05-03
申请号：US11263793
申请日：2005-10-31
申请人： Donald Weston , William Dauksher , Emmett Howard
发明人： Donald Weston , William Dauksher , Emmett Howard
IPC分类号： H01L51/40
CPC分类号： H01J9/025 , B82Y10/00 , B82Y30/00 , B82Y40/00 , C01B32/162 , H01J2201/30469 , Y10S977/742
摘要： A process for forming a catalyst layer for carbon nanotube growth comprising forming a catalyst layer having a first and second portion over one of a cathode metal layer or a ballast resistor layer; patterning a photoresist over the first portion; etching the second portion with a chlorine/argon plasma; removing the photoresist with an ash process; and removing the veils and preparing the surface for carbon nanotube growth with a semi-aqueous hydroxylamine solution.
摘要翻译：一种用于形成用于碳纳米管生长的催化剂层的方法，包括在阴极金属层或镇流电阻层之一上形成具有第一和第二部分的催化剂层; 在第一部分上图案化光致抗蚀剂; 用氯/氩等离子体蚀刻第二部分; 用灰过程去除光致抗蚀剂; 并用半水羟胺溶液除去面纱并制备用于碳纳米管生长的表面。

3. 发明申请

US20170062380A1 METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF 有权
标题翻译：提供柔性半导体器件及其柔性半导体器件的方法
公开(公告)号：US20170062380A1
公开(公告)日：2017-03-02
申请号：US15349511
申请日：2016-11-11
申请人： Emmett Howard , Nicholas Munizza , Paul Yee , Michael Marrs
发明人： Emmett Howard , Nicholas Munizza , Paul Yee , Michael Marrs
IPC分类号： H01L23/00
CPC分类号： H01L24/83 , H01L21/6835 , H01L24/29 , H01L2221/68318 , H01L2221/6835 , H01L2221/68381 , H01L2224/8309 , H01L2224/83359
摘要： Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.
摘要翻译：一些实施例包括一种方法。该方法可以包括：提供载体衬底; 在所述载体基底上提供粘附修饰层; 提供器件衬底; 以及将所述器件衬底和所述载体衬底耦合在一起时，当所述器件衬底和所述载体衬底耦合在一起时，所述粘附修饰层位于所述器件衬底和所述载体衬底之间。在这些实施例中，粘合改性层可以被配置成使得器件衬底通过粘合改性层间接地与载体衬底相互耦合，第一接合力大于第二结合力，器件衬底与载体基材不存在粘附改性层。还公开了相关方法和装置的其它实施例。

4. 发明申请

US20070123134A1 Method for preventing electron emission from defects in a field emission device 失效
标题翻译：防止场发射装置中的电子发射缺陷的方法
公开(公告)号：US20070123134A1
公开(公告)日：2007-05-31
申请号：US11292408
申请日：2005-11-30
申请人： Emmett Howard , Kenneth Dean , Dirk Jordan
发明人： Emmett Howard , Kenneth Dean , Dirk Jordan
IPC分类号： H01J9/24 , H01J9/00
CPC分类号： H01J9/025 , H01J3/021 , H01J9/148 , H01J29/481
摘要： A method is provided for preventing electron emission from a sidewall (34) of a gate electrode (20) and the edge (28) of the gate electrode stack of a field emission device (10), the gate electrode (20) having a surface (24) distally disposed from an anode (40) and a side (26) proximate to emission electrodes (38). The method comprises growing dielectric material (22) over the surface (24) and side (26) of the gate electrode (20), and performing an anisotropic etch (32) normal to the surface (24) to remove the dielectric material (22) from the surface (24) and leaving at least a portion of the dielectric material (22) on the side (26) of the gate electrode (20) and edge (28) of the gate electrode stack.
摘要翻译：提供了一种防止来自栅极电极（20）的侧壁（34）和场致发射器件（10）的栅电极堆叠的边缘（28）的电子发射的方法，栅电极（20）具有表面（40）和靠近发射电极（38）的侧面（26）远离地设置的（24）。该方法包括在栅电极（20）的表面（24）和侧面（26）上方生长电介质材料（22），并且执行垂直于表面（24）的各向异性蚀刻（32）以移除电介质材料），并且在栅电极（20）的侧面（26）和栅极电极叠层的边缘（28）上留下介电材料（22）的至少一部分。

5. 发明授权

US5804909A Edge emission field emission device 失效
标题翻译：边缘发射场发射装置
公开(公告)号：US5804909A
公开(公告)日：1998-09-08
申请号：US832841
申请日：1997-04-04
申请人： Thomas Nilsson , John Song , Emmett Howard
发明人： Thomas Nilsson , John Song , Emmett Howard
IPC分类号： H01J3/02 , H01J19/24
CPC分类号： H01J3/022 , H01J2201/30423 , H01J2201/319
摘要： An edge emission FED (100) includes a supporting substrate (110); a cathode (120) disposed on the supporting substrate (110); a ballast layer (130) disposed on the cathode (120); an emissive layer (140) disposed on the ballast layer (130) and defining an emissive edge (183); a field shaper layer (150) disposed on the emissive layer (140); a dielectric layer (160) disposed on the field shaper layer (150); a gate extraction electrode (170) disposed on the dielectric layer (160); an emission well (180) defined by the ballast layer (130), the emissive edge (183), the field shaper layer (150), the dielectric layer (160), and the gate extraction electrode (170); and an anode plate (188) opposing the gate extraction electrode (170).
摘要翻译：边缘发射FED（100）包括支撑衬底（110）; 设置在所述支撑基板（110）上的阴极（120）; 设置在阴极（120）上的镇流器层（130）; 设置在所述镇流器层（130）上并限定发射边缘（183）的发射层（140）; 设置在所述发射层（140）上的场整形器层（150）; 设置在所述场整形器层（150）上的电介质层（160）; 设置在介电层（160）上的栅极引出电极（170）; 由镇流器层（130），发射边缘（183），场整形器层（150），电介质层（160）和栅极引出电极（170）限定的发射阱（180）。以及与栅极引出电极（170）相对的阳极板（188）。

6. 发明授权

US09953951B2 Method of providing a flexible semiconductor device and flexible semiconductor device thereof 有权
公开(公告)号：US09953951B2
公开(公告)日：2018-04-24
申请号：US15349511
申请日：2016-11-11
申请人： Emmett Howard , Nicholas Munizza , Paul Yee , Michael Marrs
发明人： Emmett Howard , Nicholas Munizza , Paul Yee , Michael Marrs
IPC分类号： H01L23/00 , H01L21/02 , H01L33/12 , H01L21/683
CPC分类号： H01L24/83 , H01L21/6835 , H01L24/29 , H01L2221/68318 , H01L2221/6835 , H01L2221/68381 , H01L2224/8309 , H01L2224/83359
摘要： Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.

7. 发明申请

US20160329268A1 METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF 有权
标题翻译：提供柔性半导体器件及其柔性半导体器件的方法
公开(公告)号：US20160329268A1
公开(公告)日：2016-11-10
申请号：US15217405
申请日：2016-07-22
申请人： Emmett Howard , Nicholas Munizza , Paul Yee
发明人： Emmett Howard , Nicholas Munizza , Paul Yee
IPC分类号： H01L23/498 , H01L21/683 , H01L21/48
CPC分类号： H01L23/4985 , H01L21/2007 , H01L21/4853 , H01L21/52 , H01L21/6835 , H01L51/0097 , H01L2221/68318 , H01L2221/6835 , H01L2221/68381 , H01L2221/68386
摘要： Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.
摘要翻译：一些实施例包括一种方法。该方法可以包括提供载体衬底，在载体衬底上提供释放层，以及在载体衬底和释放层上提供器件衬底。提供器件衬底可以包括将器件衬底接合到载体衬底，以及将器件衬底接合到释放层。此外，提供释放层可以包括将释放层粘合到载体基底。同时，脱模层可以包括聚甲基丙烯酸甲酯，并且装置基板可以以第一粘附强度结合到载体基板上，装置基板可以以小于第一粘合强度的第二粘合强度结合到剥离层，并且剥离层可以以大于第二粘合强度的第三粘合强度结合到载体基材。还公开了相关方法和装置的其它实施例。

8. 发明申请

US20060208625A1 Field emission display 失效
标题翻译：场发射显示
公开(公告)号：US20060208625A1
公开(公告)日：2006-09-21
申请号：US11082715
申请日：2005-03-16
申请人： Kenneth Dean , Bernard Coll , Emmett Howard
发明人： Kenneth Dean , Bernard Coll , Emmett Howard
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01J29/08 , H01J31/127
摘要： An apparatus is provided for reducing color bleed in a flat panel display. The apparatus comprises an anode (30) with a plurality of phosphors (28) of at least two colors sequentially disposed thereon. A cathode (14) is arranged in parallel opposed position to and separated from the anode (30) and contains a plurality of pads (40) of emitters. Each pad (40) is disposed on the cathode (14) in spaced relationship to and aligned with one of the at least two colors, respectively, wherein electrons from each of the plurality of pads of emitters that drift from its intended phosphor (28) are encouraged to drift toward an adjacent phosphor (28) of the same color.
摘要翻译：提供一种用于减少平板显示器中的颜色渗色的装置。该装置包括具有顺序地设置在其上的至少两种颜色的多个荧光体（28）的阳极（30）。阴极（14）被布置成与阳极（30）相对并且与阳极（30）分离并且包含多个发射器的焊盘（40）。每个焊盘（40）分别与阴极（14）隔开关系并且与至少两种颜色中的一种对准配置，其中来自发射器的多个焊盘中的每一个的电子从其预期的荧光体（28）漂移，被鼓励漂移到相同颜色的相邻磷光体（28）。

9. 发明授权

US09768107B2 Method of providing a flexible semiconductor device and flexible semiconductor device thereof 有权
公开(公告)号：US09768107B2
公开(公告)日：2017-09-19
申请号：US15217405
申请日：2016-07-22
申请人： Emmett Howard , Nicholas Munizza , Paul Yee
发明人： Emmett Howard , Nicholas Munizza , Paul Yee
IPC分类号： H01L21/58 , H01L23/498 , H01L21/683 , H01L21/48 , H01L21/52 , H01L21/20 , H01L51/00
CPC分类号： H01L23/4985 , H01L21/2007 , H01L21/4853 , H01L21/52 , H01L21/6835 , H01L51/0097 , H01L2221/68318 , H01L2221/6835 , H01L2221/68381 , H01L2221/68386
摘要： Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.

10. 发明申请

US20170243810A1 ELECTRONIC DEVICE AND METHODS OF PROVIDING AND USING ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20170243810A1
公开(公告)日：2017-08-24
申请号：US15590843
申请日：2017-05-09
申请人： Joseph Smith , Emmett Howard , Jennifer Blain Christen , Yong-Kyun Lee
发明人： Joseph Smith , Emmett Howard , Jennifer Blain Christen , Yong-Kyun Lee
IPC分类号： H01L23/498 , H01L27/146
CPC分类号： H01L23/4985 , A61B2562/02 , A61B2562/164 , H01L21/30604 , H01L21/6835 , H01L21/768 , H01L23/15 , H01L23/3192 , H01L27/1218 , H01L27/1262 , H01L27/14603 , H01L27/14636 , H01L27/153 , H01L27/156 , H01L27/3293 , H01L29/786 , H01L29/78603 , H01L2221/6835 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要： Some embodiments include a method of providing an electronic device. The method can comprise: providing a first device substrate; providing one or more first active sections over a second side of the first device substrate at a first device portion of the first device substrate; and after providing the first active section(s) over the second side of the first device substrate at the first device portion, folding a first perimeter portion of the first device substrate toward the first device portion at a first side of the first device substrate so that a first edge portion remains to at least partially frame the first device portion. The first edge portion can comprise a first edge portion width dimension smaller than a first smallest cross dimension of one or more pixel(s) of one or more semiconductor device(s) of the first active section(s). Other embodiments of related methods and devices are also disclosed.

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