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    • 3. 发明申请
    • Radiation emitting semiconductor device
    • 辐射发射半导体器件
    • US20050003565A1
    • 2005-01-06
    • US10837828
    • 2004-05-03
    • Dominik EisertVolker HaerleFrank KuehnManfred Mundbrod-VangerowUwe StraussUlrich Zehnder
    • Dominik EisertVolker HaerleFrank KuehnManfred Mundbrod-VangerowUwe StraussUlrich Zehnder
    • H01L33/00H01L33/20H01L33/22H01L33/38H01L33/40H01L21/00
    • H01L33/20H01L33/0079H01L33/22H01L33/38H01L33/405H01L33/60H01L2224/32245H01L2224/32257H01L2224/48091H01L2224/48247H01L2224/48465H01L2224/73265H01L2924/10155H01L2924/00014H01L2924/00
    • Radiation-emitting semiconductor device, method for fabricating same and radiation-emitting optical device. A radiation-emitting semiconductor device with a multilayer structure (100) comprising a radiation-emitting active layer (10), with electrical contacts (30, 40) for impressing a current in the multilayer structure (100) and with a radiotransparent window layer (20). The window layer is arranged exclusively on the side of the multilayer structure (100) facing away from a main direction of radiation of the semiconductor device and has at least one side wall that includes a first side wall portion (20a) which extends obliquely, concavely or in a stepwise manner toward a central axis of the semiconductor device lying perpendicular to the multilayer sequence. In its subsequent extension toward the back side, viewed from the multilayer structure, the side wall changes over into a second side wall portion (20b) that extends perpendicularly to the multilayer structure, that is, parallel to the central axis, and the portion of the window layer (20) encompassing the second side wall portion (20b) forms a mounting pedestal for the semiconductor device. The first and second side wall portions are fabricated especially preferably by means of a saw blade having a shaped edge. In a preferred optical device, the semiconductor device is mounted window layer downward in a reflector cup.
    • 辐射发射半导体器件,其制造方法和发射光学器件。 一种具有多层结构(100)的辐射发射半导体器件(100),包括辐射发射有源层(10),具有用于在多层结构(100)中施加电流的电触点(30,40)以及无线电透过窗口层 20)。 窗层仅排列在背离半导体器件的主辐射方向的多层结构(100)的侧面上,并具有至少一个侧壁,该侧壁包括第一侧壁部分(20a),该第一侧壁部分倾斜地, 或者以逐步的方式朝向垂直于多层序列的半导体器件的中心轴线。 在从多层结构观察的随后的向后延伸的过程中,侧壁转变成垂直于多层结构延伸的第二侧壁部分(20b),即平行于中心轴线的部分 包围第二侧壁部分(20b)的窗口层(20)形成用于半导体器件的安装基座。 第一和第二侧壁部分特别优选地通过具有成形边缘的锯片来制造。 在优选的光学器件中,半导体器件将窗口层向下安装在反射杯中。
    • 7. 发明授权
    • Radiation emitting semiconductor device
    • 辐射发射半导体器件
    • US06730939B2
    • 2004-05-04
    • US09781753
    • 2001-02-12
    • Dominik EisertVolker HaerleFrank KuehnManfred Mundbrod-VangerowUwe StraussUlrich Zehnder
    • Dominik EisertVolker HaerleFrank KuehnManfred Mundbrod-VangerowUwe StraussUlrich Zehnder
    • H01L3300
    • H01L33/20H01L33/0079H01L33/22H01L33/38H01L33/405H01L33/60H01L2224/32245H01L2224/32257H01L2224/48091H01L2224/48247H01L2224/48465H01L2224/73265H01L2924/10155H01L2924/00014H01L2924/00
    • A radiation-emitting semiconductor device with a multilayer structure comprising a radiation-emitting active layer, with electrical contacts for impressing a current in the multilayer structure and with a radiotransparent window layer. The window layer is arranged exclusively on the side of the multilayer structure facing away from a main direction of radiation of the semiconductor device and has at least one side wall that includes a first side wall portion which extends obliquely, concavely or in a stepwise manner toward a central axis of the semiconductor device lying perpendicular to the multilayer sequence. In its subsequent extension toward the back side, viewed from the multilayer structure, the side wall changes over into a second side wall portion that extends perpendicularly to the multilayer structure, that is, parallel to the central axis, and the portion of the window layer encompassing the second side wall portion forms a mounting pedestal for the semiconductor device. The first and second side wall portions are fabricated especially preferably by means of a saw blade having a shaped edge. In a preferred optical device, the semiconductor device is mounted window layer downward in a reflector cup.
    • 一种具有多层结构的辐射发射半导体器件,包括发射有辐射的有源层,具有用于在多层结构中施加电流的电触点和无线电透过窗口层。 窗层仅排列在背离半导体器件的主辐射方向的多层结构的侧面上,并且具有至少一个侧壁,该侧壁包括第一侧壁部分,该第一侧壁部分倾斜地,凹形地或逐步地向着 半导体器件的垂直于多层序列的中心轴线。 在从多层结构观察的其后向后侧的延伸中,侧壁转变成垂直于多层结构延伸的第二侧壁部分,即平行于中心轴线的部分和窗口层的部分 包围第二侧壁部分形成用于半导体器件的安装基座。 第一和第二侧壁部分特别优选地通过具有成形边缘的锯片来制造。 在优选的光学器件中,半导体器件将窗口层向下安装在反射杯中。