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1. 发明授权

US09048124B2 Heat sinking and electromagnetic shielding structures 有权
标题翻译：散热和电磁屏蔽结构
公开(公告)号：US09048124B2
公开(公告)日：2015-06-02
申请号：US13623436
申请日：2012-09-20
申请人： Dominic E. Dolci , James G. Smeenge , Vinh H. Diep , Chiew-Siang Goh
发明人： Dominic E. Dolci , James G. Smeenge , Vinh H. Diep , Chiew-Siang Goh
IPC分类号： H05K7/20 , H01L23/10 , H01L23/552 , H01L23/40 , H01L23/473 , H01L23/00 , H01L25/065 , H01L23/373
CPC分类号： H01L23/10 , H01L23/373 , H01L23/3736 , H01L23/40 , H01L23/4006 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/0655 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73253 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1434 , H01L2924/16251 , H01L2924/167 , H01L2924/014 , H01L2924/00
摘要： An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat.
摘要翻译：电子设备可以设置有诸如射频收发机集成电路和对电磁干扰敏感的其他集成电路的电子部件。金属结构被配置成同时用作电气部件的散热结构和电磁干扰屏蔽。使用焊料将部件安装到基板上。金属栅栏结构也焊接到基板上。每个金属围栏具有覆盖相应的一个部件的开口。导热弹性体间隙填充垫安装在开口中。使用围绕间隙填充垫的导电垫片将金属散热结构电气短路到栅栏，使得该结构用作电磁干扰屏蔽。来自组件的热量穿过间隙填充垫移动到金属散热结构，使得散热结构可以横向扩散并散热。

2. 发明申请

US20140078677A1 Heat Sinking and Electromagnetic Shielding Structures 有权
标题翻译：散热和电磁屏蔽结构
公开(公告)号：US20140078677A1
公开(公告)日：2014-03-20
申请号：US13623436
申请日：2012-09-20
申请人： Dominic E. Dolci , James G. Smeenge , Vinh H. Diep , Chiew-Siang Goh
发明人： Dominic E. Dolci , James G. Smeenge , Vinh H. Diep , Chiew-Siang Goh
IPC分类号： H05K7/20 , H05K9/00
CPC分类号： H01L23/10 , H01L23/373 , H01L23/3736 , H01L23/40 , H01L23/4006 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/0655 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73253 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1434 , H01L2924/16251 , H01L2924/167 , H01L2924/014 , H01L2924/00
摘要： An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat.
摘要翻译：电子设备可以设置有诸如射频收发机集成电路和对电磁干扰敏感的其他集成电路的电子部件。金属结构被配置成同时用作电气部件的散热结构和电磁干扰屏蔽。使用焊料将部件安装到基板上。金属栅栏结构也焊接到基板上。每个金属围栏具有覆盖相应的一个部件的开口。导热弹性体间隙填充垫安装在开口中。使用围绕间隙填充垫的导电垫片将金属散热结构电气短路到栅栏，使得该结构用作电磁干扰屏蔽。来自组件的热量穿过间隙填充垫移动到金属散热结构，使得散热结构可以横向扩散并散热。

3. 发明授权

US08493740B2 Component retention mechanism 失效
标题翻译：组件保留机制
公开(公告)号：US08493740B2
公开(公告)日：2013-07-23
申请号：US13175673
申请日：2011-07-01
申请人： Vinh H. Diep , Giles Matthew Lowe , Peter Russell-Clarke , Phillip Satterfield , Clark Everett Waterfall , Alex Chun lap Yeung
发明人： Vinh H. Diep , Giles Matthew Lowe , Peter Russell-Clarke , Phillip Satterfield , Clark Everett Waterfall , Alex Chun lap Yeung
IPC分类号： H05K5/00
CPC分类号： G06F13/409
摘要： A component retention mechanism facilitates improved installation, retention and removal of hardware components (e.g., PCI cards) on a personal computer. The retention mechanism includes a locking component, support member, and release mechanism coupled to each other. The locking component can be a steel bar or other stiff item positioned proximate to multiple socket connectors on a circuit board. The locking component moves between unlocked and locked positions that mechanically and simultaneously unlock or lock in place multiple add-in cards inserted into the socket connectors. The support member moves and thereby facilitates movement of the locking component between locked and unlocked positions. The release mechanism facilitates movement of the support member and is actuated when a force is exerted by a user thereto. An associated slider housing coupled to the release mechanism and support member includes a fan, support shelves and a door that provides additional support to oversized PCI cards.
摘要翻译：组件保持机构有助于改进个人计算机上的硬件组件（例如，PCI卡）的安装，保持和移除。保持机构包括彼此联接的锁定部件，支撑部件和释放机构。锁定部件可以是靠近电路板上的多个插座连接器定位的钢筋或其他刚性物品。锁定组件在解锁和锁定位置之间移动，机械地同时解锁或锁定插入插座连接器中的多个附加卡。支撑构件移动并且因此有助于锁定部件在锁定位置和解锁位置之间的移动。释放机构便于支撑构件的移动，并且当用户施加力时致动该释放机构。耦合到释放机构和支撑构件的相关联的滑动器壳体包括风扇，支撑架和门，其为超大的PCI卡提供额外的支撑。

4. 发明授权

US07995350B2 Component retention mechanism 失效
标题翻译：组件保留机制
公开(公告)号：US07995350B2
公开(公告)日：2011-08-09
申请号：US12340413
申请日：2008-12-19
申请人： Vinh H. Diep , Giles Matthew Lowe , Peter Russell-Clarke , Phillip Satterfield , Clark Everett Waterfall , Alex Chun lap Yeung
发明人： Vinh H. Diep , Giles Matthew Lowe , Peter Russell-Clarke , Phillip Satterfield , Clark Everett Waterfall , Alex Chun lap Yeung
IPC分类号： H05K5/00
CPC分类号： G06F13/409
摘要： A component retention mechanism facilitates improved installation, retention and removal of hardware components (e.g., PCI cards) on a personal computer. The retention mechanism includes a locking component, support member, and release mechanism coupled to each other. The locking component can be a steel bar or other stiff item positioned proximate to multiple socket connectors on a circuit board. The locking component moves between unlocked and locked positions that mechanically and simultaneously unlock or lock in place multiple add-in cards inserted into the socket connectors. The support member moves and thereby facilitates movement of the locking component between locked and unlocked positions. The release mechanism facilitates movement of the support member and is actuated when a force is exerted by a user thereto. An associated slider housing coupled to the release mechanism and support member includes a fan, support shelves and a door that provides additional support to oversized PCI cards.
摘要翻译：组件保持机构有助于改进个人计算机上的硬件组件（例如，PCI卡）的安装，保持和移除。保持机构包括彼此联接的锁定部件，支撑部件和释放机构。锁定部件可以是靠近电路板上的多个插座连接器定位的钢筋或其他刚性物品。锁定组件在解锁和锁定位置之间移动，机械地同时解锁或锁定插入插座连接器中的多个附加卡。支撑构件移动并且因此有助于锁定部件在锁定位置和解锁位置之间的移动。释放机构便于支撑构件的移动，并且当用户施加力时致动该释放机构。耦合到释放机构和支撑构件的相关联的滑动器壳体包括风扇，支撑架和门，其为超大的PCI卡提供额外的支撑。

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