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1. 发明授权

US4360560A Base material for the production of printed circuits and process for the preparation of the base material 失效
标题翻译：用于生产印刷电路的基材和用于制备基材的方法
公开(公告)号：US4360560A
公开(公告)日：1982-11-23
申请号：US18734
申请日：1979-03-08
申请人： Siegfried Kopnick , Dirk Huthwelker , Arnold Franz , Lothar Jacob
发明人： Siegfried Kopnick , Dirk Huthwelker , Arnold Franz , Lothar Jacob
IPC分类号： B32B29/00 , H05K1/03 , H05K3/18 , H05K3/38 , B32B27/04 , B32B27/30 , B32B27/42 , B32B31/12 , H05K1/00
CPC分类号： H05K1/036 , B32B29/00 , H05K3/387 , H05K2201/0133 , H05K2201/0284 , H05K2201/0293 , H05K2203/1476 , H05K3/181 , Y10S428/901 , Y10T428/31877 , Y10T442/3561 , Y10T442/3577
摘要： A base material for the production of printed circuits according to the additive method includes a laminate base made up of laminated-together core sheets impregnated with hardenable resin, and a cover layer made up of a substrate sheet preimpregnated with phenolic resol resin and provided with an adhesive layer of an elastomeric polymer. The preimpregnated substrate sheet is also provided with a further resin impregnation containing a self-crosslinking copolymer of acrylic monomers and up to 30% by weight of a hardenable phenolic resol resin.
摘要翻译：用于根据添加剂方法生产印刷电路的基材包括由浸渍有可硬化树脂的层叠在一起的芯片构成的层叠基材和由预先浸渍有酚醛树脂树脂的基材片构成的覆盖层，弹性体聚合物的粘合剂层。预浸渍的基材片还具有进一步的树脂浸渍，其含有丙烯酸单体的自交联共聚物和最多30重量％的可硬化酚醛树脂树脂。

2. 发明授权

US4317856A Insulating-material bodies having metal particles dispersed in the resin 失效
标题翻译：具有分散在树脂中的金属颗粒的绝缘材料体
公开(公告)号：US4317856A
公开(公告)日：1982-03-02
申请号：US99224
申请日：1979-11-30
申请人： Dirk Huthwelker , Arnold Franz , Siegfried Kopnick
发明人： Dirk Huthwelker , Arnold Franz , Siegfried Kopnick
IPC分类号： C08K3/00 , B32B15/04 , B32B15/08 , B32B27/18 , C08K3/10 , C23C18/20 , H05K1/03 , B32B15/00
CPC分类号： C23C18/206 , C23C18/2033 , C23C18/30 , Y10S428/901 , Y10T428/31678 , Y10T428/31703 , Y10T428/31971 , Y10T442/2475
摘要： The inclusion of metal particles finely and essentially statistically distributed in an insulating-material body which can be coated with a metal without use of an electric current is described wherein a solution of a reducible metal compound of a metal of Group VIII or Ib is employed. The solution can be added to a resin impregnating solution for the insulating material or to the adhesive of one or more adhesive layers in the insulating material. The solution of metal preferably contains a small amount of ammonium chloride.
摘要翻译：描述了将金属颗粒精细地并且基本上统计分布在绝缘材料体中，其中可以用金属涂覆而不使用电流，其中使用了可以使用第VIII或Ib族金属的可还原金属化合物的溶液。该溶液可以添加到用于绝缘材料的树脂浸渍溶液或绝缘材料中的一个或多个粘合剂层的粘合剂上。金属溶液优选含有少量氯化铵。

3. 发明授权

US5525181A Method of manufacturing a multilayer printed circuit board having first and second conducting patterns connected through an adhesive layer and laminate for the manufacture of such a printed circuit board 失效
标题翻译：制造具有通过粘合剂层连接的第一和第二导电图案和用于制造这种印刷电路板的层压板的多层印刷电路板的制造方法
公开(公告)号：US5525181A
公开(公告)日：1996-06-11
申请号：US310825
申请日：1994-09-22
申请人： Helmut Bruckner , Siegfried Kopnick , Werner Uggowitzer
发明人： Helmut Bruckner , Siegfried Kopnick , Werner Uggowitzer
IPC分类号： H05K3/38 , H05K1/00 , H05K3/34 , H05K3/40 , H05K3/46 , B32B31/10
CPC分类号： H05K3/4084 , H05K3/4652 , H05K2201/0305 , H05K2201/0355 , H05K2201/091 , H05K2203/063 , H05K3/3447 , H05K3/3452 , H05K3/4007 , H05K3/4038 , H05K3/4676 , Y10T156/109 , Y10T156/1092 , Y10T156/1093 , Y10T29/49155
摘要： Two-layer or multilayer printed circuit board, method of manufacturing such a printed circuit board, and laminate for the manufacture of such a printed circuit board by such a method.A two-layer or multilayer printed circuit board (1) comprises a support plate (2) which consists of a basic material and which carries a first conductor pattern (3) and a second conductor pattern (17) connected to the support plate (2) via an adhesive layer (11)consisting of an electrically insulating adhesive material. At least one opening (12, 13) is provided in the adhesive layer (1 1), which opening leads to a connecting section (4, 5) of the first conductor pattern (3) and to which a connecting section (18, 19) of the second conductor pattern (17) extends, and by means of which the connecting sections (4, 5, 18, 19) of the two conductor patterns (3, 17) can be electrically interconnected by means of an electrically conducting material connection (28, 29). The adhesive layer (11) consists of an adhesive material which in a certain temperature range has a higher hardness than the region (2a) of the support plate (2) adjoining the first conductor pattern (3 ), and the first conductor pattern (3) is pressed into the support plate (2) by the adhesive layer (11) exclusively in its region covered by the adhesive layer (11) as a result of a pressing process for joining together the adhesive layer (11) and the support plate (2), while the region of each connecting section (4, 5) of the first conductor pattern (3) surrounded by an opening (12, 13) is given a curved shape in the direction of a connecting section (18, 19) of the second conductor pattern (17).
摘要翻译：双层或多层印刷电路板，这种印刷电路板的制造方法和用于通过这种方法制造这种印刷电路板的层压板。双层或多层印刷电路板（1）包括支撑板（2），支撑板（2）由基本材料组成并且承载第一导体图案（3）和连接到支撑板（2）的第二导体图案）通过由电绝缘粘合剂材料组成的粘合剂层（11）。至少一个开口（12,13）设置在粘合剂层（11）中，该开口通向第一导体图案（3）的连接部分（4,5）并且连接部分（18,19）第二导体图案（17）的延伸部分延伸，借助于这两个导体图案（3,17）的连接部分（4,5,18,19）可以通过导电材料连接（28,29）。粘合剂层（11）由在一定温度范围内具有比邻接第一导体图案（3）的支撑板（2）的区域（2a）更高的硬度的粘合剂材料和第一导体图案（3））通过粘合剂层（11）仅在粘合剂层（11）覆盖的区域中被压入支撑板（2）中，结果是将粘合剂层（11）和支撑板（11）接合在一起的压制工艺在由开口（12,13）围绕的第一导体图案（3）的每个连接部分（4,5）的区域在连接部分（18,19）的方向上被赋予弯曲形状第二导体图案（17）。

4. 发明授权

US5378858A Two-layer or multilayer printed circuit board 失效
标题翻译：双层或多层印刷电路板
公开(公告)号：US5378858A
公开(公告)日：1995-01-03
申请号：US966796
申请日：1992-10-27
申请人： Helmut Bruckner , Siegfried Kopnick , Werner Uggowitzer
发明人： Helmut Bruckner , Siegfried Kopnick , Werner Uggowitzer
IPC分类号： H05K3/38 , H05K1/00 , H05K3/34 , H05K3/40 , H05K3/46 , H01K1/02
CPC分类号： H05K3/4084 , H05K3/4652 , H05K2201/0305 , H05K2201/0355 , H05K2201/091 , H05K2203/063 , H05K3/3447 , H05K3/3452 , H05K3/4007 , H05K3/4038 , H05K3/4676 , Y10T156/109 , Y10T156/1092 , Y10T156/1093 , Y10T29/49155
摘要： A two-layer or multilayer printed circuit board (1) comprises a support plate (2) which consists of a basic material and which carries a first conductor pattern (3) and a second conductor pattern (17) connected to the support plate (2) via an adhesive layer (11) consisting of an electrically insulating adhesive material. At least one opening (12, 13) is provided in the adhesive layer (11), which opening leads to a connecting section (4, 5) of the first conductor pattern (3) and to which a connecting section (18, 19) of the second conductor pattern (17) extends, and by means of which the connecting sections (4, 5, 18, 19) of the two conductor patterns (3, 17) can be electrically interconnected by means of an electrically conducting material connection (28, 29). The adhesive layer (11) consists of an adhesive material which in a certain temperature range has a higher hardness than the region (2a) of the support plate (2) adjoining the first conductor pattern (3 ), and the first conductor pattern (3) is pressed into the support plate (2) by the adhesive layer (11) exclusively in its region covered by the adhesive layer (11) as a result of a pressing process for joining together the adhesive layer (11) and the support plate (2), while the region of each connecting section (4, 5) of the first conductor pattern (3) surrounded by an opening (12, 13) is given a curved shape in the direction of a connecting section (18, 19) of the second conductor pattern (17).
摘要翻译：双层或多层印刷电路板（1）包括支撑板（2），支撑板（2）由基本材料组成并且承载第一导体图案（3）和连接到支撑板（2）的第二导体图案）通过由电绝缘粘合剂材料组成的粘合剂层（11）。至少一个开口（12,13）设置在粘合剂层（11）中，该开口通向第一导体图案（3）的连接部分（4,5），连接部分（18,19）第二导体图案（17）的第二导体图案（17）延伸，并且借助于该导电图案（3,17）的两个导体图案（3,17）的连接部分（4,5,18,19）可以通过导电材料连接 28,29）。粘合剂层（11）由在一定温度范围内具有比邻接第一导体图案（3）的支撑板（2）的区域（2a）更高的硬度的粘合剂材料和第一导体图案（3））通过粘合剂层（11）仅在粘合剂层（11）覆盖的区域中被压入支撑板（2）中，结果是将粘合剂层（11）和支撑板（11）接合在一起的压制工艺在由开口（12,13）围绕的第一导体图案（3）的每个连接部分（4,5）的区域在连接部分（18,19）的方向上被赋予弯曲形状第二导体图案（17）。

5. 发明授权

US5560795A Process for manufacturing a printed circuit board and printed circuit board 失效
标题翻译：制造印刷电路板和印刷电路板的工艺
公开(公告)号：US5560795A
公开(公告)日：1996-10-01
申请号：US232166
申请日：1994-08-02
申请人： Helmut Bruckner , Siegfried Kopnick , Werner Uggowitzer
发明人： Helmut Bruckner , Siegfried Kopnick , Werner Uggowitzer
IPC分类号： H05K3/20 , H05K3/34 , H05K3/38 , H05K3/40 , H05K3/46 , B32B31/18 , B32B31/20
CPC分类号： H05K3/4652 , H05K3/4084 , H05K2201/0305 , H05K2201/0355 , H05K2201/091 , H05K2203/033 , H05K2203/063 , H05K3/3447 , H05K3/4038 , Y10T156/1046 , Y10T156/1056 , Y10T156/109 , Y10T156/1093 , Y10T29/49155 , Y10T29/49167
摘要： Producing a printed circuit board having at least two layers and having a carrier board, a first Conductor layer having contact areas and a second conductor layer having connecting areas, in which a conductive foil, provided with an adhesive coating, is laminated onto the carrier board having the first conductor layer and the contact areas, the adhesive coating an the conductive foal having holes which correspond with the contact areas of the first conductor layer. The perforated conductive foil, provided with the adhesive coating, is compressed and laminated with the carrier board having the first conductor layer, the contact areas of the first conductor layer being bulged at least partially through the holes in the adhesive coating in the direction of the surface of the connecting areas of the second conductor layer so that the surfaces of the contact areas are in each case at a distance from the surface of the connecting areas of the second conductor layer which is less than the thickness of the connecting areas. Subsequently, the second conductor layer having the connecting areas is produced from the conductive foil, the connecting areas of the second conductor layer bounding the holes in the adhesive coating, after which the contact areas of the first conductor layer can be electrically conductively connected to the corresponding connecting areas of the second conductor layer, through the holes in the adhesive coating.
摘要翻译： PCT No.PCT / EP92 / 02507 Sec。 371日期1994年8月2日 102（e）日期1994年8月2日PCT 1991年11月1日PCT PCT。公开号WO93 / 09655 日期：1993年5月13日生产具有至少两层并具有载体板的印刷电路板，具有接触区域的第一导体层和具有连接区域的第二导体层，其中设置有粘合剂涂层的导电箔被层压在具有第一导体层和接触区域的载体板上，粘合剂涂覆具有与第一导体层的接触面积相对应的孔的导电马俑。设置有粘合剂涂层的穿孔导电箔被压缩并与具有第一导体层的载体板层压，第一导体层的接触区域至少部分地通过粘合剂涂层中的孔沿着第二导体层的连接区域的表面，使得接触区域的表面在每种情况下距离第二导体层的连接区域的表面小于连接区域的厚度。随后，具有连接区域的第二导体层由导电箔制成，第二导体层的连接区域包围粘合剂涂层中的孔，之后第一导体层的接触面积可导电地连接到第二导体层的相应的连接区域，通过粘合剂涂层中的孔。

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