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    • 5. 发明授权
    • Process for delineating photoresist lines at pattern edges only using
image reversal composition with diazoquinone
    • 仅使用具有重氮醌的图像反转组合物在图案边缘处描绘光致抗蚀剂线的方法
    • US4568631A
    • 1986-02-04
    • US605088
    • 1984-04-30
    • Dinesh A. BadamiMark C. HakeyHolger Moritz
    • Dinesh A. BadamiMark C. HakeyHolger Moritz
    • H01L21/027G03F7/039G03F7/20G03F7/26G03F7/40H01L21/30G03C5/00
    • G03F7/40G03F7/039G03F7/20G03F7/2022
    • An optical photolithographic process in which resist lines having widths in the micron and sub-micron range are produced without the use of a fine line photomask. A positive photoresist having an additive for image reversal is applied to the surface of a semiconductor substrate. The photoresist is exposed through a photomask to ultraviolet light. The edges of the opaque sections of the mask diffract the ultraviolet light, forming partially exposed areas between the exposed and unexposed areas formed in the photoresist. After development in a solvent to remove the exposed areas, the photoresist undergoes an image reversal process. The photoresist is first baked at 100.degree. C. for 30 minutes. During this bake step, the photoactive decomposition products present in the partially exposed areas react, freezing the solubility of the partially exposed areas with respect to that of the unexposed areas. The photoresist is then blanket exposed and developed in a solvent, leaving the partially exposed areas on the substrate. The resulting thin resist lines can be used to form narrow isolation trenches by coating the substrate with a quartz film and lifting off the resist lines.
    • 在不使用细线光掩模的情况下制造具有微米和亚微米范围宽度的抗蚀剂线的光学光刻工艺。 将具有用于图像反转的添加剂的正性光致抗蚀剂施加到半导体衬底的表面。 光致抗蚀剂通过光掩模曝光到紫外光。 掩模的不透明部分的边缘衍射紫外光,在形成在光致抗蚀剂中的暴露区域和未曝光区域之间形成部分暴露的区域。 在溶剂中显影以除去曝光区域后,光致抗蚀剂经历图像反转过程。 光致抗蚀剂首先在100℃下烘烤30分钟。 在该烘烤步骤期间,存在于部分暴露的区域中的光敏分解产物反应,冻结部分曝光的区域相对于未曝光区域的溶解度。 然后将光致抗蚀剂铺展在一个溶剂中,将部分暴露的区域留在衬底上。 所得到的薄抗蚀剂线可以用于通过用石英膜涂覆基板并提起抗蚀剂线来形成窄的隔离沟槽。