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1. 发明授权

US4187827A Process for multiple lap cutting of solid materials 失效
标题翻译：固体材料多次切割的工艺
公开(公告)号：US4187827A
公开(公告)日：1980-02-12
申请号：US902514
申请日：1978-05-03
申请人： Dieter Regler , Erhard Sitrl , Alfred Moritz
发明人： Dieter Regler , Erhard Sitrl , Alfred Moritz
IPC分类号： B24B27/06 , B24B37/00 , B28D5/04 , B28D1/02
CPC分类号： B28D5/042
摘要： A process for the multiple lap cutting of solid materials, using a set of parallel, spaced apart blades mounted on the frame of a gang-saw for reciprocal movement over the solid materials to be cut, in a suspension of a lapping abrasive, wherein a pressure of from 100 to 1,000 gf per blade is exerted on the solid material, the free working length of the blades is held between 110 to 250 mm, and wherein the pressure applied to the blades is inversely proportional to the length of the blades, and the blades move through the solid material at a mean lateral speed of from 30 to 150 meters per minute.
摘要翻译：一种用于固体材料的多次切割的方法，使用安装在组合框架上的一组平行的间隔开的叶片，用于在研磨研磨剂的悬浮液中在要切割的固体材料上往复运动，其中a 每个叶片100至1,000gf的压力施加在固体材料上，叶片的自由工作长度保持在110至250mm之间，并且其中施加到叶片的压力与叶片的长度成反比，并且刀片以每分钟30到150米的平均横向速度穿过固体材料。

2. 发明授权

US4246003A Lap cutting abrasive 失效
标题翻译：搭接磨料
公开(公告)号：US4246003A
公开(公告)日：1981-01-20
申请号：US63653
申请日：1979-08-03
申请人： Dieter Regler , Alfred Moritz
发明人： Dieter Regler , Alfred Moritz
IPC分类号： C10M125/26 , B28D5/00 , B28D5/04 , C09K3/14 , C10M103/00 , C10M103/02 , C10M103/04 , C10M125/02 , C10M125/04 , C10N10/16 , C10N20/06 , C10N40/22 , C10N50/00 , C30B33/00 , B24D17/00
CPC分类号： B28D5/042 , B28D5/00 , B28D5/007 , C09K3/1472 , C30B33/00
摘要： A lap cutting abrasive for use with lap cutting blades, comprising one party weight of a low viscosity carrier liquid, and one to three parts by weight of cutting particles having an average size of from 10 to 50 .mu.m suspended in the carrier liquid. The carrier liquid has a viscosity of from 1 to 10 cP, and preferably is aqueous glycerin. The cutting particles preferably have an average particle size of from 15 to 30 .mu.m. In a further embodiment, the average particle size of the cutting particles is matched to the thickness of the lap cutting blade used during sawing. Preferably, the cutting particles have an average particle size corresponding to 0.15 to 0.1 times the thickness of the lap cutting blade used during sawing.
摘要翻译：一种用于搭接切割刀片的搭接切削磨料，其包含一重量份的低粘度载液，和1-3重量份悬浮在载体液体中的平均尺寸为10至50μm的切割颗粒。载液的粘度为1〜10cP，优选为甘油水溶液。切割颗粒的平均粒径优选为15〜30μm。在另一个实施例中，切割颗粒的平均粒度与锯切期间使用的搭接切割刀片的厚度相匹配。优选地，切割颗粒的平均粒度对应于在锯切期间使用的搭接切割刀片的厚度的0.15至0.1倍。

3. 发明授权

US4161167A Lap cutting blades 失效
标题翻译：搭接切割刀片
公开(公告)号：US4161167A
公开(公告)日：1979-07-17
申请号：US897837
申请日：1978-04-19
申请人： Dieter Regler , Alfred Moritz
发明人： Dieter Regler , Alfred Moritz
IPC分类号： B28D1/12 , B28D5/04 , B28D1/00 , B28D1/08
CPC分类号： B28D1/127 , B28D5/042
摘要： Lap cutting blades are provided which are useable for the multiple lap cung of solid materials, such as semiconductorrods. The blades each have a generally rectilinear cutting edge, the length of which is 1-75 times the thickness of the blade, as measured at its cutting edge. The cutting edge of each blade has rectilinear edge portions separated by a plurality of notched edge portions which, in turn, define a plurality of recesses which encompass 5 to 25% of the total blade length and 5 to 40% of the effective operating length of the blade. The notched blade edge portions define a notch angle of between 20 and 80 degrees, as measured between the tangent thereto at its point of intersection with the rectilinear cutting edge portion and a line perpendicular to the rectilinear cutting edge portion.
摘要翻译：提供搭接切割刀片，可用于固体材料（例如半导体路径）的多次搭接切割。叶片各自具有大致直线的切割边缘，其长度是在其切割边缘处测量的叶片的厚度的1-75倍。每个叶片的切割边缘具有由多个切口边缘部分分开的直线边缘部分，这些边缘部分又限定了多个凹陷，其包含总叶片长度的5至25％和有效操作长度的5至40％刀片。切口刀片边缘部分在与直线切割边缘部分的交点处的切线与垂直于直线切割边缘部分的直线之间测量的切线角度限定在20度和80度之间。

4. 发明授权

US4283242A Process for cementing semiconductor discs onto a carrier plate 失效
标题翻译：将半导体圆盘固定在载板上的工艺
公开(公告)号：US4283242A
公开(公告)日：1981-08-11
申请号：US73415
申请日：1979-09-07
申请人： Dieter Regler , Bruno Meissner , Alfred Moritz
发明人： Dieter Regler , Bruno Meissner , Alfred Moritz
IPC分类号： H01L21/304 , B24B37/27 , B24B37/34 , H01L21/302 , H01L21/673 , H01L21/68 , B32B31/22
CPC分类号： H01L21/302 , B24B37/27 , B24B37/345 , Y10S156/93 , Y10T156/11
摘要： An apparatus and process for cementing semiconductor discs onto a carrier ate, wherein after the carrier plate is coated with a layer of adhesive substance, the discs are applied to the adhesive layer and a vacuum-tight sealing dome is placed over the carrier plate to define a sealed, hollow space. A chemically-inert elastic diaphragm is clamped within the dome 0.2 to 1.5 mm above the free surface of the discs, to divide the hollow space into two sections or subchambers which are initially simulataneously evacuated. Then, air pressure is applied to the upper section, so that the discs are pressed by the diaphragm onto the cement layer. Air pressure is then subsequently fed to the lower hollow space, so that the dome can be removed from the carrier plate.
摘要翻译：一种用于将半导体盘固定到载体板上的装置和方法，其中在载体板上涂覆有粘合剂物质层之后，将盘施加到粘合剂层，并将真空密封的圆顶放置在载体板上以限定密封的中空空间。化学惰性的弹性膜片夹在圆盘自由表面以上0.2至1.5毫米的圆顶内，将中空空间分成最初同时抽真空的两个部分或子室。然后，将空气压力施加到上部，使得圆盘被隔膜压到水泥层上。然后随后将空气压力送入下部空腔，从而可以将圆顶从载体板上取下。

5. 发明授权

US4733649A Process and apparatus for multiple lap cutting of solid materials 失效
标题翻译：固体材料多次切割的工艺和设备
公开(公告)号：US4733649A
公开(公告)日：1988-03-29
申请号：US709589
申请日：1985-03-08
申请人： Dieter Regler , Alfred Moritz , Klemens Muhlbauer
发明人： Dieter Regler , Alfred Moritz , Klemens Muhlbauer
IPC分类号： B24B27/06 , B28D5/00 , B28D5/04 , B28D1/02
CPC分类号： B28D5/042 , B28D5/0058
摘要： A process and an apparatus for carrying out a process for multiple lap cutting of solid materials, especially those having rectangular or square cross sections, in which the workpiece is subjected, during the cutting operation, to a rotating motion thereby improving the quality of the discs and increasing the cutting efficiency.
摘要翻译：一种用于在切割操作期间执行固体材料，特别是具有矩形或正方形截面的多次搭接切割工艺的方法和装置，其中工件在切割操作期间经受旋转运动，从而提高盘的质量并提高切割效率。

6. 发明授权

US4204515A Apparatus for machining workpieces by abrasion 失效
标题翻译：用于通过磨损加工工件的装置
公开(公告)号：US4204515A
公开(公告)日：1980-05-27
申请号：US934770
申请日：1978-08-17
申请人： Dieter Seifert , Dieter Regler , Volker Ofenmacher , Alfred Moritz , August Freudlsperger , Walter Berger
发明人： Dieter Seifert , Dieter Regler , Volker Ofenmacher , Alfred Moritz , August Freudlsperger , Walter Berger
IPC分类号： B24B27/06 , B24B1/04 , B28D5/04 , H01L21/304 , B28D1/06
CPC分类号： B28D5/042
摘要： Apparatus for machining workpieces by abrasion by means of an oscillating ltiple-blade tool, which is moved across the workpiece. The moved masses define an oscillatory system, as a result of which the energy can be stored in the reversal ranges by a buffer system. This apparatus, especially when designed as a lap-cutting machine for cutting semiconductor rods, is preferably driven by the oscillation of the masses to be moved, and is driven in the resonance range. The tool carriages are buffer loaded at each end and are oscillated at or near the natural resonance frequency of the moving masses.
摘要翻译：用于通过在工件上移动的摆动多刀工具进行磨损来加工工件的装置。移动的质量定义了振荡系统，其结果是可以通过缓冲系统将能量存储在反转范围内。该设备特别是当设计为用于切割半导体棒的搭接切割机时，优选地由待移动的质量块的振荡驱动，并且在谐振范围内被驱动。工具托架在每个端部缓冲加载，并且在移动质量的固有共振频率处或附近振荡。

7. 发明授权

US4300965A Process for cementing semiconductor discs to carrier plates and product so obtained 失效
标题翻译：将半导体盘固定到载板上的方法和如此获得的产品的工艺
公开(公告)号：US4300965A
公开(公告)日：1981-11-17
申请号：US766457
申请日：1977-02-07
申请人： Dietrich Schmidt , Bruno Meissner , Heinz-Jorg Rath , Dieter Regler , Jurgen Voss
发明人： Dietrich Schmidt , Bruno Meissner , Heinz-Jorg Rath , Dieter Regler , Jurgen Voss
IPC分类号： H01L21/304 , H01L21/302 , H01L21/673 , B32B31/00
CPC分类号： H01L21/302 , Y10S156/93 , Y10T156/1092 , Y10T156/11
摘要： Process for cementing semiconductor discs to a carrier plate for subsequentolishing, which comprises applying to the discs a cementing solution being composed of(a) a resin of a melting range between 50.degree. and 180.degree. C. and a melt viscosity between 1000 and 6000 P;(b) a substance acting as plasticizer for the resin at cementing temperatures; and(c) a solvent for the resin and the plasticizer, which evaporizes at cementing temperatures,while avoiding during the application the occlusion of air bubbles between discs and cementing layer, and exerting pressure onto the plates at a temperature between cementing temperatures and 30.degree. C. below the same. The invention also comprises the carrier plate carrying one or more discs cemented thereto by the above process.
摘要翻译：用于将半导体盘固定到用于随后抛光的载体板上的方法，其包括向所述盘施加胶结剂溶液，所述胶结溶液由（a）熔点在50℃和180℃之间的熔融温度和1000至6000℃之间的熔融粘度 P; （b）在固井温度下作为树脂增塑剂的物质; 和（c）用于树脂和增塑剂的溶剂，其在固结温度下蒸发，同时在施加期间避免在圆盘和固井层之间堵塞气泡，并且在固井温度和30℃之间的温度下施加压力 C.下同。本发明还包括承载板，其承载通过上述方法粘合到其上的一个或多个盘。

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