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1. 发明授权

US08256498B2 Heat dissipation apparatus having heat pipes inserted therein 有权
标题翻译：具有插入其中的热管的散热装置
公开(公告)号：US08256498B2
公开(公告)日：2012-09-04
申请号：US12331390
申请日：2008-12-09
申请人： Hong-Bo Deng , Di-Qiong Zhao , Ye Chen
发明人： Hong-Bo Deng , Di-Qiong Zhao , Ye Chen
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/467 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus includes a heat sink and a pair of first heat pipes. The heat sink includes a pair of first fin assemblies staggered with a pair of second fin assemblies. The first and second fin assemblies each define a receiving groove therein. The second fin assemblies each further defines an opening communicating with the receiving groove of a corresponding second fin assembly. The first heat pipes each include an evaporation section and a condensation section. A portion of the condensation section of each of the first heat pipes is inserted into the receiving groove of each of the first fin assemblies. The other portion of the condensation section of each of the first heat pipes is received in the receiving groove of each of the second fin assemblies through the opening.
摘要翻译：散热装置包括散热器和一对第一热管。散热器包括与一对第二鳍组件交错的一对第一翅片组件。第一和第二翅片组件每个在其中限定接收凹槽。第二翅片组件还限定了与对应的第二翅片组件的接收槽连通的开口。第一热管各自包括蒸发部和冷凝部。每个第一热管的冷凝部分的一部分插入到每个第一散热片组件的接收槽中。每个第一热管的冷凝部分的另一部分通过开口容纳在每个第二散热片组件的接收槽中。

2. 发明授权

US07796387B2 Heat dissipation apparatus having a fan received therein 失效
标题翻译：散热装置具有容纳在其中的风扇
公开(公告)号：US07796387B2
公开(公告)日：2010-09-14
申请号：US12331391
申请日：2008-12-09
申请人： Hong-Bo Deng , Di-Qiong Zhao , Ye Chen
发明人： Hong-Bo Deng , Di-Qiong Zhao , Ye Chen
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus includes a heat sink and a fan. The heat sink defines a recessed space at a center of a top end thereof, and an engaging groove in an inner circumference of the top end of the heat sink surrounding and communicating with the space. The fan includes a frame and an impeller assembled to the frame. A plurality of legs extends downwardly from the frame. Each of the legs includes a hook at a free end thereof. The hooks of the legs engage in the engaging groove of the heat sink for securely mounting the fan in the recessed space of the heat sink. Heat pipes extend through the heat sink and connect with a base.
摘要翻译：散热装置包括散热器和风扇。散热器在其顶端的中心处限定凹陷空间，并且散热器的顶端的内圆周中的接合槽围绕并与空间连通。风扇包括框架和组装到框架上的叶轮。多个腿从框架向下延伸。每个腿在其自由端包括钩。腿的钩接合散热器的接合槽，用于将风扇牢固地安装在散热器的凹陷空间中。热管延伸穿过散热器并与基座连接。

3. 外观设计

USD597498S1 Heat dissipation device 有权
公开(公告)号：USD597498S1
公开(公告)日：2009-08-04
申请号：US29321528
申请日：2008-07-18
申请人： Di-Qiong Zhao , Hong-Bo Deng , Ye Chen
设计人： Di-Qiong Zhao , Hong-Bo Deng , Ye Chen

4. 外观设计

USD593511S1 Heat dissipation device 有权
公开(公告)号：USD593511S1
公开(公告)日：2009-06-02
申请号：US29321527
申请日：2008-07-18
申请人： Hong-Bo Deng , Di-Qiong Zhao , Ye Chen
设计人： Hong-Bo Deng , Di-Qiong Zhao , Ye Chen

5. 发明授权

US07142426B2 Heat dissipating device and method for manufacturing it 失效
标题翻译：散热装置及其制造方法
公开(公告)号：US07142426B2
公开(公告)日：2006-11-28
申请号：US11015984
申请日：2004-12-17
申请人： Gen-Cai Wang , Di-Qiong Zhao , Yi-Chyng Fang
发明人： Gen-Cai Wang , Di-Qiong Zhao , Yi-Chyng Fang
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an integrally formed body defining a round hole therein. The pressing portion extends beyond the clip and presses the body of the clip on the heat sink. The method for manufacturing the heat dissipating device as above-mentioned includes the following steps: providing a heat sink with a collar formed thereon; providing a clip on the heat sink with the collar extending beyond the clip; having the collar deformed under pressure to form a pressing portion pressing the clip on the heat sink.
摘要翻译：散热装置包括在其上形成按压部的散热片和夹子。散热器包括中空的散热构件和柱状芯，并且夹具包括在其中限定圆孔的整体形成的主体。按压部分延伸超过夹子并将夹子的主体按压在散热器上。如上所述的制造散热装置的方法包括以下步骤：提供具有形成在其上的轴环的散热器; 在衣架上延伸超过夹子提供散热器上的夹子; 使得衣领在压力下变形以形成将夹子压在散热器上的按压部分。

6. 外观设计

USD579423S1 Heat sink 有权
公开(公告)号：USD579423S1
公开(公告)日：2008-10-28
申请号：US29297784
申请日：2007-11-19
申请人： Yuh-Ching Chang , Ming-Kun Cao , Di-Qiong Zhao
设计人： Yuh-Ching Chang , Ming-Kun Cao , Di-Qiong Zhao

7. 发明申请

US20060034058A1 Heat dissipating device and method for manufacturing it 失效
公开(公告)号：US20060034058A1
公开(公告)日：2006-02-16
申请号：US11015984
申请日：2004-12-17
申请人： Gen-Cai Wang , Di-Qiong Zhao , Yi-Chyng Fang
发明人： Gen-Cai Wang , Di-Qiong Zhao , Yi-Chyng Fang
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an integrally formed body defining a round hole therein. The pressing portion extends beyond the clip and presses the body of the clip on the heat sink. The method for manufacturing the heat dissipating device as above-mentioned includes the following steps: providing a heat sink with a collar formed thereon; providing a clip on the heat sink with the collar extending beyond the clip; having the collar deformed under pressure to form a pressing portion pressing the clip on the heat sink.

8. 发明授权

US07755897B2 Memory module assembly with heat dissipation device 失效
标题翻译：带散热装置的内存组件
公开(公告)号：US07755897B2
公开(公告)日：2010-07-13
申请号：US11964896
申请日：2007-12-27
申请人： Fei Chen , Di-Qiong Zhao , Yi-Chyng Fang , Yue-Bin Wang
发明人： Fei Chen , Di-Qiong Zhao , Yi-Chyng Fang , Yue-Bin Wang
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.
摘要翻译：存储模块组件（100）包括具有右侧表面（240）和左侧表面（220），散热器（400）和热管（500）的存储卡（200）。散热器包括附接到存储卡的左侧表面的基座构件（420）和附接到存储卡的右侧表面并联接到基座构件的外壳（440）。基座部件包括安装在存储卡的左侧表面上的基板部分（422）和从基板部分延伸并支撑在存储卡的顶部边缘上的支撑部分（424）。热管包括与外壳和基板部分中的一个热接合的蒸发器（520）和与支撑部分热接合的冷凝器（540）。

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