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    • 7. 发明授权
    • Methods of forming semiconductor devices having buried oxide patterns
    • 形成具有掩埋氧化物图案的半导体器件的方法
    • US07320908B2
    • 2008-01-22
    • US11072103
    • 2005-03-04
    • Yong-Hoon SonSi-Young ChoiByeong-Chan LeeJong-Wook LeeIn-Soo JungDeok-Hyung Lee
    • Yong-Hoon SonSi-Young ChoiByeong-Chan LeeJong-Wook LeeIn-Soo JungDeok-Hyung Lee
    • H01L21/338
    • H01L29/7851H01L21/823481H01L29/0653H01L29/66545H01L29/66621
    • Methods for forming semiconductor devices are provided. A semiconductor substrate is etched such that the semiconductor substrate defines a trench and a preliminary active pattern. The trench has a floor and a sidewall. An insulating layer is provided on the floor and the sidewall of the trench and a spacer is formed on the insulating layer such that the spacer is on the sidewall of the trench and on a portion of the floor of the trench. The insulating layer is removed on the floor of the trench and beneath the spacer such that a portion of the floor of the trench is at least partially exposed, the spacer is spaced apart from the floor of the trench and a portion of the preliminary active pattern is partially exposed. A portion of the exposed portion of the preliminary active pattern is partially removed to provide an active pattern that defines a recessed portion beneath the spacer. A buried insulating layer is formed in the recessed portion of the active pattern. Related devices are also provided.
    • 提供了形成半导体器件的方法。 蚀刻半导体衬底,使得半导体衬底限定沟槽和初步活性图案。 沟槽具有地板和侧壁。 绝缘层设置在地板上,并且沟槽的侧壁和间隔件形成在绝缘层上,使得间隔件位于沟槽的侧壁和沟槽底部的一部分上。 绝缘层在沟槽的地板上移除并且在间隔物的下面被移除,使得沟槽的底部的一部分至少部分地露出,间隔物与沟槽的底部间隔开,并且预活性图案的一部分 部分暴露。 部分地去除预活性图案的暴露部分的一部分以提供在间隔物下方限定凹陷部分的活性图案。 在活性图案的凹部中形成掩埋绝缘层。 还提供了相关设备。