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1. 发明申请

US20070001290A1 Semiconductor packaging structure 审中-公开
标题翻译：半导体封装结构
公开(公告)号：US20070001290A1
公开(公告)日：2007-01-04
申请号：US11280198
申请日：2005-11-17
申请人： Daw-Heng Wong , Shr-Hau Hung , Tsung-Kang Ying
发明人： Daw-Heng Wong , Shr-Hau Hung , Tsung-Kang Ying
IPC分类号： H01L23/34
CPC分类号： H01L33/642 , H01L23/3677 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor packaging structure includes a baseboard, a semiconductor chip set, a thermal conductor, a package and a heat sink. The thermal conductor is located on the baseboard. The semiconductor chip set is directly mounted onto the thermal conductor. The heat sink is coupled on the thermal conductor. Hence heat energy generated by the semiconductor chip set, when electrically energized, is transferred through the thermal conductor to the heat sink, to perform heat exchange.
摘要翻译：半导体封装结构包括基板，半导体芯片组，热导体，封装和散热器。导热体位于基板上。半导体芯片组直接安装在热导体上。散热器耦合在热导体上。因此，当通电时，由半导体芯片组产生的热能通过导热体传递到散热器，进行热交换。

2. 发明授权

US07259401B2 Reflection-type optoelectronic semiconductor device 失效
标题翻译：反射型光电半导体器件
公开(公告)号：US07259401B2
公开(公告)日：2007-08-21
申请号：US10923025
申请日：2004-08-23
申请人： Daw-Heng Wong , Hung-Yuan Su
发明人： Daw-Heng Wong , Hung-Yuan Su
IPC分类号： H01L29/22 , H01L29/24
CPC分类号： H01L33/60 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A reflection-type optoelectronic semiconductor device has an LED chip disposed on a first conducting wire portion, a second conducting wire portion connected to the LED chip via a connection wire, a packaging body for sealing the LED chip and part of the first conducting wire portion and the second conducting wire portion, a reflecting face disposed in an opposite direction of a light emission face of the LED chip and surrounding the packaging body, and an optical spectrum conversion layer coated onto the packaging body. A primary light emitted by the LED chip is reflected to the optical spectrum conversion layer by the reflecting face to undergo light excitation for producing a secondary light. The primary light and the secondary light are combined to generate a mixed light. A lens can be placed in the travel direction of the mixed light to change the distribution of the mixed light.
摘要翻译：反射型光电子半导体器件具有设置在第一导线部分上的LED芯片，经由连接线连接到LED芯片的第二导线部分，用于密封LED芯片的封装体和第一导线部分的一部分所述第二导线部，与所述LED芯片的发光面相反的方向配置并包围所述封装体的反射面以及涂覆在所述封装体上的光谱转换层。由LED芯片发射的初级光被反射面反射到光谱转换层，以进行用于产生二次光的光激发。初级光和次级光被组合以产生混合光。可以将透镜放置在混合光的行进方向上以改变混合光的分布。

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