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1. 发明授权

US07066731B2 Method for conditioning/heat treatment 失效
标题翻译：调理/热处理方法
公开(公告)号：US07066731B2
公开(公告)日：2006-06-27
申请号：US10839637
申请日：2004-05-05
申请人： Davide F. Tenaglia , Ken-Ichi Shimazu
发明人： Davide F. Tenaglia , Ken-Ichi Shimazu
IPC分类号： F27D5/00
CPC分类号： F27D5/00 , F27D3/12
摘要： A method for heat treatment of printing plates includes arranging a plurality of printing plates into a stack, interspersing a plurality of thermally conductive plates at a plurality of levels in the stack, and placing the stack of plurality of printing plates with the interspersed conductive plates in an ambient of heated medium, wherein the conductive plates are larger laterally than the printing plates such that portions of the top and bottom surfaces of the conductive plates are exposed to the ambient of heated medium and thereby collect and conduct heat into the interior regions of the stack where the conductive plates are in thermal contact with, heating the interior regions up at a higher rate than would be achieved without the conductive plates in place.
摘要翻译：印刷板的热处理方法包括将多个印版布置成堆叠，在堆叠中以多个级别散布多个导热板，并将多个印版的叠层放置在散布的导电板中加热介质的环境，其中导电板比印刷板横向更大，使得导电板的顶表面和底表面的部分暴露于加热介质的环境，从而收集并将热量传导到导电板与之接触的叠层，以比没有导电板就位的情况更高的速率加热内部区域。

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