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    • 3. 发明授权
    • Alignment correction technique
    • 校准校正技术
    • US4595836A
    • 1986-06-17
    • US626368
    • 1984-06-29
    • Robert A. Simpson
    • Robert A. Simpson
    • G01N23/203G01R19/00H01J37/304G01N23/00
    • H01J37/3045G01R19/0038
    • An E-beam alignment correction system employing an up-up integration technique. Input signals during each scan period are integrated and digitized then held in respective registers. The value in one register is converted to its negative value then digitally combined with the other value to generate an alignment correction value. This technique eliminates the requirement of positive and negative integrations needed with up-down integration techniques and droop of the sample and hold device as a function of time. A common analog path is used so that errors add out during digital combination of signal values.
    • 采用上行集成技术的电子束对准校正系统。 每个扫描周期内的输入信号被积分并数字化,然后保存在相应的寄存器中。 一个寄存器中的值转换为负值,然后与另一个值进行数字组合,以生成对齐校正值。 这种技术消除了上下积分技术所需的正和负积分的要求以及取样和保持装置作为时间的函数的下降。 使用通用的模拟路径,以便在信号值的数字组合期间增加错误。
    • 5. 发明授权
    • System for contactless electrical property testing of multi-layer
ceramics
    • 多层陶瓷非接触电性能试验系统
    • US4417203A
    • 1983-11-22
    • US267119
    • 1981-05-26
    • Hans C. PfeifferRobert A. SimpsonWerner Stickel
    • Hans C. PfeifferRobert A. SimpsonWerner Stickel
    • H01L21/66G01Q30/02G01R31/02G01R31/302G01R31/305H05K3/46
    • B82Y15/00G01R31/305
    • An electron beam system for non contact testing of three dimensional networks of conductors embedded in dielectric material, specifically detection of open and short circuit conditions. Top to bottom and top to top surface wiring is tested electrically without making physical electrical contact. The system comprises two flood beams and a focus probe beam wih one flood beam located at either side of the specimen. Proper choice of acceleration potentials, beam currents and dwell times of the beams allow alteration of the secondary electron emission from the specimen in such a way that electrical properties of the conductor networks can be measured directly. The difference in secondary electron emission resulting from different surface potentials is detected as a strong signal which allows clear discrimination between uninterrupted and interrupted as well as shorted pairs of conductors. This testing system can be applied to the high speed testing of advanced VLSI packaging substrates as well as to the greensheets, sublaminates, and laminates from which they are fabricated.
    • 用于非接触测试的电子束系统,用于嵌入介质材料的导体的三维网络,特别是开路和短路条件的检测。 从顶部到底部以及顶部到顶部的表面布线都进行电气测试,而不会进行物理电气接触。 该系统包括两个横梁和一个焦点探针光束,一个位于样品两侧的一个放射束。 正确选择加速电位,光束电流和停留时间可以改变样品的二次电子发射,从而可以直接测量导体网络的电气特性。 由不同表面电位产生的二次电子发射的差异被检测为强信号,其允许清晰地区分不间断的和中断的以及短路导体对。 该测试系统可以应用于高级VLSI封装基板的高速测试以及制造它们的绿色薄片,亚层压板和层压板。