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    • 3. 发明授权
    • Support assembly for card member having a memory element disposed
thereupon
    • 具有设置在其上的存储元件的卡构件的支撑组件
    • US5420759A
    • 1995-05-30
    • US927706
    • 1992-08-10
    • Michael L. CharlierDavid W. TrahanJohn A. Kalenowsky
    • Michael L. CharlierDavid W. TrahanJohn A. Kalenowsky
    • G06K19/06G06K19/077H05K7/00
    • G06K19/07739G06K19/06G06K19/077G06K19/07743G06K19/07701
    • A support assembly, and associated method, for permitting a reduced-sized, card member to be received by a standard-sized, card reader assembly of a radio telephone. The support assembly is comprised of a frame formed of a standard-sized, card member having a through-hole extending therethrough. The through-hole is of dimensions corresponding to the card member of the reduced dimensions. A thin, support sheet covers a portion of an opening formed by the through-hole on a top surface of the frame to form a front joist thereby, and the thin, support sheet is folded about an edge of the frame similarly to form a rear joist over an opening formed upon a bottom face surface of the frame by the through-hole. The front joist and the rear joist together form a pocket for supporting the card member of the reduced dimensions within the through-hole. Once the card member of the reduced dimensions is inserted within the through-hole, the support assembly may be inserted into a card reader assembly constructed to be operative to receive the standard-sized card member.
    • 一种支持组件和相关联的方法,用于允许小型卡片构件被无线电话的标准大小的读卡器组件接收。 支撑组件包括由具有延伸穿过其中的通孔的标准尺寸的卡构件形成的框架。 通孔的尺寸对应于减小尺寸的卡片。 薄的支撑片材覆盖由框架的顶表面上的通孔形成的开口的一部分,从而形成前托梁,并且薄的支撑片材围绕框架的边缘折叠,以形成后部 通过通孔形成在框架的底面上的开口上。 前托梁和后托梁一起形成用于在通孔内支撑减小尺寸的卡构件的口袋。 一旦将减小的尺寸的卡片构件插入到通孔内,则支撑组件可以插入到构造成可操作以接收标准尺寸的卡构件的读卡器组件中。
    • 4. 发明授权
    • Method and apparatus for shielding an electrical circuit that is
disposed on a substrate
    • 用于屏蔽设置在基板上的电路的方法和装置
    • US5436802A
    • 1995-07-25
    • US213652
    • 1994-03-16
    • David W. TrahanMichael L. CharlierKeith A. Gronczewski
    • David W. TrahanMichael L. CharlierKeith A. Gronczewski
    • H05K9/00
    • H05K9/0032
    • An electronic device employs a method and apparatus for shielding an electrical circuit (101) that is disposed on a substrate (120). A base member (103) that includes a top portion (104) and a plurality of side portions (105) is electrically coupled to a receptacle area (121) of the substrate (120) such that the plurality of side portions (105) substantially encircle the electrical circuit (101). The top portion (104) of the base member (103) includes a plurality of tab members (108) interposed with a plurality of receptacle openings (109). A substantially planar cover (102) that includes a plurality of protrusions (111) is positioned adjacent to the top portion (104) of the base member (103) such that each protrusion (111) is positioned within a corresponding receptacle opening (109). The cover (102) is then urged until each protrusion (111) interlocks with a corresponding tab member (108) to substantially enclose and, thus, shield the electrical circuit (101).
    • 电子装置采用屏蔽设置在基板(120)上的电路(101)的方法和装置。 包括顶部部分(104)和多个侧部部分(105)的基部构件(103)电耦合到基板(120)的容纳区域(121),使得多个侧部部分(105)基本上 环绕电路(101)。 基部构件(103)的顶部(104)包括插入有多个容器开口(109)的多个突片构件(108)。 包括多个突起(111)的基本平坦的盖(102)被定位成与基部构件(103)的顶部(104)相邻,使得每个突起(111)位于相应的容器开口(109)内, 。 然后推动盖(102),直到每个突起(111)与相应的突出部件(108)互锁,以基本上包围并因此屏蔽电路(101)。
    • 8. 发明授权
    • Heat sink assembly for densely packed transistors
    • 用于紧密堆叠晶体管的散热器组件
    • US4872089A
    • 1989-10-03
    • US286001
    • 1988-12-19
    • Alfred G. OckenMichael L. CharlierRaymond J. Kowieski
    • Alfred G. OckenMichael L. CharlierRaymond J. Kowieski
    • H01L23/40H05K7/12H05K7/20
    • H05K7/12H01L23/4093H01L2924/0002
    • A heat sink assembly for a plurality of transistors includes specially-formed spring clips and a specially-formed heat sink to hold the transistors firmly on the heat sink, and a lead protector that mates with the heat sink to receive and protect the leads of the transistors during handling. The lead protector and the heat sink include integrally-formed fastener/alignment pins for aligning the lead protector with the heat sink, and for aligning the completed heat sink assembly with a circuit board and for holding the assembly securely fastened to the circuit board. A particular feature of the lead protector permits it to mate with heat sink in a first discrete position in which it receives and protects the transistor leads, and to more closely mate with the heat sink in a second discrete position in which the transistor leads pass through the lead protector and into target holes in the circuit board.
    • 用于多个晶体管的散热器组件包括特别形成的弹簧夹和专门形成的散热器,以将晶体管牢固地保持在散热器上,以及引线保护器,其与散热器配合以接收和保护引线 处理过程中的晶体管。 引线保护器和散热器包括用于将引线保护器与散热器对准的整体形成的紧固件/对准销钉,以及用于将完整的散热器组件与电路板对准并将组件牢固地固定在电路板上。 引线保护器的特定特征允许它在第一离散位置与散热器配合,在该第一离散位置接收和保护晶体管引线,并且在晶体管引线通过的第二离散位置中与散热器更紧密地配合 导线保护器并插入电路板中的目标孔中。