专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09640737B2 Horizontal light emitting diodes including phosphor particles 有权
公开(公告)号：US09640737B2
公开(公告)日：2017-05-02
申请号：US13018013
申请日：2011-01-31
申请人： Matthew Donofrio , John Adam Edmond , James Ibbetson , David Todd Emerson , Michael John Bergmann , Kevin Haberern , Raymond Rosado , Jeffrey Carl Britt
发明人： Matthew Donofrio , John Adam Edmond , James Ibbetson , David Todd Emerson , Michael John Bergmann , Kevin Haberern , Raymond Rosado , Jeffrey Carl Britt
IPC分类号： H01L33/50 , H01L33/20
CPC分类号： H01L33/505 , H01L33/20 , H01L33/507
摘要： Horizontal light emitting diodes include anode and cathode contacts on the same face and a transparent substrate having an oblique sidewall. A conformal phosphor layer having an average equivalent particle diameter d50 of at least about 10 μm is provided on the oblique sidewall. High aspect ratio substrates may be provided. The LED may be directly attached to a submount.

2. 发明申请

US20120193660A1 HORIZONTAL LIGHT EMITTING DIODES INCLUDING PHOSPHOR PARTICLES 有权
标题翻译：水平发光二极管，包括磷化物颗粒
公开(公告)号：US20120193660A1
公开(公告)日：2012-08-02
申请号：US13018013
申请日：2011-01-31
申请人： Matthew Donofrio , John Adam Edmond , James Ibbetson , David Todd Emerson , Michael John Bergmann , Kevin Haberern , Raymond Rosado , Jeffrey Carl Britt
发明人： Matthew Donofrio , John Adam Edmond , James Ibbetson , David Todd Emerson , Michael John Bergmann , Kevin Haberern , Raymond Rosado , Jeffrey Carl Britt
IPC分类号： H01L33/50 , H01L33/58
CPC分类号： H01L33/505 , H01L33/20 , H01L33/507
摘要： Horizontal light emitting diodes include anode and cathode contacts on the same face and a transparent substrate having an oblique sidewall. A conformal phosphor layer having an average equivalent particle diameter d50 of at least about 10 μm is provided on the oblique sidewall. High aspect ratio substrates may be provided. The LED may be directly attached to a submount.
摘要翻译：水平发光二极管包括在同一面上的阳极和阴极触点以及具有倾斜侧壁的透明衬底。在倾斜侧壁上设置平均当量粒径d50为至少约10μm的保形荧光体层。可以提供高纵横比基底。 LED可以直接连接到底座。

3. 发明申请

US20120193661A1 GAP ENGINEERING FOR FLIP-CHIP MOUNTED HORIZONTAL LEDS 有权
标题翻译：用于片状安装水平LED的GAP工程
公开(公告)号：US20120193661A1
公开(公告)日：2012-08-02
申请号：US13112502
申请日：2011-05-20
申请人： David Todd Emerson , Raymond Rosado , Matthew Donofrio , John Adam Edmond
发明人： David Todd Emerson , Raymond Rosado , Matthew Donofrio , John Adam Edmond
IPC分类号： H01L33/58
CPC分类号： H01L33/52 , H01L25/0753 , H01L33/20 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A horizontal LED die is flip-chip mounted on a mounting substrate to define a gap that extends between the closely spaced apart anode and cathode contacts of the LED die, and between the closely spaced apart anode and cathode pads of the substrate. An encapsulant is provided on the light emitting diode die and the mounting substrate. The gap is configured to prevent sufficient encapsulant from entering the gap that would degrade operation of the LED.
摘要翻译：水平LED管芯被倒装安装在安装基板上以限定在LED管芯的紧密间隔开的阳极和阴极接触件之间以及衬底的间隔开的阳极和阴极焊盘之间延伸的间隙。密封剂设置在发光二极管管芯和安装基板上。间隙被配置成防止足够的密封剂进入间隙，这将降低LED的操作。

4. 发明授权

US09660153B2 Gap engineering for flip-chip mounted horizontal LEDs 有权
公开(公告)号：US09660153B2
公开(公告)日：2017-05-23
申请号：US13112502
申请日：2011-05-20
申请人： David Todd Emerson , Raymond Rosado , Matthew Donofrio , John Adam Edmond
发明人： David Todd Emerson , Raymond Rosado , Matthew Donofrio , John Adam Edmond
IPC分类号： H01L33/58 , H01L33/52 , H01L33/20 , H01L33/48 , H01L33/50 , H01L33/54 , H01L33/62 , H01L25/075
CPC分类号： H01L33/52 , H01L25/0753 , H01L33/20 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A horizontal LED die is flip-chip mounted on a mounting substrate to define a gap that extends between the closely spaced apart anode and cathode contacts of the LED die, and between the closely spaced apart anode and cathode pads of the substrate. An encapsulant is provided on the light emitting diode die and the mounting substrate. The gap is configured to prevent sufficient encapsulant from entering the gap that would degrade operation of the LED.

5. 发明授权

US09754926B2 Light emitting diode (LED) arrays including direct die attach and related assemblies 有权
公开(公告)号：US09754926B2
公开(公告)日：2017-09-05
申请号：US13027006
申请日：2011-02-14
申请人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
发明人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
IPC分类号： H01L27/15 , H01L25/075 , H01L33/50 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/505 , H01L33/62 , H01L2224/16
摘要： An electronic device may include a packaging substrate having a packaging substrate face with a plurality of electrically conductive pads on the packaging substrate face. A first light emitting diode die may bridge first and second ones of the electrically conductive pads. More particularly, the first light emitting diode die may include first anode and cathode contacts respectively coupled to the first and second electrically conductive pads using metallic bonds. Moreover, widths of the metallic bonds between the first anode contact and the first pad and between the first cathode contact and the second pad may be at least 60 percent of a width of the first light emitting diode die. A second light emitting diode die may bridge third and fourth ones of the electrically conductive pads. The second light emitting diode die may include second anode and cathode contacts respectively coupled to the third and fourth electrically conductive pads using metallic bonds. Widths of the metallic bonds between the second anode contact and the second pad and between the second cathode contact and the third pad may be at least 60 percent of a width of the first light emitting diode die.

6. 外观设计

USD689210S1 Lamp packages 有权
标题翻译：灯包装
公开(公告)号：USD689210S1
公开(公告)日：2013-09-03
申请号：US29402573
申请日：2011-09-23
申请人： Matthew Donofrio , John Adam Edmond , Hua Shuang Kong , Peter S. Andrews , David Todd Emerson
设计人： Matthew Donofrio , John Adam Edmond , Hua Shuang Kong , Peter S. Andrews , David Todd Emerson

7. 外观设计

USD689209S1 Lamp packages 有权
公开(公告)号：USD689209S1
公开(公告)日：2013-09-03
申请号：US29402571
申请日：2011-09-23
申请人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
设计人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson

8. 发明申请

US20120193649A1 LIGHT EMITTING DIODE (LED) ARRAYS INCLUDING DIRECT DIE ATTACH AND RELATED ASSEMBLIES 有权
标题翻译：发光二极管（LED）阵列包括直接连接和相关组件
公开(公告)号：US20120193649A1
公开(公告)日：2012-08-02
申请号：US13027006
申请日：2011-02-14
申请人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
发明人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
IPC分类号： H01L27/15 , H01L21/82
CPC分类号： H01L25/0753 , H01L33/505 , H01L33/62 , H01L2224/16
摘要： An electronic device may include a packaging substrate having a packaging substrate face with a plurality of electrically conductive pads on the packaging substrate face. A first light emitting diode die may bridge first and second ones of the electrically conductive pads. More particularly, the first light emitting diode die may include first anode and cathode contacts respectively coupled to the first and second electrically conductive pads using metallic bonds. Moreover, widths of the metallic bonds between the first anode contact and the first pad and between the first cathode contact and the second pad may be at least 60 percent of a width of the first light emitting diode die. A second light emitting diode die may bridge third and fourth ones of the electrically conductive pads. The second light emitting diode die may include second anode and cathode contacts respectively coupled to the third and fourth electrically conductive pads using metallic bonds. Widths of the metallic bonds between the second anode contact and the second pad and between the second cathode contact and the third pad may be at least 60 percent of a width of the first light emitting diode die.
摘要翻译：电子设备可以包括具有包装基板面的封装基板，在封装基板面上具有多个导电焊盘。第一发光二极管管芯可以桥接第一和第二导电焊盘。更具体地，第一发光二极管管芯可以包括使用金属接合分别耦合到第一和第二导电焊盘的第一阳极和阴极触点。此外，第一阳极接触件和第一焊盘之间以及第一阴极接触件和第二焊盘之间的金属接合的宽度可以是第一发光二极管管芯的宽度的至少60％。第二发光二极管管芯可以桥接第三和第四导电焊盘。第二发光二极管管芯可以包括使用金属接合分别耦合到第三和第四导电焊盘的第二阳极和阴极触点。第二阳极接触件和第二焊盘之间以及第二阴极接触件和第三焊盘之间的金属接合的宽度可以是第一发光二极管管芯的宽度的至少60％。

9. 发明授权

US09831220B2 Light emitting diode (LED) arrays including direct die attach and related assemblies 有权
公开(公告)号：US09831220B2
公开(公告)日：2017-11-28
申请号：US13424699
申请日：2012-03-20
申请人： Matthew Donofrio , Christopher P. Hussell , John Adam Edmond
发明人： Matthew Donofrio , Christopher P. Hussell , John Adam Edmond
IPC分类号： H01L25/075 , H01L33/50 , H01L33/62 , H01L33/20
CPC分类号： H01L25/0753 , H01L33/20 , H01L33/505 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： An electronic device may include a packaging substrate having a packaging face, and the packaging substrate may include positive and negative electrically conductive pads on the packaging face. A plurality of light emitting diodes may be electrically and mechanically coupled to the packaging face of the packaging substrate, with the plurality of light emitting diodes being electrically coupled between the positive and negative electrically conductive pads on the packaging face. A continuous optical coating may be provided on the plurality of light emitting diodes and on the packaging face of the packaging substrate so that the plurality of light emitting diodes are between the optical coating and the packaging substrate.

10. 发明申请

US20120319148A1 CONFORMAL GEL LAYERS FOR LIGHT EMITTING DIODES AND METHODS OF FABRICATING SAME 有权
标题翻译：用于发光二极管的合适凝胶层及其制造方法
公开(公告)号：US20120319148A1
公开(公告)日：2012-12-20
申请号：US13160793
申请日：2011-06-15
申请人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong
发明人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong
IPC分类号： H01L33/50 , H01L33/52
CPC分类号： H01L33/54 , H01L25/0753 , H01L33/20 , H01L33/505 , H01L33/507 , H01L2224/14 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/0002 , H01L2924/10158 , H01L2924/00014 , H01L2924/00
摘要： Light emitting devices include a light emitting diode die on a mounting substrate and a conformal gel layer on the mounting substrate and/or on the light emitting diode die. The conformal gel layer may at least partially fill a gap between the light emitting diode die and the mounting substrate. A phosphor layer and/or a molded dome may be provided on the conformal gel layer. The conformal gel layer may be fabricated by spraying and/or dispensing the gel that is diluted in the solvent.
摘要翻译：发光器件包括在安装衬底上的发光二极管管芯和安装衬底上和/或发光二极管管芯上的保形凝胶层。保形凝胶层可以至少部分地填充发光二极管管芯和安装衬底之间的间隙。可以在保形凝胶层上提供荧光体层和/或模制圆顶。可以通过喷雾和/或分配在溶剂中稀释的凝胶来制造保形凝胶层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式