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1. 发明授权

US06868898B2 Heat pipe having an inner retaining wall for wicking components 有权
标题翻译：热管具有用于芯吸部件的内挡土墙
公开(公告)号：US06868898B2
公开(公告)日：2005-03-22
申请号：US10400743
申请日：2003-03-26
申请人： David S. Chau , Ioan Sauciuc
发明人： David S. Chau , Ioan Sauciuc
IPC分类号： F28D15/02 , F28D15/00
CPC分类号： F28D15/0241
摘要： A heat pipe is provided, which includes at least one outer structural wall, a wicking structure, and an inner retaining wall for the wicking structure. The outer structural wall has condenser, intermediate, and evaporator sections sequentially after one another. The wicking structure includes a plurality of wicking components onto which a fluid condenses at the condenser section when heat transfers therefrom out through the condenser section, flows thereon through the intermediate section, and evaporates therefrom when heat transfers thereto through the evaporator section. The wicking components are held in place between the intermediate section and an outer surface of the inner retaining wall. The fluid evaporating from the evaporator section recirculates past an inner surface of the inner retaining wall to the condenser section.
摘要翻译：提供了一种热管，其包括至少一个外部结构壁，芯吸结构和用于芯吸结构的内部保持壁。外部结构壁相互依次具有冷凝器，中间和蒸发器部分。芯吸结构包括多个芯吸部件，当热量通过冷凝器部分从冷凝器部分流出时，流体在冷凝器部分冷凝，在其上流过中间部分，并且当热量通过蒸发器部分传递到其上时从其中蒸发。芯吸部件保持在中间部分和内部保持壁的外表面之间的适当位置。从蒸发器部分蒸发的流体通过内部保持壁的内表面再循环到冷凝器部分。

2. 发明授权

US07336487B1 Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant 有权
标题翻译：用于IC器件冷却系统的冷板和配合歧管板，使得能够运送预先充满液体冷却剂的冷却系统
公开(公告)号：US07336487B1
公开(公告)日：2008-02-26
申请号：US11541175
申请日：2006-09-29
申请人： Gregory M. Chrysler , Paul J. Gwin , David S. Chau
发明人： Gregory M. Chrysler , Paul J. Gwin , David S. Chau
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a cold plate and a manifold plate are disclosed. The cold plate may be coupled with an integrated circuit die, and the cold plate may also include a flow path to receive a liquid coolant. Coolant moving through the flow path can remove heat generated by the die. The cold plate may include one or more piercing elements that are coupled with the flow path. The manifold plate may hold a volume of a liquid coolant, and one or more breakable seals on the manifold plate contain the liquid coolant within the manifold plate (and perhaps other components of a fluid cooling system). The piercing element (or elements) on the cold plate may be inserted into the breakable seal (or seals) on the manifold plate to open the breakable seals and establish fluid communication between the cold and manifold plates. The use of a manifold plate including the breakable seals may enable the shipment and storage of a fluid cooling system precharged with a working fluid. Other embodiments are described and claimed.
摘要翻译：公开了冷板和歧管板的实施例。冷板可以与集成电路模具连接，并且冷板还可以包括用于接收液体冷却剂的流动路径。通过流路移动的冷却剂可以去除由模具产生的热量。冷板可以包括与流动路径联接的一个或多个刺穿元件。歧管板可以容纳一定体积的液体冷却剂，并且歧管板上的一个或多个可破坏的密封件包含歧管板（以及流体冷却系统的其它部件）内的液体冷却剂。冷板上的穿孔元件（或元件）可以插入到歧管板上的可破坏的密封件（或密封件）中，以打开可破坏的密封件并建立冷和歧管板之间的流体连通。使用包括可破坏密封件的歧管板可以使得能够装载和储存预先充满工作流体的流体冷却系统。描述和要求保护其他实施例。

3. 发明申请

US20090109619A1 METHOD APPARATUS FOR COOLING SYSTEM HAVING AN S-SHAPED AIR FLOW PATH FOR USE IN A CHASSIS 审中-公开
标题翻译：用于冷却系统的方法装置，其具有用于底盘的S形空气流路径
公开(公告)号：US20090109619A1
公开(公告)日：2009-04-30
申请号：US11924217
申请日：2007-10-25
申请人： Jeffrey L. Wise , David S. Chau , Stephen A. Hauser , Pasi J. Vaananen
发明人： Jeffrey L. Wise , David S. Chau , Stephen A. Hauser , Pasi J. Vaananen
IPC分类号： H05K7/20
CPC分类号： H05K7/20836
摘要： A method and apparatus cooling a chassis. The apparatus includes a telecommunication shelf structure or chassis (102) having a top side (108), bottom side (110), front side (104) and back side (108). Slots that can support boards (112) are oriented between the top side and the bottom side. A first set of fans (126) pushes air flow through the slots from the front and bottom sides of the shelf structure to the top and back sides of the shelf structure, and a second set of fans (128) pulls air flow through the slots from the front and bottom sides of the shelf structure to the top and back of the shelf structure. The first and second set of fans form a fault tolerant and redundant fan configuration in the telecommunication shelf structure to achieve an S-shaped air flow through the telecommunication shelf structure.
摘要翻译：冷却底盘的方法和装置。该装置包括具有顶侧（108），底侧（110），前侧（104）和后侧（108）的电信架结构或底架（102）。可以支撑板（112）的插槽在顶侧和底侧之间定向。第一组风扇（126）将空气流从搁板结构的前侧和底侧通过狭槽推到搁架结构的顶侧和后侧，第二组风扇（128）将气流拉过狭槽从架子结构的前侧和底部到搁板结构的顶部和后部。第一组和第二组风扇在电信架构结构中形成容错和冗余的风扇配置，以实现通过电信架结构的S形气流。

4. 发明申请

US20080155990A1 SOCKET ENABLED CURRENT DELIVERY TO A THERMOELECTRIC COOLER TO COOL AN IN-SUBSTRATE VOLTAGE REGULATOR 有权
标题翻译：插入式电流输送到热电冷却器以冷却基板电压调节器
公开(公告)号：US20080155990A1
公开(公告)日：2008-07-03
申请号：US11616794
申请日：2006-12-27
申请人： Ashish Gupta , David S. Chau
发明人： Ashish Gupta , David S. Chau
IPC分类号： F25B21/02 , F25D23/12
CPC分类号： F25B21/02 , F25B2321/0212 , G06F1/20 , H05K7/1092
摘要： An apparatus including a socket having a socket body and a cavity within the socket body. The apparatus further including a thermoelectric cooler coupled to an in-substrate voltage regulator positioned within the cavity. A method including coupling a thermoelectric cooler to an in-substrate voltage regulator positioned within a cavity of a socket and electrically coupling the thermoelectric cooler to the socket using a contact of the socket. A system including an electronic appliance having a processor including an in-substrate voltage regulator positioned within a cavity of a socket coupled to the processor. The system further including a thermoelectric cooler positioned within the cavity and coupled to the in-substrate voltage regulator.
摘要翻译：一种装置，包括具有插座主体和插座主体内的空腔的插座。该装置还包括耦合到位于空腔内的内置电压调节器的热电冷却器。一种方法，包括将热电冷却器耦合到位于插座的空腔内的衬底内调节调节器，并使用插座的触点将热电冷却器电连接到插座。一种包括具有处理器的电子设备的系统，所述处理器包括位于耦合到所述处理器的插座的腔内的内置电压调节器。该系统还包括位于腔内的热电冷却器，并耦合到衬底内的电压调节器。

5. 发明授权

US07739876B2 Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator 有权
标题翻译：插座启用电流传输到热电冷却器以冷却衬底内的稳压器
公开(公告)号：US07739876B2
公开(公告)日：2010-06-22
申请号：US11616794
申请日：2006-12-27
申请人： Ashish Gupta , David S. Chau
发明人： Ashish Gupta , David S. Chau
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B2321/0212 , G06F1/20 , H05K7/1092
摘要： An apparatus including a socket having a socket body and a cavity within the socket body. The apparatus further including a thermoelectric cooler coupled to an in-substrate voltage regulator positioned within the cavity. A method including coupling a thermoelectric cooler to an in-substrate voltage regulator positioned within a cavity of a socket and electrically coupling the thermoelectric cooler to the socket using a contact of the socket. A system including an electronic appliance having a processor including an in-substrate voltage regulator positioned within a cavity of a socket coupled to the processor. The system further including a thermoelectric cooler positioned within the cavity and coupled to the in-substrate voltage regulator.
摘要翻译：一种装置，包括具有插座主体和插座主体内的空腔的插座。该装置还包括耦合到位于空腔内的内置电压调节器的热电冷却器。一种方法，包括将热电冷却器耦合到位于插座的空腔内的衬底内调节调节器，并使用插座的触点将热电冷却器电连接到插座。一种包括具有处理器的电子设备的系统，所述处理器包括位于耦合到所述处理器的插座的腔内的内置电压调节器。该系统还包括位于空腔内的热电冷却器并耦合到衬底内的电压调节器。

6. 发明授权

US07560640B2 Densely packed thermoelectric cooler 有权
标题翻译：密集热电冷却器
公开(公告)号：US07560640B2
公开(公告)日：2009-07-14
申请号：US10996195
申请日：2004-11-22
申请人： Chuan Hu , David S. Chau
发明人： Chuan Hu , David S. Chau
IPC分类号： H01L35/28
CPC分类号： H01L35/34 , H01L23/38 , H01L35/32 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the invention provide a thin film thermoelectric cooler. The cooler may have a high packing density that provides good cooling performance. The cooler may be formed by forming a first set of cooling elements, depositing a conformal insulating layer on the first set, then forming a second set of cooling elements between the first set of elements.
摘要翻译：本发明的实施例提供一种薄膜热电冷却器。冷却器可具有高填充密度，提供良好的冷却性能。可以通过形成第一组冷却元件，在第一组上沉积保形绝缘层，然后在第一组元件之间形成第二组冷却元件来形成冷却器。

7. 发明授权

US07430870B2 Localized microelectronic cooling 有权
标题翻译：局部微电子冷却
公开(公告)号：US07430870B2
公开(公告)日：2008-10-07
申请号：US11174313
申请日：2005-06-30
申请人： David S. Chau , Gregory M. Chrysler
发明人： David S. Chau , Gregory M. Chrysler
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , H01L23/38 , H01L35/30 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling system comprising one or more thermoelectric cooler(s) is thermally coupled to a heat spreader to provide cooling to one or more hot spot(s) of a microelectronic device.
摘要翻译：通常描述了向微电子器件提供局部冷却的装置和相关方法。在这方面，根据一个示例性实施例，包括一个或多个热电冷却器的冷却系统热耦合到散热器以向微电子器件的一个或多个热点提供冷却。

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