专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09531167B2 Device and method for connecting an RF generator to a coaxial conductor 有权
标题翻译：将RF发生器连接到同轴导体的装置和方法
公开(公告)号：US09531167B2
公开(公告)日：2016-12-27
申请号：US14293741
申请日：2014-06-02
申请人： David P. Lester , Viswanathan Lakshminarayan , Mario M. Bokatius , Basim H. Noori , Pierre Marie Jean Piel
发明人： David P. Lester , Viswanathan Lakshminarayan , Mario M. Bokatius , Basim H. Noori , Pierre Marie Jean Piel
IPC分类号： H01T15/00 , F02P3/01 , F02P13/00 , F02P23/04 , H05H1/46 , H05H1/52 , H01T13/44
CPC分类号： H01T15/00 , F02P3/01 , F02P13/00 , F02P23/04 , H01T13/44 , H05H1/46 , H05H1/52 , H05H2001/4682
摘要： The present disclosure presents a device and method for connecting an RF generator to a coaxial conductor. The device includes a substrate, a radio frequency generator on the substrate, and a coaxial conductor coupled to a first surface of the substrate. The coaxial conductor includes a conductive core and a conductive shield around the conductive core and is configured to transmit the radio frequency signal to a radiation device. The device includes a cap coupled to the substrate and extending from a second surface of the substrate opposite the first surface. The cap includes an outer wall and a center post. The outer wall is electrically connected to the conductive shield of the coaxial conductor and the center post is electrically connected to the conductive core of the coaxial conductor. An output pad of the radio frequency generator is electrically connected to the conductive core.
摘要翻译：本公开提出了一种用于将RF发生器连接到同轴导体的装置和方法。该装置包括衬底，在衬底上的射频发生器和耦合到衬底的第一表面的同轴导体。同轴导体包括导电芯和围绕导电芯的导电屏蔽，并被配置为将射频信号传输到辐射装置。该装置包括联接到基板并从基板的与第一表面相对的第二表面延伸的盖。盖子包括外壁和中心柱。外壁电连接到同轴导体的导电屏蔽，并且中心柱电连接到同轴导体的导电芯。射频发生器的输出焊盘与导电芯电连接。

2. 发明申请

US20150349499A1 DEVICE AND METHOD FOR CONNECTING AN RF GENERATOR TO A COAXIAL CONDUCTOR 有权
标题翻译：将RF发生器连接到同轴导体的装置和方法
公开(公告)号：US20150349499A1
公开(公告)日：2015-12-03
申请号：US14293741
申请日：2014-06-02
申请人： David P. Lester , Viswanathan Lakshminarayan , Mario M. Bokatius , Basim H. Noori , J. Piel Pierre-Marie
发明人： David P. Lester , Viswanathan Lakshminarayan , Mario M. Bokatius , Basim H. Noori , J. Piel Pierre-Marie
IPC分类号： H01T15/00 , F02P23/04
CPC分类号： H01T15/00 , F02P3/01 , F02P13/00 , F02P23/04 , H01T13/44 , H05H1/46 , H05H1/52 , H05H2001/4682
摘要： The present disclosure presents a device and method for connecting an RF generator to a coaxial conductor. The device includes a substrate, a radio frequency generator on the substrate, and a coaxial conductor coupled to a first surface of the substrate. The coaxial conductor includes a conductive core and a conductive shield around the conductive core and is configured to transmit the radio frequency signal to a radiation device. The device includes a cap coupled to the substrate and extending from a second surface of the substrate opposite the first surface. The cap includes an outer wall and a center post. The outer wall is electrically connected to the conductive shield of the coaxial conductor and the center post is electrically connected to the conductive core of the coaxial conductor. An output pad of the radio frequency generator is electrically connected to the conductive core.
摘要翻译：本公开提出了一种用于将RF发生器连接到同轴导体的装置和方法。该装置包括衬底，在衬底上的射频发生器和耦合到衬底的第一表面的同轴导体。同轴导体包括导电芯和围绕导电芯的导电屏蔽，并被配置为将射频信号传输到辐射装置。该装置包括联接到基板并从基板的与第一表面相对的第二表面延伸的盖。盖子包括外壁和中心柱。外壁电连接到同轴导体的导电屏蔽，并且中心柱电连接到同轴导体的导电芯。射频发生器的输出焊盘与导电芯电连接。

3. 发明授权

US09518555B2 Radiation devices 有权
标题翻译：辐射装置
公开(公告)号：US09518555B2
公开(公告)日：2016-12-13
申请号：US14560675
申请日：2014-12-04
申请人： Mario M. Bokatius , Lakshminarayan Viswanathan , David P. Lester , Basim H. Noori , Pierre Marie J. Piel
发明人： Mario M. Bokatius , Lakshminarayan Viswanathan , David P. Lester , Basim H. Noori , Pierre Marie J. Piel
IPC分类号： H01T13/16 , F02P23/04 , H05H1/24 , H01T21/02 , H05H1/52
CPC分类号： F02P23/04 , F02P9/007 , F02P13/00 , H01T13/16 , H01T21/02 , H05H1/24 , H05H1/52
摘要： A radiation device and related method are presented. The radiation device includes a body. The body includes a threaded portion configured to engage with a threaded opening in an engine and an open interior volume. The radiation device includes a ground electrode coupled to the body, a substrate disposed within the open interior volume in the body, and a radio frequency generator on the substrate. The radio frequency generator is configured to receive an input signal and, in response to the input signal, generate plasma energy between the body and the ground electrode.
摘要翻译：提出了一种辐射装置及相关方法。辐射装置包括主体。主体包括构造成与发动机中的螺纹开口和敞开的内部容积接合的螺纹部分。辐射装置包括耦合到主体的接地电极，设置在主体内的开放内部空间内的基板，以及基板上的射频发生器。射频发生器被配置为接收输入信号，并且响应于输入信号，在主体和接地电极之间产生等离子体能量。

4. 发明申请

US20160160833A1 RADIATION DEVICES 有权
标题翻译：辐射装置
公开(公告)号：US20160160833A1
公开(公告)日：2016-06-09
申请号：US14560675
申请日：2014-12-04
申请人： Mario M. Bokatius , Lakshminarayan Viswanathan , David P. Lester , Basim H. Noori , Pierre Marie J. Piel
发明人： Mario M. Bokatius , Lakshminarayan Viswanathan , David P. Lester , Basim H. Noori , Pierre Marie J. Piel
IPC分类号： F02P23/04 , H01T13/16 , H01T21/02 , H05H1/24
CPC分类号： F02P23/04 , F02P9/007 , F02P13/00 , H01T13/16 , H01T21/02 , H05H1/24 , H05H1/52
摘要： A radiation device and related method are presented. The radiation device includes a body. The body includes a threaded portion configured to engage with a threaded opening in an engine and an open interior volume. The radiation device includes a ground electrode coupled to the body, a substrate disposed within the open interior volume in the body, and a radio frequency generator on the substrate. The radio frequency generator is configured to receive an input signal and, in response to the input signal, generate plasma energy between the body and the ground electrode.
摘要翻译：提出了一种辐射装置及相关方法。辐射装置包括主体。主体包括构造成与发动机中的螺纹开口和敞开的内部容积接合的螺纹部分。辐射装置包括耦合到主体的接地电极，设置在主体内的开放内部空间内的基板，以及基板上的射频发生器。射频发生器被配置为接收输入信号，并且响应于输入信号，在主体和接地电极之间产生等离子体能量。

5. 发明申请

US20150262961A1 Wedge Bond Foot Jumper Connections 有权
标题翻译：楔形键脚跳线连接
公开(公告)号：US20150262961A1
公开(公告)日：2015-09-17
申请号：US14204340
申请日：2014-03-11
申请人： Jeffrey K. Jones , Basim H. Noori , Mohd Salimin Sahludin , Fernando A. Santos
发明人： Jeffrey K. Jones , Basim H. Noori , Mohd Salimin Sahludin , Fernando A. Santos
IPC分类号： H01L23/00 , H01L29/861 , H01L23/64 , H01L27/07 , H01L21/822 , H01L49/02 , H01L27/06
CPC分类号： H01L24/48 , H01L21/822 , H01L22/14 , H01L23/642 , H01L23/647 , H01L24/43 , H01L24/45 , H01L27/0676 , H01L27/0794 , H01L28/20 , H01L2224/05578 , H01L2224/05599 , H01L2224/13028 , H01L2224/1613 , H01L2224/438 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4801 , H01L2224/48011 , H01L2224/4813 , H01L2224/4847 , H01L2224/85399 , H01L2224/85423 , H01L2224/85444 , H01L2224/85447 , H01L2924/00014 , H01L2924/1203 , H01L2924/1205 , H01L2924/1207 , H01L2924/20658 , H01L2924/30107 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756
摘要： A semiconductor device includes a substrate, first and second bond pad structures supported by the substrate and spaced from one another by a gap, and a wire bond foot jumper extending across the gap and bonded to the first and second bond pad structures.
摘要翻译：半导体器件包括衬底，由衬底支撑并且通过间隙彼此间隔开的第一和第二接合焊盘结构，以及跨越间隙延伸并结合到第一和第二接合焊盘结构的引线接合脚跨接件。

6. 发明授权

US08319504B2 Tuner characterization methods and apparatus 有权
标题翻译：调谐器表征方法和装置
公开(公告)号：US08319504B2
公开(公告)日：2012-11-27
申请号：US12475251
申请日：2009-05-29
申请人： Christopher J. Roff , Basim H. Noori
发明人： Christopher J. Roff , Basim H. Noori
IPC分类号： G01R27/04
CPC分类号： G01R27/30
摘要： Embodiments include methods and apparatus for characterizing a tuner. For a given tuner, a processing system is adapted to measure scattering parameters for a plurality of characterization points that are non-uniformly distributed across a Smith chart, and to store the scattering parameters in a tuner characterization file. Interpolation and extrapolation processes are performed to determine additional scattering parameters for a plurality of additional characterization points, which are also stored in the tuner characterization file.
摘要翻译：实施例包括用于表征调谐器的方法和装置。对于给定的调谐器，处理系统适于测量跨越史密斯圆图非均匀分布的多个表征点的散射参数，并将散射参数存储在调谐器表征文件中。执行插值和外插过程以确定多个附加特征点的附加散射参数，其还存储在调谐器表征文件中。

7. 发明申请

US20120105170A1 DIRECTIONAL COUPLERS FOR USE IN ELECTRONIC DEVICES, AND METHODS OF USE THEREOF 有权
标题翻译：用于电子设备的方向连接器及其使用方法
公开(公告)号：US20120105170A1
公开(公告)日：2012-05-03
申请号：US12916068
申请日：2010-10-29
申请人： Basim H. Noori , Stephen C. Cripps
发明人： Basim H. Noori , Stephen C. Cripps
IPC分类号： H01P5/18
CPC分类号： H01P5/185 , H03F1/0288 , H03F3/24 , H03F2200/207
摘要： Embodiments include directional couplers, electronic devices within which they are incorporated, and methods for using directional couplers. An embodiment of a directional coupler includes a set of coupled lines and a reflection coefficient manipulator. The set of coupled lines includes first and second conductive structures. The first conductive structure has a first port, a second port, and a substantially linear, first conductive central portion between the first port and the second port. The second conductive structure has a third port, a fourth port, and a substantially linear, second conductive central portion between the third port and the fourth port. The reflection coefficient manipulator is integrated with the set of coupled lines and is disposed in proximity to a gap between the first and second conductive structures. The reflection coefficient manipulator, which includes slots, protrusions, or both, is configured to equate reflection coefficients of the first and second conductive structures.
摘要翻译：实施例包括定向耦合器，并入其中的电子器件，以及使用定向耦合器的方法。定向耦合器的实施例包括一组耦合线和反射系数操纵器。该组耦合线包括第一和第二导电结构。第一导电结构在第一端口和第二端口之间具有第一端口，第二端口和基本上线性的第一导电中心部分。第二导电结构在第三端口和第四端口之间具有第三端口，第四端口和基本上线性的第二导电中心部分。反射系数操纵器与该组耦合线集成，并且设置在第一和第二导电结构之间的间隙附近。包括槽，突起或两者的反射系数操纵器被配置为等于第一和第二导电结构的反射系数。

8. 发明申请

US20150381121A1 INTEGRATED PASSIVE DEVICE ASSEMBLIES FOR RF AMPLIFIERS, AND METHODS OF MANUFACTURE THEREOF 有权
标题翻译：用于射频放大器的集成无源器件组件及其制造方法
公开(公告)号：US20150381121A1
公开(公告)日：2015-12-31
申请号：US14317572
申请日：2014-06-27
申请人： Jeffrey K. Jones , Basim H. Noori , Michael E. Watts
发明人： Jeffrey K. Jones , Basim H. Noori , Michael E. Watts
IPC分类号： H03F3/19 , H01L25/16 , H01L49/02 , H03F3/21 , H01L23/31 , H01L23/04 , H01L23/00 , H03F1/56 , H01L25/00 , H01L21/56
CPC分类号： H03F3/21 , H01G4/385 , H01G4/40 , H01L23/047 , H01L23/481 , H01L23/488 , H01L23/66 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/165 , H01L25/50 , H01L2223/6611 , H01L2223/6655 , H01L2223/6672 , H01L2224/48091 , H01L2224/48111 , H01L2224/49052 , H01L2224/49175 , H01L2224/49433 , H01L2924/00014 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1304 , H01L2924/13091 , H01L2924/19104 , H03F1/565 , H03F3/193 , H03F3/195 , H03F2200/222 , H03F2200/387 , H03F2200/451 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/05599
摘要： An embodiment of an integrated passive device (IPD) assembly includes a first capacitor formed over a semiconductor substrate, where the first capacitor includes a first capacitor electrode, a second capacitor electrode, and dielectric material that electrically insulates the first capacitor electrode from the second capacitor electrode. The IPD assembly also includes a first contact pad exposed at a top surface of the IPD assembly and electrically coupled to the second capacitor electrode, and a second contact pad exposed at the top surface of the IPD. A second capacitor is coupled to the top surface of the IPD, and includes a first terminal electrically coupled to the first contact pad, and a second terminal electrically coupled to the second contact pad. The IPD assembly may be included in a packaged RF device, forming portions of an output impedance matching circuit and an envelope frequency termination circuit.
摘要翻译：集成无源器件（IPD）组件的实施例包括形成在半导体衬底上的第一电容器，其中第一电容器包括第一电容器电极，第二电容器电极和将第一电容器电极与第二电容器电绝缘的电介质材料电极。 IPD组件还包括暴露在IPD组件的顶表面处并电耦合到第二电容器电极的第一接触焊盘和暴露在IPD的顶表面处的第二接触焊盘。第二电容器耦合到IPD的顶表面，并且包括电耦合到第一接触焊盘的第一端子和电耦合到第二接触焊盘的第二端子。 IPD组件可以包括在封装的RF器件中，形成输出阻抗匹配电路的一部分和封装频率终止电路。

9. 发明授权

US07378920B2 Methods and apparatus for a high-frequency output match circuit 有权
标题翻译：高频输出匹配电路的方法和装置
公开(公告)号：US07378920B2
公开(公告)日：2008-05-27
申请号：US11354472
申请日：2006-02-14
申请人： Jeffrey K. Jones , Basim H. Noori
发明人： Jeffrey K. Jones , Basim H. Noori
IPC分类号： H03H7/38
CPC分类号： H03H7/38 , H01L2223/6655 , H03F1/565 , H03F3/191 , H03F2200/387 , H03F2200/391 , H03F2200/402 , H03F2200/451
摘要： An output match circuit is coupled between the terminal of a high-frequency device and a ground terminal. The output match circuit includes an LC shunt and an LC notch serially coupled to the LC shunt, wherein the LC notch includes a resonant capacitive element in series with a resonant inductive element. The LC notch may simply include a resonant inductive element coupled directly to the ground terminal. The series inductive element may have a terminal coupled between the resonant capacitive element and the resonant inductive element.
摘要翻译：输出匹配电路耦合在高频器件的端子和接地端子之间。输出匹配电路包括串联耦合到LC分流器的LC分路和LC陷波，其中LC陷波包括与谐振电感元件串联的谐振电容元件。 LC陷波可以简单地包括直接耦合到接地端子的谐振电感元件。串联电感元件可以具有耦合在谐振电容元件和谐振电感元件之间的端子。

10. 发明授权

US09438184B2 Integrated passive device assemblies for RF amplifiers, and methods of manufacture thereof 有权
标题翻译：用于RF放大器的集成无源器件组件及其制造方法
公开(公告)号：US09438184B2
公开(公告)日：2016-09-06
申请号：US14317572
申请日：2014-06-27
申请人： Jeffrey K. Jones , Basim H. Noori , Michael E. Watts
发明人： Jeffrey K. Jones , Basim H. Noori , Michael E. Watts
IPC分类号： H01L21/8242 , H01L29/86 , H01L29/06 , H03F3/21 , H01L25/00 , H01L25/16 , H01L23/00 , H03F1/56 , H01L23/047 , H03F3/195 , H03F3/193
CPC分类号： H03F3/21 , H01G4/385 , H01G4/40 , H01L23/047 , H01L23/481 , H01L23/488 , H01L23/66 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/165 , H01L25/50 , H01L2223/6611 , H01L2223/6655 , H01L2223/6672 , H01L2224/48091 , H01L2224/48111 , H01L2224/49052 , H01L2224/49175 , H01L2224/49433 , H01L2924/00014 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1304 , H01L2924/13091 , H01L2924/19104 , H03F1/565 , H03F3/193 , H03F3/195 , H03F2200/222 , H03F2200/387 , H03F2200/451 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/05599
摘要： An embodiment of an integrated passive device (IPD) assembly includes a first capacitor formed over a semiconductor substrate, where the first capacitor includes a first capacitor electrode, a second capacitor electrode, and dielectric material that electrically insulates the first capacitor electrode from the second capacitor electrode. The IPD assembly also includes a first contact pad exposed at a top surface of the IPD assembly and electrically coupled to the second capacitor electrode, and a second contact pad exposed at the top surface of the IPD. A second capacitor is coupled to the top surface of the IPD, and includes a first terminal electrically coupled to the first contact pad, and a second terminal electrically coupled to the second contact pad. The IPD assembly may be included in a packaged RF device, forming portions of an output impedance matching circuit and an envelope frequency termination circuit.
摘要翻译：集成无源器件（IPD）组件的实施例包括形成在半导体衬底上的第一电容器，其中第一电容器包括第一电容器电极，第二电容器电极和将第一电容器电极与第二电容器电绝缘的电介质材料电极。 IPD组件还包括暴露在IPD组件的顶表面处并电耦合到第二电容器电极的第一接触焊盘和暴露在IPD的顶表面处的第二接触焊盘。第二电容器耦合到IPD的顶表面，并且包括电耦合到第一接触焊盘的第一端子和电耦合到第二接触焊盘的第二端子。 IPD组件可以包括在封装的RF器件中，形成输出阻抗匹配电路的一部分和封装频率终止电路。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式