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    • 5. 发明授权
    • Wind tower service lift
    • 风塔服务电梯
    • US08016268B2
    • 2011-09-13
    • US12130922
    • 2008-05-30
    • David OliphantJared QuilterTodd AndersenThomas Conroy
    • David OliphantJared QuilterTodd AndersenThomas Conroy
    • B66D1/26
    • B66B9/187
    • An apparatus used for maintaining a wind tower structure wherein the wind tower structure may have a plurality of legs and may be configured to support a wind turbine above the ground in a better position to interface with winds. The lift structure may be configured for carrying objects and have a guide system and drive system for mechanically communicating with a primary cable, rail or other first elongate member attached to the wind tower structure. The drive system and guide system may transmit forces that move the lift relative to the cable and thereby relative to the wind tower structure. A control interface may be included for controlling the amount and direction of the power into the guide system and drive system thereby causing the guide system and drive system to move the lift relative to said first elongate member such that said lift moves relative to said wind tower structure.
    • 一种用于维持风塔结构的装置,其中风塔结构可以具有多个支腿,并且可以被配置为将风力涡轮机支撑在地面上方的更好的位置以与风相接触。 提升结构可以被构造成用于携带物体,并且具有用于与附接到风塔结构的主缆索,导轨或其它第一细长构件机械地连通的导向系统和驱动系统。 驱动系统和引导系统可传递相对于电缆移动升降机并因此相对于风塔结构的力。 可以包括控制界面以控制导入系统和驱动系统的动力的数量和方向,从而导致引导系统和驱动系统相对于第一细长构件移动升降机,使得升降机相对于所述风塔移动 结构体。
    • 6. 发明申请
    • WIND TOWER SERVICE LIFT
    • 风塔服务提升
    • US20090294219A1
    • 2009-12-03
    • US12130922
    • 2008-05-30
    • David OliphantJared QuilterTodd AndersenThomas Conroy
    • David OliphantJared QuilterTodd AndersenThomas Conroy
    • B66B9/16B66B9/00B66B9/187B66B1/00
    • B66B9/187
    • An apparatus used for maintaining a wind tower structure wherein the wind tower structure may have a plurality of legs and may be configured to support a wind turbine above the ground in a better position to interface with winds. The lift structure may be configured for carrying objects and have a guide system and drive system for mechanically communicating with a primary cable, rail or other first elongate member attached to the wind tower structure. The drive system and guide system may transmit forces that move the lift relative to the cable and thereby relative to the wind tower structure. A control interface may be included for controlling the amount and direction of the power into the guide system and drive system thereby causing the guide system and drive system to move the lift relative to said first elongate member such that said lift moves relative to said wind tower structure.
    • 一种用于维持风塔结构的装置,其中风塔结构可以具有多个支腿,并且可以被配置为将风力涡轮机支撑在地面上方的更好的位置以与风相接触。 提升结构可以被构造成用于携带物体,并且具有用于与附接到风塔结构的主缆索,导轨或其它第一细长构件机械地连通的导向系统和驱动系统。 驱动系统和引导系统可传递相对于电缆移动升降机并因此相对于风塔结构的力。 可以包括控制界面,用于控制导入系统和驱动系统的动力的数量和方向,从而导致引导系统和驱动系统相对于所述第一细长构件移动升降机,使得升降机相对于所述风塔移动 结构体。
    • 7. 发明授权
    • Modular jack for type III PCMCIA cards
    • US06488543B2
    • 2002-12-03
    • US09966150
    • 2001-09-27
    • David OliphantRyan A. KunzThomas A. JohnsonSteven Lo Forte
    • David OliphantRyan A. KunzThomas A. JohnsonSteven Lo Forte
    • H01R2400
    • H01R24/64Y10S439/923
    • The modular jack allows a RJ series connector plug to be attached to a communications card that conforms to the PCMCIA requirements for a Type III card. The modular jack includes a main body portion including a top surface, a bottom outer surface and a front surface. The receptacle is disposed entirely within the front surface of the modular jack such that no portion of the plug extends through either the top surface or the bottom surface of the main body portion of the modular jack. Thus, the modular jack allows the communications card to be connected to standard RJ series plugs without deviating from the Type III PCMCIA card height requirement, even when the plug is inserted into the jack. Desirably, the main body portion has a height measured from the top surface to the bottom surface that is generally equal to or less than about 10.5 mm. Additionally, the receptacle preferably includes an upper inner surface and a lower inner surface that are separated by a distance that is generally equal to or less than about 10.1 mm. The modular jack may also include a latching area that securely holds the connector plug within the receptacle, but allows the connector plug to be removed from the receptacle without the user depressing a biased clip of the connector plug if a predetermined force is applied to a body of the connector plug.
    • 9. 发明授权
    • Chip component assembly
    • US06650546B2
    • 2003-11-18
    • US09794515
    • 2001-02-27
    • Jon A. NelsonRick GilesDavid Oliphant
    • Jon A. NelsonRick GilesDavid Oliphant
    • H05K114
    • H05K9/0039H05K1/0231H05K5/0256H05K2201/10371H05K2201/10492H05K2201/10636Y02P70/611
    • A chip component assembly is provided that includes a plurality of chip components each having respective first and second terminal elements, the first terminal elements being joined to corresponding solder pads on a printed circuit board, the solder pads being in communication with electronic circuitry of the printed circuit board, and the second terminal elements being joined together by an array ground plane of a grounding device. The grounding device additionally includes a ground path structure which physically and electrically connects the array ground plane, and thus the chip components, to a ground pad located on the printed circuit board so as to provide a ground path from the chip components. Preferably, the array ground plane additionally includes a plurality of resilient contact elements which provide for substantial and continuous contact between the array ground plane and an ancillary ground plane, such as the top cover of a PC card. The grounding device serves to foreclose electrostatic discharge or EMI by the chip components and in some applications further serves to direct undesirable noise to ground. The relatively small size of the grounding device permits the use of a relatively smaller ground pad on the printed circuit board, thereby conserving valuable printed circuit board surface area. Finally, the ground path structure is configured for automated attachment to the chip components, and the chip component assembly thus formed is well suited for installation on the printed circuit board by pick-and-place manufacturing techniques.