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    • 4. 发明授权
    • Feedthrough assembly and method
    • 馈通装配和方法
    • US07341802B1
    • 2008-03-11
    • US10811434
    • 2004-03-25
    • Naoki OtaHiroshi NakaharaDavid L. DeMuthM. Elizabeth Bush
    • Naoki OtaHiroshi NakaharaDavid L. DeMuthM. Elizabeth Bush
    • H01M2/06
    • H01M2/065H01M2/0404H01M2/0482H01M2/0486H01M10/0525H01M10/0587
    • A feedthrough is insulated and hermetically sealed by brazing a ceramic disk to a case cover and by brazing the top surface of the ceramic disk to the bottom surface of a feedthrough pinhead. Using this technique instead of forming a compression seal, the surface area for bonding is increased, increasing bond strength. The ceramic disk electrically insulates the feedthrough pin from the cover, and provides a large surface area for mechanically sealing the cell with the braze. Considering the small size of many cells, this increased surface area is important for getting a good seal and increasing bond strength. This design also creates a longer fluid path, providing greater hermeticity. Furthermore, a greater range of component material combinations is available because CTE compatibility limitations of the feedthrough pin, cover, and insulator are minimized. This feedthrough is applicable to broad array of applications and numerous material combinations.
    • 馈通通过将陶瓷盘钎焊到外壳盖并通过将陶瓷盘的顶表面钎焊到馈通针头的底表面进行绝缘和密封。 使用这种技术而不是形成压缩密封,粘合的表面积增加,粘结强度增加。 陶瓷盘将馈通销与盖电绝缘,并提供大的表面积用于用钎焊机械密封电池。 考虑到许多细胞的体积小,这种增加的表面积对于获得良好的密封和增加粘合强度是重要的。 该设计还创造了更长的流体路径,提供更大的气密性。 而且,更大范围的组件材料组合是可用的,因为馈通销,盖和绝缘体的CTE兼容性限制被最小化。 该馈通适用于广泛的应用和众多材料组合。