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    • 3. 发明授权
    • Epoxy-terminated prepolymer of polyepoxide and diamine with curing agent
    • 聚环氧化物和二胺与固化剂的环氧封端预聚物
    • US5965673A
    • 1999-10-12
    • US835671
    • 1997-04-10
    • Ralph D. HermansenSteven E. Lau
    • Ralph D. HermansenSteven E. Lau
    • C08G59/06C08G59/08C08G59/40C08L63/00C08K3/36C08L63/02C08L63/04
    • C08G59/4042C08G59/066C08G59/08
    • A solid, one-component, flexible epoxy-based composition and method for making the same are provided. The present compositions comprise: (a) an epoxy-terminated prepolymer formed by reacting at least four moles of a polyepoxide resin with approximately one mole of a diamine compound, wherein at least one of the polyepoxide resin and diamine compound is solid at room temperature, and wherein the prepolymer is rheologically stable for weeks as a single component mixture at room temperature and, and (b) a substantially stoichiometric amount of an epoxy resin curing agent selected from the group consisting of a heat-curable, latent epoxy resin curing agent and a room temperature-curable ketimine curing agent. Optional components include thixotropic agents, diluents, fillers, anti-oxidants, and processing aids. The present uncured epoxy-based compositions upon cure, exhibit a durometer Shore D of less than about 45 (or a durometer Shore A of less than about 100).
    • 提供固体,单组分,柔性环氧基组合物及其制备方法。 本发明的组合物包括:(a)通过使至少四摩尔的聚环氧树脂与约1摩尔的二胺化合物反应形成的环氧基封端的预聚物,其中至少一种聚环氧树脂和二胺化合物在室温下是固体, 并且其中所述预聚物在室温下作为单一组分混合物流变稳定数周,和(b)基本上化学计量的环氧树脂固化剂,其选自可热固化的潜在环氧树脂固化剂和 室温固化的酮亚胺固化剂。 任选组分包括触变剂,稀释剂,填充剂,抗氧化剂和加工助剂。 目前未固化的环氧基组合物在固化时表现出小于约45的肖氏硬度(或肖氏A的硬度小于约100)。
    • 4. 发明授权
    • Adhesive of flexible epoxy resin and latent dihydrazide
    • 柔性环氧树脂和潜在二酰肼的粘合剂
    • US06723803B1
    • 2004-04-20
    • US08700133
    • 1996-08-20
    • Ralph D. HermansenSteven E. Lau
    • Ralph D. HermansenSteven E. Lau
    • C08G5940
    • C08G59/4035C08G59/20C08G59/22C09J163/00
    • Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not exceeding a durometer Shore D reading of 45 when cured with a stoichiometric amount of diethylene triamine (“DETA”); and (b) a substantially stoichiometric amount of at least one latent epoxy resin curing agent. Optionally, the adhesive composition may also incorporate one or more semi-flexible resins. Other optional components include fillers, thixotropic agents, and flexibilizers. The adhesive composition provicdes an epoxy-based adhesive composition that is storable for weeks as a single component mixture at room temperature, curable at temperatures ranging from about 100° C. to 125° C. in less than two hours, and flexible upon curing to temperatures as low as minus 50° C., exhibiting a durometer Shore A of less than about 95.
    • 在未固化状态下在室温下保持稳定的柔性环氧基粘合剂组合物包含:(a)当化学计量量的二亚乙基三胺固化时,至少一种硬度不超过硬度的肖氏D读数为45的柔性聚环氧树脂( “DETA”); 和(b)基本上化学计量的至少一种潜在环氧树脂固化剂。 任选地,粘合剂组合物还可以掺入一种或多种半柔性树脂。 其它任选的组分包括填料,触变剂和增韧剂。 粘合剂组合物提供环氧基粘合剂组合物,其可在室温下作为单一组分混合物储存数周,可在不到两小时内在约100℃至125℃的温度范围内固化,并且在固化至 温度低至零下50摄氏度,表现出肖氏A的硬度小于约95。
    • 5. 发明授权
    • Room-temperature stable, one-component, thermally-conductive, flexible
epoxy adhesives
    • 室温稳定,单组分,导热,柔性环氧胶粘剂
    • US6060539A
    • 2000-05-09
    • US877980
    • 1997-06-18
    • Ralph D. HermansenSteven E. Lau
    • Ralph D. HermansenSteven E. Lau
    • C08G59/18C08G59/20C08G59/40C08K3/22C08K3/34C08K3/38C09J163/00C08K3/28
    • C08K3/34C08G59/184C08G59/20C08G59/4035C08K3/22C08K3/38C09J163/00
    • A flexible thermally-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) a thermally-conductive filler. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks or even months at room temperature and is curable in less than one hour at a temperature ranging from about 100.degree. C. to 140.degree. C., whereupon the cured adhesive composition exhibits a durometer Shore A of less than about 90 and a thermal conductivity exceeding 0.4 BTU/hr-ft-.degree. F. (0.7 W/m-K).
    • 提供柔性导热性环氧系粘合剂组合物及其制造方法。 本发明的粘合剂组合物包含(a)当用化学计量的二亚乙基三胺(“DETA”)固化时,包含至少一种硬度不超过约45的硬度的肖氏D读数的聚环氧树脂的聚合物混合物和基本上化学计量 至少一种潜在环氧树脂固化剂的量; 和(b)导热填料。 可选组分包括二级环氧树脂,非反应性增韧剂,稀释剂和加工助剂。 本粘合剂组合物在室温下流变稳定数周或甚至几个月,并且在约100℃至140℃的温度下在少于1小时内可固化,因此固化的粘合剂组合物显示硬度为肖氏A 小于约90,热导率超过0.4BTU / hr-ft-°F(0.7W / mK)。
    • 7. 发明授权
    • Low exotherm, low temperature curing, epoxy impregnants
    • 低放热,低温固化,环氧浸渍剂
    • US5350779A
    • 1994-09-27
    • US85244
    • 1993-06-29
    • Ralph D. HermansenSteven E. Lau
    • Ralph D. HermansenSteven E. Lau
    • C08G59/50H01B3/40C08L63/02
    • C08G59/5026H01B3/40
    • Epoxy-type impregnating compounds, which are useful for electrical potting or encapsulation, plastic tooling, and fiber-reinforced composites, comprise a resin component and a stoichiometric amount of a curative and have a curing temperature of less than about 120.degree. F. (49.degree. C.). The resin component is the diglycidyl ether of bisphenol A, either alone or as a mixture with up to about 15 wt % of at least one reactive monoepoxide diluent or up to about 50 wt % of at least one reactive diepoxide diluent, the diluent having a viscosity of less than about 200 cp. The curative is a mixture of cycloaliphatic diamines, comprising from about 20 to 80 wt % of at least one sterically-hindered cycloaliphatic diamine and the balance at least one sterically-unhindered cycloaliphatic diamine. These epoxy compounds are unique because they can be handled in relatively large bulk without concern for dangerous runaway exotherms. In addition, they result in useful products with a moderate service temperature range, without the necessity of high temperature cures. The advantages of the low temperature cure are lower residual stress in the cured product, better dimensional control in molding, and lower energy expenditure.
    • 可用于电灌封或封装,塑料加工和纤维增强复合材料的环氧型浸渍化合物包含树脂组分和化学计量量的固化剂,其固化温度低于约120°F。(49 DEG)。 树脂组分是双酚A的二缩水甘油醚,单独或作为与至多约15重量%的至少一种反应性单环氧化物稀释剂或至多约50重量%的至少一种反应性二环氧化物稀释剂的混合物,所述稀释剂具有 粘度小于约200cp。 固化剂是脂环族二胺的混合物,其包含约20至80重量%的至少一个空间位阻环脂族二胺,余量至少一个空间不受阻碍的脂环族二胺。 这些环氧化合物是独特的,因为它们可以在相当大的体积下处理,而不用担心危险的放电放电。 此外,它们产生具有适中的使用温度范围的有用产品,而不需要高温固化。 低温固化的优点是固化产物残留应力较低,成型时尺寸控制更好,能耗更低。
    • 8. 发明授权
    • Adhesive of epoxy resin, amine-terminated ban and conductive filler
    • 环氧树脂粘合剂,胺封端和导电填料
    • US5929141A
    • 1999-07-27
    • US901153
    • 1997-07-28
    • Steven E. LauDeborah S. HuffRalph D. HermansenE. Dean Johnston
    • Steven E. LauDeborah S. HuffRalph D. HermansenE. Dean Johnston
    • C08G59/22C08G59/50C09J9/02C09J163/00H05K3/32C08K3/08
    • H05K3/321C08G59/22C08G59/50C09J163/00H05K2201/0133
    • A flexible, electrically-conductive, one-component epoxy adhesive composition and method for making the same are provided. The present adhesive composition comprises: (a) at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45 when cured with a stoichiometric amount of diethylene triamine; (b) a substantially stoichiometric amount of curing agent including at least one amine-terminated butadiene-acrylonitrile polymer; and (c) an electrically-conductive filler. The epoxy adhesive, upon cure, has a volume resistivity not exceeding about 10.sup.-3 ohm-cm at room temperature and a drop resistance such that a 6-mil-thick (0.015 cm) bond effected by the adhesive can withstand at least six 60-inch (152 cm) drops onto a hard surface. Optional components in the epoxy adhesive include secondary rigid and semi-rigid epoxy resins, secondary amine curing agents, non-reactive flexibilizers, diluents, and processing aids. The adhesive bonds achieved using these epoxy adhesives are non-brittle, flexible, resilient, and drop-resistant, while also exhibiting strong adhesion and good processing characteristics.
    • 提供柔性导电的单组分环氧粘合剂组合物及其制备方法。 本发明的粘合剂组合物包含:(a)当化学计量量的二亚乙基三胺固化时,至少一种聚环氧树脂的硬度不超过肖氏D读数约45; (b)基本上化学计量的固化剂,包括至少一种胺封端的丁二烯 - 丙烯腈聚合物; 和(c)导电填料。 环氧树脂粘合剂在固化时的体积电阻率在室温下不超过约10-3欧姆 - 厘米,并且具有防滴落性,使得由粘合剂实现的6密耳厚(0.015cm)的粘合剂能够承受至少六个60 -inch(152厘米)滴在硬表面上。 环氧树脂粘合剂中的任选组分包括二级刚性和半刚性环氧树脂,仲胺固化剂,非反应性增韧剂,稀释剂和加工助剂。 使用这些环氧树脂粘合剂的粘合剂粘合剂是非脆性的,柔性的,有弹性的和防滴落的,同时还具有很强的附着力和良好的加工特性。
    • 9. 发明授权
    • Room-temperature stable, one-component, electrically-conductive,
flexible epoxy adhesives
    • 室温稳定,单组分,导电,柔性环氧胶粘剂
    • US5575956A
    • 1996-11-19
    • US504002
    • 1995-07-19
    • Ralph D. HermansenSteven E. Lau
    • Ralph D. HermansenSteven E. Lau
    • C08G59/22C08G59/32C08G59/36C08G59/38C08G59/50C08G59/56C08K3/08C08L63/04C09J9/02C09J163/00C09J163/04H01B1/20H01B1/22
    • H01B1/22
    • A flexible electrically-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises: (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore A reading of 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) an electrically-conductive filler comprising a metal. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks as a single component mixture at room temperature and is curable in less than two hours at a temperature ranging from about 100.degree. C. to 140.degree. C., whereupon the cured adhesive composition exhibits a durometer Shore A of less than 95 and a volume resistivity less than about 10.sup.-2 ohm-cm at room temperature.
    • 提供柔性导电性环氧类粘合剂组合物及其制造方法。 本发明的粘合剂组合物包括:(a)当用化学计量量的二亚乙基三胺(“DETA”)固化时,包含至少一种硬度不超过硬度的肖氏A读数为45的聚环氧树脂的聚合物混合物和基本上化学计量 至少一种潜在环氧树脂固化剂的量; 和(b)包含金属的导电填料。 可选组分包括二级环氧树脂,非反应性增韧剂,稀释剂和加工助剂。 本粘合剂组合物在室温下作为单一组分混合物流变稳定了几周,并且在约100℃至140℃的温度下在少于两小时内可固化,于是固化的粘合剂组合物显示出硬度为Shore A小于95,体积电阻率小于约10-2欧姆 - 厘米。