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1. 发明授权

US06801649B1 Method and apparatus for determining a reference point of a bottle bottom in an image 失效
标题翻译：用于确定图像中瓶底参考点的方法和装置
公开(公告)号：US06801649B1
公开(公告)日：2004-10-05
申请号：US09772751
申请日：2001-01-30
申请人： David J. Michael , Juha Koljonen , Paul Dutta-Choudhury
发明人： David J. Michael , Juha Koljonen , Paul Dutta-Choudhury
IPC分类号： G06K900
CPC分类号： G06K9/3216 , G06K9/6203 , G06T7/30 , G06T7/60
摘要： An efficient and reliable method and apparatus is disclosed that finds a reference point of an object profile within an image when the object is of an unknown size. The object profile is modeled using a synthetic labeled-projection model, which in conjunction with the image, is projected over a portion of the image of the object profile to derive a histogram. The histogram is normalized and a maximum of a first derivative of the histogram is defined for that position. The position of the labeled-projection model is moved relative to the image, and the process is repeated until a selected portion of the image has been examined. The first derivative of the normalized labeled projection is greatest when a feature of the image and the feature denoted by a specific synthetic label of the labeled-projection model are aligned. The method and apparatus can locate the center of the object with reliability, because use of the labeled-projection model and the histogram minimizes the * effects of image artifacts. Further, the method decreases computational time, and thus, increases performance speed.
摘要翻译：公开了一种有效且可靠的方法和装置，当物体具有未知尺寸时，找到图像内的对象轮廓的参考点。使用合成的标注投影模型对对象轮廓进行建模，该模型与图像一起投影在对象轮廓的图像的一部分上以导出直方图。对直方图进行归一化，并为该位置定义直方图的一阶导数的最大值。标记投影模型的位置相对于图像移动，并重复该过程直到已经检查图像的所选部分。当图像的特征和由标记投影模型的特定合成标签表示的特征对齐时，归一化标记投影的一阶导数最大。该方法和装置可以可靠地定位对象的中心，因为使用标注投影模型和直方图可以最大限度地减小图像伪影的*效应。此外，该方法减少了计算时间，从而提高了性能速度。

2. 发明授权

US06249602B1 Method and apparatus for determining a reference point of an object profile within an image 失效
标题翻译：用于确定图像内的对象轮廓的参考点的方法和装置
公开(公告)号：US06249602B1
公开(公告)日：2001-06-19
申请号：US09086326
申请日：1998-05-28
申请人： David J. Michael , Juha Koljonen , Paul Dutta-Choudhury
发明人： David J. Michael , Juha Koljonen , Paul Dutta-Choudhury
IPC分类号： G06K900
CPC分类号： G06K9/3216 , G06K9/6203 , G06T7/30 , G06T7/60
摘要： An efficient and reliable method and apparatus is disclosed that finds a reference point of an object profile within an image when the object is of an unknown size. The object profile is modeled using a synthetic labeled-projection model, which in conjunction with the image, is projected over a portion of the image of the object profile to derive a histogram. The histogram is normalized and a maximum of a first derivative of the histogram is defined for that position. The position of the labeled-projection model is moved relative to the image, and the process is repeated until a selected portion of the image has been examined. The first derivative of the normalized labeled projection is greatest when a feature of the image and the feature denoted by a specific synthetic label of the labeled-projection model are aligned. The method and apparatus can locate the center of the object with reliability, because use of the labeled-projection model and the histogram minimizes the * effects of image artifacts. Further, the method decreases computational time, and thus, increases performance speed.
摘要翻译：公开了一种有效且可靠的方法和装置，当物体具有未知尺寸时，找到图像内的对象轮廓的参考点。使用合成的标注投影模型对对象轮廓进行建模，该模型与图像一起投影在对象轮廓的图像的一部分上以导出直方图。对直方图进行归一化，并为该位置定义直方图的一阶导数的最大值。标记投影模型的位置相对于图像移动，并重复该过程直到已经检查图像的所选部分。当图像的特征和由标记投影模型的特定合成标签表示的特征对齐时，归一化标记投影的一阶导数最大。该方法和装置可以可靠地定位对象的中心，因为使用标注投影模型和直方图可以最大限度地减小图像伪影的*效应。此外，该方法减少了计算时间，从而提高了性能速度。

3. 发明授权

US5912984A Method and apparatus for in-line solder paste inspection 失效
标题翻译：用于在线焊膏检测的方法和设备
公开(公告)号：US5912984A
公开(公告)日：1999-06-15
申请号：US769739
申请日：1996-12-19
申请人： David J. Michael , Juha Koljonen , Sanjay Nichani , Peter Roberts
发明人： David J. Michael , Juha Koljonen , Sanjay Nichani , Peter Roberts
IPC分类号： B23K3/08 , G06T7/00 , H05K1/02 , H05K3/12 , H05K3/34 , G06K9/00
CPC分类号： G06T7/001 , B23K3/08 , G06T7/0028 , G06T7/2053 , H05K3/3484 , B23K2201/40 , G06T2207/30152 , H05K1/0269 , H05K2203/163 , H05K3/1216
摘要： Inspection of solder paste on a printed circuit board using a before printing image (pre-image) to normalize an after printing image (post-image) of the printed circuit board. Existing lighting and optics used for alignment of the screen printing stencil to the printed circuit board are used for the solder paste inspection. A stencil in the screen printing process is also inspected using a before printing image (pre) to normalize an after printing image (post) of the stencil.
摘要翻译：使用之前打印的图像（预图像）检查印刷电路板上的焊膏以使印刷电路板的后打印图像（后图像）归一化。用于将丝网印刷模板对准印刷电路板的现有照明和光学装置用于焊膏检查。丝网印刷过程中的模板也使用之前的打印图像（预）进行检查，以对印版图像（后）进行归一化。

4. 发明授权

US5550763A Using cone shaped search models to locate ball bonds on wire bonded devices 失效
标题翻译：使用锥形搜索模型来定位导线接合装置上的球形接合
公开(公告)号：US5550763A
公开(公告)日：1996-08-27
申请号：US236211
申请日：1994-05-02
申请人： David J. Michael , Juha Koljonen , Arman Garakani
发明人： David J. Michael , Juha Koljonen , Arman Garakani
IPC分类号： G01N21/88 , H05K13/08 , G01B11/24 , G01N21/86
CPC分类号： G01N21/88 , H01L24/48 , H01L24/85 , H05K13/08 , H01L2224/48465 , H01L2224/859 , H01L2924/00014 , H01L2924/14
摘要： Method and apparatus for automatically locating the center of a ball bond of a wire to a lead frame and semiconductor chip or similar device; analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform. The present invention constructs a synthetic flattened cone model using a center radius, and monotonically increasing slope values to generate a model having a variation in grey levels, and inner and outer radii that will encompass expected size variations in a ball bond; sets a threshold for acceptable normalized correlation search results; acquires a digitized image of the bond, including a nominal location for the bond; conducts a normalized correlation search of the digitized image at the bond location, using the flattened synthetic cone model; and indicates the presence and location of the expected circular object as the location having the largest coefficient which exceeds a threshold.
摘要翻译：用于自动将导线的球接合中心定位到引线框架和半导体芯片或类似装置的方法和装置; 分析光学感测图像; 粘合机制; 以及连接到所述接合机构，所述可移动平台的主机控制器。本发明使用中心半径构造合成扁平锥体模型，并且单调地增加斜率值以产生具有灰度级变化的模型，以及包含球形键的预期尺寸变化的内外半径; 设置可接受的标准化相关搜索结果的阈值; 获得债券的数字化图像，包括债券的标称位置; 使用扁平的合成锥模型，对结合位置处的数字化图像进行归一化相关检索; 并且指示期望的圆形物体作为具有超过阈值的最大系数的位置的存在和位置。

5. 发明授权

US5640199A Automated optical inspection apparatus 失效
标题翻译：自动光学检测仪器
公开(公告)号：US5640199A
公开(公告)日：1997-06-17
申请号：US236215
申请日：1994-05-02
申请人： Arman Garakani , David J. Michael , Juha Koljonen
发明人： Arman Garakani , David J. Michael , Juha Koljonen
IPC分类号： E05B9/08 , E05B13/10 , G06T7/00 , H01L21/66 , H04N7/18
CPC分类号： G06T7/001 , G06T7/0024 , H01L24/85 , G06T2207/30152 , H01L22/12 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/49171 , H01L2224/78801 , H01L2224/78901 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/01322 , H01L2924/14
摘要： This invention provides a method and apparatus for automatically locating the bond of a wire to a lead frame and semiconductor chip or similar device as an in-process operation to facilitate in-process inspection. The apparatus includes a wire bonding machine, or similar apparatus, having a movable platform such as an X-Y table for holding semiconductor chips situated in lead frames; a video camera or other optical sensing or imaging device for generating images, which camera is typically positioned over the target chip and lead frame to be bonded; illumination means for illuminating the chip in a lead frame; an image processor capable of summing said absolute difference values, whereby each sum is stored as a difference metric, and digitizing and analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform, the camera and the image processor. The apparatus generates and stores a pre-bond digital image of the semiconductor chip in the lead frame before bonding has occurred; connects one or more wires between the chip and lead frame by any of a number of means such as ultrasonic bonding, heat bonding, conductive glue bonding or other means; generates and stores a post-bond digital image of the now-bonded chip in its lead frame; registers the pre-bond and post-bond stored digital images using nearest neighbor interpolation so that analysis can be done; and permits inspection of the results of the wire bonds according to appropriate criteria.
摘要翻译：本发明提供一种方法和装置，用于将导线的键合自动定位到引线框架和半导体芯片或类似装置，作为在线操作以便于进行中的检查。该装置包括具有诸如X-Y工作台的可移动平台的引线接合机或类似装置，用于保持位于引线框架中的半导体芯片; 用于产生图像的摄像机或其他光学感测或成像装置，该相机通常位于要接合的目标芯片和引线框架上; 照明装置，用于照亮引线框架中的芯片; 能够对所述绝对差值求和的图像处理器，由此将每个和存储为差分度量，并对光学感测图像进行数字化和分析; 粘合机制; 以及连接到接合机构，可移动平台，相机和图像处理器的主机控制器。在发生接合之前，该装置生成并存储引线框中的半导体芯片的预先接合数字图像; 通过诸如超声波接合，热粘合，导电胶粘或其它方式的任何一种手段来连接芯片和引线框架之间的一条或多条线; 在其引线框中产生并存储现在粘合的芯片的后绑定数字图像; 使用最近邻插值注册预绑定和后绑定存储的数字图像，以便进行分析; 并且可以根据适当的标准检查引线结果。

6. 发明授权

US5581632A Method and apparatus for ball bond inspection system 失效
标题翻译：球焊检测系统的方法和装置
公开(公告)号：US5581632A
公开(公告)日：1996-12-03
申请号：US236213
申请日：1994-05-02
申请人： Juha Koljonen , David J. Michael
发明人： Juha Koljonen , David J. Michael
IPC分类号： G01B11/00 , G01B11/24 , G06T1/00 , G06T7/00 , G06T7/60 , G06K9/46
CPC分类号： G06K9/4633 , G06T7/0004 , G06T7/004 , G06T7/602 , G06T7/606 , G06T2207/30152
摘要： The invention automatically inspects the bond of a wire to a contact pad on a semiconductor chip. The apparatus includes a movable platform for holding semiconductor chips situated in lead frames; a video camera for sensing images; illumination means for illuminating a chip in a lead frame; an image processor to digitize and analyze the images; a bonding mechanism; and a host controller electronically connected to bonding mechanism, movable platform, video camera, and image processor. Image processor locates a bond on a pad in a digitized image and provides a first nominal center of ball bond image. The invention aligns the center of a polar coordinate transform image having one or more segments with the nominal center of ball bond image and evaluates ball bond image using the polar coordinate transform image to create a polar projection histogram array and store it. An edge filter is applied to histogram array to detect peaks and store their number and values. Polar coordinate transform image is aligned with a next nominal ball center location until a predetermined number of potential ball center locations is exhausted. The maximum peak in the list of stored peaks is selected as the radius of bond from which the size and position of bond is computed and reported to host controller for further action.
摘要翻译：本发明自动检查导线与半导体芯片上接触焊盘的接合。该装置包括用于保持位于引线框架中的半导体芯片的可移动平台; 用于感测图像的摄像机; 用于照亮引线框架中的芯片的照明装置; 图像处理器，用于数字化和分析图像; 粘合机制; 以及主机控制器，电连接到接合机构，可移动平台，摄像机和图像处理器。图像处理器将数字化图像中的焊盘定位在焊盘上，并提供第一个标称中心的焊球图像。本发明将具有一个或多个段的极坐标变换图像的中心与球形接合图像的标称中心对准，并使用极坐标变换图像评估球接合图像，以创建极性投影直方图阵列并将其存储。边缘滤波器应用于直方图阵列以检测峰值并存储其数量和值。极坐标变换图像与下一个标称球中心位置对齐，直到预定数量的潜在球中心位置被耗尽。选择存储峰值列表中的最大峰值作为键的半径，从中计算结合的大小和位置并将其报告给主机控制器进行进一步的操作。

7. 发明授权

US08189904B2 Image preprocessing for probe mark inspection 有权
标题翻译：图像预处理用于探针标记检查
公开(公告)号：US08189904B2
公开(公告)日：2012-05-29
申请号：US12948437
申请日：2010-11-17
申请人： Aaron S. Wallack , Juha Koljonen , David J. Michael
发明人： Aaron S. Wallack , Juha Koljonen , David J. Michael
IPC分类号： G06K9/00
CPC分类号： G06K9/4619 , G06T5/002 , G06T5/10 , G06T7/0004 , G06T2207/30148 , G06T2207/30152
摘要： Digital image processing methods are applied to an image of a semiconductor interconnection pad to preprocess the image prior to an inspection or registration. An image of a semiconductor pads exhibiting spatial patterns from structure, texture or features are filtered without affecting features in the image not associated with structure or texture. The filtered image is inspected in a probe mark inspection operation.
摘要翻译：数字图像处理方法应用于半导体互连焊盘的图像，以便在检查或注册之前对图像进行预处理。在结构，纹理或特征上呈现空间图案的半导体焊盘的图像被过滤而不影响图像中与结构或纹理无关的特征。在探针标记检查操作中检查过滤图像。

8. 发明授权

US07885453B1 Image preprocessing for probe mark inspection 有权
标题翻译：图像预处理用于探针标记检查
公开(公告)号：US07885453B1
公开(公告)日：2011-02-08
申请号：US11759590
申请日：2007-06-07
申请人： Aaron S. Wallack , Juha Koljonen , David J. Michael
发明人： Aaron S. Wallack , Juha Koljonen , David J. Michael
IPC分类号： G06K9/00
CPC分类号： G06K9/4619 , G06T5/002 , G06T5/10 , G06T7/0004 , G06T2207/30148 , G06T2207/30152
摘要： Digital image processing methods are applied to an image of a semiconductor interconnection pad to preprocess the image prior to an inspection or registration. An image of a semiconductor pads exhibiting spatial patterns from structure, texture or features are filtered without affecting features in the image not associated with structure or texture. The filtered image is inspected in a probe mark inspection operation.
摘要翻译：数字图像处理方法应用于半导体互连焊盘的图像，以便在检查或注册之前对图像进行预处理。在结构，纹理或特征上呈现空间图案的半导体焊盘的图像被过滤而不影响图像中与结构或纹理无关的特征。在探针标记检查操作中检查过滤图像。

9. 发明授权

US06317513B2 Method and apparatus for inspecting solder paste using geometric constraints 有权
标题翻译：使用几何约束检查焊膏的方法和设备
公开(公告)号：US06317513B2
公开(公告)日：2001-11-13
申请号：US09156918
申请日：1998-09-18
申请人： David J. Michael , Juha Koljonen
发明人： David J. Michael , Juha Koljonen
IPC分类号： G06K900
CPC分类号： B23K3/08 , B23K2101/40 , G06T7/001 , G06T7/254 , G06T7/33 , G06T2207/30152 , H05K1/0269 , H05K3/1216 , H05K3/3484 , H05K2203/163
摘要： Inspection of solder paste on a printed circuit board using a before printing image (pre-application image) to normalize an after printing image (post-application image) of the printed circuit board. Existing lighting and optics used for alignment of the screen-printing stencil to the printed circuit board are used for the solder paste inspection. An embodiment is described wherein pad regions of the printed circuit board are inspected for information about the solder paste applied on the pad regions of the printed circuit board. A stencil in the screen printing process is also inspected using a before printing image (pre-application) to normalize an after printing image (post-application) of the stencil.
摘要翻译：使用之前的打印图像（预应用图像）检查印刷电路板上的焊膏以使印刷电路板的印后图像（后应用图像）归一化。用于将丝网印刷模板对准印刷电路板的现有照明和光学器件用于焊膏检查。描述了一种实施例，其中检查印刷电路板的焊盘区域以获得关于施加在印刷电路板的焊盘区域上的焊膏的信息。丝网印刷过程中的模板也使用之前的打印图像（预先应用）进行检查，以对印版图像进行归一化（后应用）。

10. 发明授权

US5901241A Labeled projection of digital images 失效
标题翻译：数字图像的标注投影
公开(公告)号：US5901241A
公开(公告)日：1999-05-04
申请号：US759853
申请日：1996-12-02
申请人： Juha Koljonen , David J. Michael
发明人： Juha Koljonen , David J. Michael
IPC分类号： G01B11/00 , G01B11/24 , G06T1/00 , G06T7/00 , G06T7/60 , G06K9/46
CPC分类号： G06K9/4633 , G06T7/0004 , G06T7/004 , G06T7/602 , G06T7/606 , G06T2207/30152
摘要： The invention automatically inspects the bond of a wire to a contact pad on a semiconductor chip. The apparatus includes a movable platform for holding semiconductor chips situated in lead frames; a video camera for sensing images; illumination means for illuminating a chip in a lead frame; an image processor to digitize and analyze the images; a bonding mechanism; and a host controller electronically connected to bonding mechanism, movable platform, video camera, and image processor. Image processor locates a bond on a pad in a digitized image and provides a first nominal center of ball bond image. The invention aligns the center of a polar coordinate transform image having one or more segments with the nominal center of ball bond image and evaluates ball bond image using the polar coordinate transform image to create a polar projection histogram array and store it. An edge filter is applied to histogram array to detect peaks and store their number and values. Polar coordinate transform image is aligned with a next nominal ball center location until a predetermined number of potential ball center locations is exhausted. The maximum peak in the list of stored peaks is selected as the radius of bond from which the size and position of bond is computed and reported to host controller for further action.
摘要翻译：本发明自动检查导线与半导体芯片上接触焊盘的接合。该装置包括用于保持位于引线框架中的半导体芯片的可移动平台; 用于感测图像的摄像机; 用于照亮引线框架中的芯片的照明装置; 图像处理器，用于数字化和分析图像; 粘合机制; 以及主机控制器，电连接到接合机构，可移动平台，摄像机和图像处理器。图像处理器将数字化图像中的焊盘定位在焊盘上，并提供第一个标称中心的焊球图像。本发明将具有一个或多个段的极坐标变换图像的中心与球形接合图像的标称中心对准，并使用极坐标变换图像评估球接合图像，以创建极性投影直方图阵列并将其存储。边缘滤波器应用于直方图阵列以检测峰值并存储其数量和值。极坐标变换图像与下一个标称球中心位置对齐，直到预定数量的潜在球中心位置被耗尽。选择存储峰值列表中的最大峰值作为键的半径，从中计算结合的大小和位置并将其报告给主机控制器进行进一步的操作。

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