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    • 8. 发明授权
    • Passive alignment and packaging of optoelectronic components to optical
waveguides using flip-chip bonding technology
    • 使用倒装芯片焊接技术将光电子部件无源对准和封装到光波导中
    • US5499312A
    • 1996-03-12
    • US299176
    • 1994-08-31
    • Kenneth H. HahnRonald T. Kaneshiro
    • Kenneth H. HahnRonald T. Kaneshiro
    • H01L33/00G02B5/32G02B6/30G02B6/42G02B6/43H01L21/60H01L27/15H01L31/0232H01L31/12H04B10/00
    • G02B6/43G02B6/4232G02B6/4214H01L2224/16225H01L2224/48091H01L2224/49109
    • A method and apparatus for automatic passive alignment of optical waveguides with photonic devices to provide for high volume production of optical components at low cost. The invention includes an optical waveguide having an extremity for transmission of light there through. A first wetable pad is mechanically coupled with the waveguide and is arranged at a selected lateral distance from the extremity of the waveguide. The invention further includes a photonic device having a central region on a surface of the photonic device. A second wetable pad is mechanically coupled with the photonic device and is arranged at a selected lateral distance from the central region of the photonic device. A suitable material, for example solder, is chosen and used in a bond for holding the first pad in alignment with the second pad, so as to substantially provide a desired optical alignment of the extremity of the waveguide with the central region of the photonic device. The chosen material is in a liquid form as it is disposed in contact with the first and second wetable pads. Surface tension of a controlled volume of the chosen material pulls the first wetable pad into alignment with the second wetable pad, thereby substantially aligning the extremity of the waveguide with the central region of the photonic device.
    • 用于光波导与光子器件的自动被动对准的方法和装置,以便以低成本提供光学部件的大批量生产。 本发明包括具有用于透过光的末端的光波导。 第一可润湿垫与波导机械耦合并且布置在离波导末端的选定横向距离处。 本发明还包括具有在光子器件的表面上的中心区域的光子器件。 第二可润湿垫与光子器件机械耦合并且被布置在距离光子器件的中心区域的选定横向距离处。 选择合适的材料,例如焊料,并将其用于保持第一焊盘与第二焊盘对准的接合处,以便基本上提供波导末端与光子器件的中心区域的期望的光学对准 。 所选择的材料为与第一和第二可润湿垫接触的液体形式。 所选材料的受控体积的表面张力拉动第一可润湿垫与第二可润湿垫对准,从而基本上将波导的末端与光子器件的中心区对准。