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    • 5. 发明授权
    • Polyepoxide, catalyst/cure inhibitor complex and anhydride
    • 聚环氧化物,催化剂/固化抑制剂络合物和酸酐
    • US06613839B1
    • 2003-09-02
    • US09008983
    • 1998-01-20
    • Joseph GanJohn P. Everett
    • Joseph GanJohn P. Everett
    • C08G5942
    • C08G59/42C08G59/18C08L63/00Y10T428/31511C08L2666/04
    • An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of greater than zero and less than 2.5, or an organic acid having a pKa value of 1 or more, a catalyst which can be complexed with the cure inhibitor, and c) more than 30 parts by weight per 100 parts by weight of polyepoxide of a cross-linker such as a polycarboxylic acid or anhydride including a copolymer of an ethylenically unsaturated anhydride and a vinyl compound, or a hydroxy-functional compound such as a copolymer of styrene and hydroxystyrene.
    • 环氧树脂组合物包括a)聚环氧化物,b)硼酸的固化抑制剂,硼的路易斯酸衍生物,烷基硼烷,具有大于零且小于2.5的亲核性值“n”的无机酸,或 pKa值为1以上的有机酸,可与固化抑制剂配合的催化剂,以及c)相对于100重量份交联剂如聚羧酸或多元羧酸的多环氧化物,c)超过30重量份 包括烯键式不饱和酸酐和乙烯基化合物的共聚物的酸酐,或苯乙烯与羟基苯乙烯的共聚物等羟基官能化合物。