专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20140091149A1 DUAL INTERFACE SMART CARDS, AND METHODS OF MANUFACTURING 有权
标题翻译：双界面智能卡及其制造方法
公开(公告)号：US20140091149A1
公开(公告)日：2014-04-03
申请号：US14020884
申请日：2013-09-08
申请人： David Finn , Patrick Gerard Conneely , Jan Thomas Czornack , Klaus Ummenhofer , Mustafa Lotya
发明人： David Finn , Patrick Gerard Conneely , Jan Thomas Czornack , Klaus Ummenhofer , Mustafa Lotya
IPC分类号： G06K19/077 , H05K3/10
CPC分类号： G06K19/07794 , G06K19/07769 , G06K19/07783 , H01F38/14 , H01Q1/2216 , H01Q1/2225 , H01Q1/2283 , H01Q7/00 , H01Q21/29 , H05K1/165 , H05K3/103 , H05K2201/10098 , Y10T29/49018 , Y10T29/49162
摘要： A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).
摘要翻译：用于智能卡的增强天线（BA）包括围绕卡体（CB）的周边延伸的卡片天线（CA）部件，在天线模块（AM）的位置处的耦合线圈（CC）部件，以及扩展天线（EA）有助于增强天线（BA）的电感。还公开了一种通过控制由嵌入工具在卡体（CB）上的不同位置施加的力和超声功率的电线嵌入方法。

2. 发明授权

US09033250B2 Dual interface smart cards, and methods of manufacturing 有权
标题翻译：双接口智能卡和制造方法
公开(公告)号：US09033250B2
公开(公告)日：2015-05-19
申请号：US14020884
申请日：2013-09-08
申请人： David Finn , Patrick Gerard Conneely , Jan Thomas Czornack , Klaus Ummenhofer , Mustafa Lotya
发明人： David Finn , Patrick Gerard Conneely , Jan Thomas Czornack , Klaus Ummenhofer , Mustafa Lotya
IPC分类号： G06K19/06 , G06K19/077 , H05K3/10 , H01Q1/22 , H01Q7/00 , H01Q21/29 , H01F38/14
CPC分类号： G06K19/07794 , G06K19/07769 , G06K19/07783 , H01F38/14 , H01Q1/2216 , H01Q1/2225 , H01Q1/2283 , H01Q7/00 , H01Q21/29 , H05K1/165 , H05K3/103 , H05K2201/10098 , Y10T29/49018 , Y10T29/49162
摘要： A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).
摘要翻译：用于智能卡的增强天线（BA）包括围绕卡体（CB）的周边延伸的卡片天线（CA）部件，在天线模块（AM）的位置处的耦合线圈（CC）部件，以及扩展天线（EA）有助于增强天线（BA）的电感。还公开了一种通过控制由嵌入工具在卡体（CB）上的不同位置施加的力和超声功率的电线嵌入方法。

3. 发明申请

US20140104133A1 ANTENNA MODULES FOR DUAL INTERFACE SMART CARDS, BOOSTER ANTENNA CONFIGURATIONS, AND METHODS 有权
标题翻译：双界面智能卡天线模块，天线配置和方法
公开(公告)号：US20140104133A1
公开(公告)日：2014-04-17
申请号：US14078527
申请日：2013-11-13
申请人： David Finn , Jan Thomas Czornack , Mustafa Lotya , Theodor Fendt , Klaus Ummenhofer
发明人： David Finn , Jan Thomas Czornack , Mustafa Lotya , Theodor Fendt , Klaus Ummenhofer
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , G06K19/07769 , G06K19/07794 , H01F38/14 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49109 , H01L2224/73265 , H01L2924/00011 , H01L2924/16195 , H01L2924/19105 , H01Q1/2225 , H01Q1/2283 , H01Q7/00 , H05K1/0239 , H05K3/103 , H05K2201/086 , H05K2201/1003 , H05K2201/10098 , H01L2924/00014 , H01L2924/00 , H01L2924/01005 , H01L2924/01033
摘要： Winding a module antenna (MA) for an antenna module (AM) on a tubular support structure (SS) having have a lid structure (LD) or a planar tool (PT) disposed at its free end to constrain the windings. Alternatively, winding wire coils for module antennas (MA) on coil winding forms (CWF, FIG. 26) and transferring them to a module tape (MT). Double-sided and single-sided module tapes (MT) having vias and openings (h) are disclosed. Connection bridges (CBR) formed within, between or surrounding the contact pads (CP) are disclosed. Various configurations for components (CA, CC, EA) of booster antenna (BA) are disclosed. A coupler coil (CC) has an inner winding (iw) and an outer winding (ow). Techniques for embedding wire and for bonding wire are disclosed.
摘要翻译：在具有设置在其自由端的盖结构（LD）或平面工具（PT））的管状支撑结构（SS）上缠绕用于天线模块（AM）的模块天线（MA）以约束绕组。或者，用于线圈绕组形式的模块天线（MA）的绕组线圈（CWF，图26）并将它们传送到模块带（MT）。公开了具有通孔和开口（h）的双面和单面模块带（MT）。公开了形成在接触垫（CP）内，之间或围绕接触垫（CP）的连接桥（CBR）。公开了用于增强天线（BA）的组件（CA，CC，EA）的各种配置。耦合线圈（CC）具有内绕组（iw）和外绕组（ow）。公开了用于嵌入线和用于接合线的技术。

4. 发明授权

US09112272B2 Antenna modules for dual interface smart cards, booster antenna configurations, and methods 有权
标题翻译：用于双接口智能卡的天线模块，增强天线配置和方法
公开(公告)号：US09112272B2
公开(公告)日：2015-08-18
申请号：US14078527
申请日：2013-11-13
申请人： David Finn , Jan Thomas Czornack , Mustafa Lotya , Theodor Fendt , Klaus Ummenhofer
发明人： David Finn , Jan Thomas Czornack , Mustafa Lotya , Theodor Fendt , Klaus Ummenhofer
IPC分类号： H01Q1/38 , G06K19/077 , H01Q1/22 , H01Q7/00 , H05K3/10 , H01F38/14 , H05K1/02
CPC分类号： H01Q1/38 , G06K19/07769 , G06K19/07794 , H01F38/14 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49109 , H01L2224/73265 , H01L2924/00011 , H01L2924/16195 , H01L2924/19105 , H01Q1/2225 , H01Q1/2283 , H01Q7/00 , H05K1/0239 , H05K3/103 , H05K2201/086 , H05K2201/1003 , H05K2201/10098 , H01L2924/00014 , H01L2924/00 , H01L2924/01005 , H01L2924/01033
摘要： Winding a module antenna (MA) for an antenna module (AM) on a tubular support structure (SS) having have a lid structure (LD) or a planar tool (PT) disposed at its free end to constrain the windings. Alternatively, winding wire coils for module antennas (MA) on coil winding forms (CWF, FIG. 26) and transferring them to a module tape (MT). Double-sided and single-sided module tapes (MT) having vias and openings (h) are disclosed. Connection bridges (CBR) formed within, between or surrounding the contact pads (CP) are disclosed. Various configurations for components (CA, CC, EA) of booster antenna (BA) are disclosed. A coupler coil (CC) has an inner winding (iw) and an outer winding (ow). Techniques for embedding wire and for bonding wire are disclosed.
摘要翻译：在具有设置在其自由端的盖结构（LD）或平面工具（PT））的管状支撑结构（SS）上缠绕用于天线模块（AM）的模块天线（MA）以约束绕组。或者，用于线圈绕组形式的模块天线（MA）的绕组线圈（CWF，图26）并将它们传送到模块带（MT）。公开了具有通孔和开口（h）的双面和单面模块带（MT）。公开了形成在接触垫（CP）内，之间或围绕接触垫（CP）的连接桥（CBR）。公开了用于增强天线（BA）的组件（CA，CC，EA）的各种配置。耦合线圈（CC）具有内绕组（iw）和外绕组（ow）。公开了用于嵌入线和用于接合线的技术。

5. 发明授权

US09195932B2 Booster antenna configurations and methods 有权
标题翻译：增强天线配置和方法
公开(公告)号：US09195932B2
公开(公告)日：2015-11-24
申请号：US14173815
申请日：2014-02-06
申请人： David Finn , Mustafa Lotya , Klaus Ummenhofer
发明人： David Finn , Mustafa Lotya , Klaus Ummenhofer
IPC分类号： G06K19/07 , G06K19/077 , H01Q7/00 , H01Q1/22 , H01Q21/29 , H05K3/10 , H01F38/14
CPC分类号： G06K19/07794 , G06K19/07769 , H01F38/14 , H01Q1/2216 , H01Q1/2225 , H01Q1/2283 , H01Q7/00 , H01Q21/29 , H05K1/0239 , H05K1/165 , H05K3/103 , H05K2201/09036 , H05K2201/10098 , H05K2201/10287 , H05K2203/0285 , Y10T29/49162
摘要： A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).
摘要翻译：用于智能卡的增强天线（BA）包括围绕卡体（CB）的周边延伸的卡片天线（CA）部件，在天线模块（AM）的位置处的耦合线圈（CC）部件，以及扩展天线（EA）有助于增强天线（BA）的电感。还公开了一种通过控制由嵌入工具在卡体（CB）上的不同位置施加的力和超声功率的电线嵌入方法。

6. 发明申请

US20150269477A1 DUAL-INTERFACE HYBRID METAL SMARTCARD WITH A BOOSTER ANTENNA OR COUPLING FRAME 审中-公开
标题翻译：双接口混合金属智能卡，带有天线或耦合框架
公开(公告)号：US20150269477A1
公开(公告)日：2015-09-24
申请号：US14660941
申请日：2015-03-18
申请人： David Finn , Mustafa Lotya , Darren Molloy , Klaus Ummenhofer
发明人： David Finn , Mustafa Lotya , Darren Molloy , Klaus Ummenhofer
IPC分类号： G06K19/077
CPC分类号： G06K19/07794 , B23K26/361 , B23K26/40 , B23K2101/40 , B23K2103/50 , G06K19/07722 , G06K19/07747 , H01Q1/2225 , H01Q1/38 , H01Q7/00
摘要： A dual-interface metal hybrid smartcard comprising a plastic card body (CB); a metal slug (MS) disposed in the card body; and a booster antenna (BA) disposed in the card body. The metal slug may have a surface area which is at least 50% of a surface area of the card body, and may comprise titanium or alloys thereof. A antenna chip module (AM) having an antenna (MA) and contact pads (CP) may be disposed in an opening of the card body. The metal slug may comprise two or more separate metal slug components (MS-1, MS-2), which may overlap one another or which may be disposed at different locations in the card body (CB), without overlapping one another. The first metal slug component (MS-1) may be disposed around a peripheral portion of the card body (CB) as an “open loop” discontinuous metal frame around (external to) the booster antenna (BA). The second metal slug component (MS-2) may be disposed internal to the card antenna (CA) component of the booster antenna (BA).
摘要翻译：一种双接口金属混合智能卡，包括塑料卡体（CB）; 设置在卡体内的金属块（MS）; 以及设置在卡体内的增强天线（BA）。金属块可以具有至少占卡体表面积的50％的表面积，并且可以包括钛或其合金。具有天线（MA）和接触垫（CP）的天线芯片模块（AM）可以设置在卡体的开口中。金属块可以包括两个或更多个分开的金属块状部件（MS-1，MS-2），其可以彼此重叠或者可以布置在卡体（CB）中的不同位置处，而不会彼此重叠。第一金属块状部件（MS-1）可以围绕卡体（CB）的周边部分设置为围绕（外部）增强天线（BA）的“开环”不连续金属框架。第二金属芯块组件（MS-2）可以设置在增强天线（BA）的卡天线（CA）部件的内部。

7. 发明申请

US20150021402A1 BOOSTER ANTENNA CONFIGURATIONS AND METHODS 有权
标题翻译：加强天线配置和方法
公开(公告)号：US20150021402A1
公开(公告)日：2015-01-22
申请号：US14173815
申请日：2014-02-06
申请人： David Finn , Mustafa Lotya , Klaus Ummenhofer
发明人： David Finn , Mustafa Lotya , Klaus Ummenhofer
IPC分类号： G06K19/077 , H01Q1/22 , H01Q7/00
CPC分类号： G06K19/07794 , G06K19/07769 , H01F38/14 , H01Q1/2216 , H01Q1/2225 , H01Q1/2283 , H01Q7/00 , H01Q21/29 , H05K1/0239 , H05K1/165 , H05K3/103 , H05K2201/09036 , H05K2201/10098 , H05K2201/10287 , H05K2203/0285 , Y10T29/49162
摘要： A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).
摘要翻译：用于智能卡的增强天线（BA）包括围绕卡体（CB）的周边延伸的卡片天线（CA）部件，在天线模块（AM）的位置处的耦合线圈（CC）部件，以及扩展天线（EA）有助于增强天线（BA）的电感。还公开了一种通过控制由嵌入工具在卡体（CB）上的不同位置施加的力和超声功率的电线嵌入方法。

8. 发明申请

US20210192312A1 SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE 有权
公开(公告)号：US20210192312A1
公开(公告)日：2021-06-24
申请号：US17006798
申请日：2020-08-29
申请人： Mustafa Lotya , David Finn , Darren Molloy
发明人： Mustafa Lotya , David Finn , Darren Molloy
IPC分类号： G06K19/077 , H01Q1/22 , H01Q21/29 , H01Q7/00 , H05K1/16
摘要： Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

9. 发明授权

US10977542B2 Smart cards with metal layer(s) and methods of manufacture 有权
公开(公告)号：US10977542B2
公开(公告)日：2021-04-13
申请号：US16729530
申请日：2019-12-30
申请人： Mustafa Lotya , Darren Molloy , David Finn
发明人： Mustafa Lotya , Darren Molloy , David Finn
IPC分类号： G06K19/00 , G06K19/077 , G06K19/07
摘要： Metal layers of a smartcard may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Pre-laminated metal layers having an array of card sites, with each position having a defined area prepared for the later implanting of a transponder chip module characterized by different sized perforations and gaps around this defined area adjacent to the RFID slit(s), to facilitate the quick removal of the metal in creating a pocket to accept a transponder chip module.

10. 发明申请

US20210056375A1 SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE 有权
公开(公告)号：US20210056375A1
公开(公告)日：2021-02-25
申请号：US17006797
申请日：2020-08-29
申请人： Mustafa Lotya , David Finn , Darren Molloy
发明人： Mustafa Lotya , David Finn , Darren Molloy
IPC分类号： G06K19/077 , H01Q1/22 , H01Q21/29 , H01Q7/00 , H05K1/16
摘要： Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式