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    • 2. 发明申请
    • METHODS AND APPARATUS FOR TRANSFERRING A SUBSTRATE CARRIER WITHIN AN ELECTRONIC DEVICE MANUFACTURING FACILITY
    • 用于在电子设备制造设备中传输基板载体的方法和装置
    • US20070276529A1
    • 2007-11-29
    • US11838163
    • 2007-08-13
    • Todd BrillMichael TeferraAmitabh PuriDaniel JessopGlade WarnerDavid Duffin
    • Todd BrillMichael TeferraAmitabh PuriDaniel JessopGlade WarnerDavid Duffin
    • G06F19/00
    • H01L21/67276
    • In a first aspect, a first method is provided for electronic device manufacturing. The first method includes the steps of (1) receiving a request to transfer a carrier from a first substrate loading station to a second substrate loading station of an electronic device manufacturing facility including a plurality of substrate loading stations, wherein the facility further includes a plurality of carrier supports coupled to a conveyor system adapted to move the carrier within the facility; (2) assigning one of the plurality of carrier supports to transfer the carrier from the first substrate loading station to the second substrate loading station such that at least one of a time required for the transfer is reduced and balance of the conveyor system is maintained; (3) moving the carrier from the first substrate loading station; and (4) moving the carrier to the second substrate loading station. Numerous other aspects are provided.
    • 在第一方面,提供了一种用于电子设备制造的第一种方法。 第一种方法包括以下步骤:(1)接收将载体从第一基板装载站传送到包括多个基板装载站的电子装置制造设备的第二基板装载站的请求,其中该装置还包括多个 联接到适于在所述设施内移动所述承载件的输送机系统的托架支撑件; (2)分配所述多个载体支架中的一个以将所述载体从所述第一基板装载站传送到所述第二基板装载站,使得所述传送所需的时间中的至少一个被减少并且所述传送系统的平衡被维持; (3)从第一基板装载站移动载体; 和(4)将载体移动到第二基板装载站。 提供了许多其他方面。
    • 5. 发明申请
    • Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
    • 用于在电子设备制造设备内转移衬底载体的方法和设备
    • US20050245101A1
    • 2005-11-03
    • US11067460
    • 2005-02-25
    • Todd BrillMichael TeferraAmitabh PuriDaniel JessopGlade WarnerDavid Duffin
    • Todd BrillMichael TeferraAmitabh PuriDaniel JessopGlade WarnerDavid Duffin
    • B24B5/00H01L21/00H01L21/677
    • H01L21/67276
    • In a first aspect, a first method is provided for electronic device manufacturing. The first method includes the steps of (1) receiving a request to transfer a carrier from a first substrate loading station to a second substrate loading station of an electronic device manufacturing facility including a plurality of substrate loading stations, wherein the facility further includes a plurality of carrier supports coupled to a conveyor system adapted to move the carrier within the facility; (2) assigning one of the plurality of carrier supports to transfer the carrier from the first substrate loading station to the second substrate loading station such that at least one of a time required for the transfer is reduced and balance of the conveyor system is maintained; (3) moving the carrier from the first substrate loading station; and (4) moving the carrier to the second substrate loading station. Numerous other aspects are provided.
    • 在第一方面,提供了一种用于电子设备制造的第一种方法。 第一种方法包括以下步骤:(1)接收将载体从第一基板装载站传送到包括多个基板装载站的电子装置制造设备的第二基板装载站的请求,其中该装置还包括多个 联接到适于在所述设施内移动所述承载件的输送机系统的托架支撑件; (2)分配所述多个载体支架中的一个以将所述载体从所述第一基板装载站传送到所述第二基板装载站,使得所述传送所需的时间中的至少一个被减少并且传送系统的平衡被维持; (3)从第一基板装载站移动载体; 和(4)将载体移动到第二基板装载站。 提供了许多其他方面。