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    • 8. 发明授权
    • Selective etching and formation of xenon difluoride
    • 选择性蚀刻和形成氙二氟化物
    • US08278222B2
    • 2012-10-02
    • US12360588
    • 2009-01-27
    • Dingjun WuEugene Joseph Karwacki, Jr.Anupama MallikarjunanAndrew David Johnson
    • Dingjun WuEugene Joseph Karwacki, Jr.Anupama MallikarjunanAndrew David Johnson
    • H01L21/302H01L21/461
    • B08B7/0035C23C16/4405C23F4/00H01L21/32135H01L21/32136H01L21/67028
    • This invention relates to a process for selective removal of materials, such as: silicon, molybdenum, tungsten, titanium, zirconium, hafnium, vanadium, tantalum, niobium, boron, phosphorus, germanium, arsenic, and mixtures thereof, from silicon dioxide, silicon nitride, nickel, aluminum, TiNi alloy, photoresist, phosphosilicate glass, boron phosphosilicate glass, polyimides, gold, copper, platinum, chromium, aluminum oxide, silicon carbide and mixtures thereof. The process is related to the important applications in the cleaning or etching process for semiconductor deposition chambers and semiconductor tools, devices in a micro electro mechanical system (MEMS), and ion implantation systems. Methods of forming XeF2 by reacting Xe with a fluorine containing chemical are also provided, where the fluorine containing chemical is selected from the group consisting of F2, NF3, C2F6, CF4, C3F8, SF6, a plasma containing F atoms generated from an upstream plasma generator and mixtures thereof.
    • 本发明涉及从二氧化硅,硅,硅,钼,钨,钨,钛,锆,铪,钒,钽,铌,硼,磷,锗,砷及其混合物中选择性地去除材料的方法 氮化物,镍,铝,TiNi合金,光致抗蚀剂,磷硅酸盐玻璃,硼磷硅酸盐玻璃,聚酰亚胺,金,铜,铂,铬,氧化铝,碳化硅及其混合物。 该过程涉及用于半导体沉积室和半导体工具,微机电系统(MEMS)中的器件和离子注入系统的清洁或蚀刻工艺中的重要应用。 还提供了通过使Xe与含氟化合物反应形成XeF 2的方法,其中含氟化学物质选自由F2,NF3,C2F6,CF4,C3F8,SF6组成的组,含有从上游等离子体产生的F原子的等离子体 发电机及其混合物。