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1. 发明授权

US10902978B2 Diffusion barriers for metallic superconducting wires 有权
公开(公告)号：US10902978B2
公开(公告)日：2021-01-26
申请号：US16718542
申请日：2019-12-18
申请人： David B. Smathers , Paul Aimone
发明人： David B. Smathers , Paul Aimone
IPC分类号： H01B12/10 , H01L39/12 , H01L39/14 , H01B12/06 , H01L39/24
摘要： In various embodiments, superconducting wires incorporate diffusion barriers composed of Nb alloys or Nb—Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.

2. 发明授权

US10049793B2 Fabrication of reinforced superconducting wires 有权
公开(公告)号：US10049793B2
公开(公告)日：2018-08-14
申请号：US15205804
申请日：2016-07-08
申请人： Paul Aimone , Francois-Charles Dary , David B. Smathers
发明人： Paul Aimone , Francois-Charles Dary , David B. Smathers
IPC分类号： H01B12/00 , H01B12/10 , C22F1/18 , C22C27/02 , H01B13/00 , H01B1/02 , B21C3/04
摘要： In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.

3. 发明授权

US11495372B2 Diffusion barriers for metallic superconducting wires 有权
公开(公告)号：US11495372B2
公开(公告)日：2022-11-08
申请号：US17130399
申请日：2020-12-22
申请人： David B. Smathers , Paul Aimone
发明人： David B. Smathers , Paul Aimone
IPC分类号： H01B12/10 , H01L39/12 , H01L39/14 , H01B12/06 , H01L39/24
摘要： In various embodiments, superconducting wires incorporate diffusion barriers composed of Nb alloys or Nb—Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.

4. 发明授权

US11417445B2 Fabrication of reinforced superconducting wires 有权
公开(公告)号：US11417445B2
公开(公告)日：2022-08-16
申请号：US16861525
申请日：2020-04-29
申请人： Paul Aimone , Francois-Charles Dary , David B. Smathers
发明人： Paul Aimone , Francois-Charles Dary , David B. Smathers
IPC分类号： H01B12/00 , H01B12/10 , H01L39/14 , H01L39/24 , B21C3/04 , C22C27/02 , C22F1/18 , H01B1/02 , H01B13/00
摘要： In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.

5. 发明授权

US10546669B2 Diffusion barriers for metallic superconducting wires 有权
公开(公告)号：US10546669B2
公开(公告)日：2020-01-28
申请号：US16295725
申请日：2019-03-07
申请人： David B. Smathers , Paul Aimone
发明人： David B. Smathers , Paul Aimone
IPC分类号： H01B12/10 , H01L39/12 , H01L39/14 , H01B12/06 , H01L39/24
摘要： In various embodiments, superconducting wires incorporate diffusion barriers composed of Nb alloys or Nb—Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.

6. 发明授权

US11791066B2 Diffusion barriers for metallic superconducting wires 有权
公开(公告)号：US11791066B2
公开(公告)日：2023-10-17
申请号：US17954628
申请日：2022-09-28
申请人： David B. Smathers , Paul Aimone
发明人： David B. Smathers , Paul Aimone
IPC分类号： H01B12/10 , H01B12/06 , H10N60/20 , H10N60/85 , H10N60/01
CPC分类号： H01B12/10 , H01B12/06 , H10N60/20 , H10N60/85 , H10N60/0128 , H10N60/0156 , H10N60/0184 , Y02E40/60
摘要： In various embodiments, superconducting wires incorporate diffusion barriers composed of Nb alloys or Nb—Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.

7. 发明授权

US10679775B2 Fabrication of reinforced superconducting wires 有权
公开(公告)号：US10679775B2
公开(公告)日：2020-06-09
申请号：US16037279
申请日：2018-07-17
申请人： Paul Aimone , Francois-Charles Dary , David B. Smathers
发明人： Paul Aimone , Francois-Charles Dary , David B. Smathers
IPC分类号： H01B12/10 , C22C27/02 , B21C3/04 , H01L39/14 , H01L39/24 , C22F1/18 , H01B1/02 , H01B13/00
摘要： In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.

8. 发明授权

US09984795B2 Diffusion barriers for metallic superconducting wires 有权
公开(公告)号：US09984795B2
公开(公告)日：2018-05-29
申请号：US15696330
申请日：2017-09-06
申请人： David B. Smathers , Paul Aimone
发明人： David B. Smathers , Paul Aimone
IPC分类号： H01B12/00 , H01L39/14 , H01L39/24 , H01B12/10 , H01B12/06 , H01L39/12
CPC分类号： H01B12/10 , H01B12/06 , H01L39/12 , H01L39/14 , H01L39/2403 , H01L39/2406 , H01L39/2409
摘要： In various embodiments, superconducting wires incorporate diffusion barriers composed of Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.

9. 发明申请

US20110056828A1 MONOLITHIC ALUMINUM ALLOY TARGET AND METHOD OF MANUFACTURING 有权
标题翻译：单晶铝合金靶和制造方法
公开(公告)号：US20110056828A1
公开(公告)日：2011-03-10
申请号：US12736311
申请日：2010-01-06
申请人： Weifang Miao , David B. Smathers , Robert S. Bailey
发明人： Weifang Miao , David B. Smathers , Robert S. Bailey
IPC分类号： C23C14/34 , C22F1/04
CPC分类号： C23C14/3407 , B21C23/001 , B21J1/04 , B21J1/06 , C22C21/00 , C22F1/04 , C23C14/3414
摘要： Aluminum or aluminum alloy sputter targets and methods of making same are provided. The pure aluminum or aluminum alloy is mechanically worked to produce a circular blank, and then the blank is given a recrystallization anneal to achieve desirable grain size and crystallographic texture. A 10-50% additional strain is provided to the blank step after the annealing to increase the mechanical strength. Further, in a flange area of the target, the strain is greater than in the other target areas with the strain in the flange area being imparted at a rate of about 20-60% strain. The blank is then finished to form a sputtering target with desirable crystallographic texture and adequate mechanical strength.
摘要翻译：提供铝或铝合金溅射靶及其制造方法。对纯铝或铝合金进行机械加工以产生圆形坯料，然后将坯料进行再结晶退火，以获得所需的晶粒尺寸和晶体织构。在退火之后向坯料步骤提供10-50％的附加应变以增加机械强度。此外，在靶的凸缘区域中，应变大于在其他目标区域中的应变，其中凸缘区域中的应变以约20-60％应变的速率施加。然后将坯料完成以形成具有所需晶体学结构和足够的机械强度的溅射靶。

10. 发明授权

US07708868B2 Variable thickness plate for forming variable wall thickness physical vapor deposition target 失效
标题翻译：用于形成可变壁厚物理气相沉积靶的可变厚度板
公开(公告)号：US07708868B2
公开(公告)日：2010-05-04
申请号：US11443232
申请日：2006-05-30
申请人： David B. Smathers , Melvin K. Holcomb , Eric Land
发明人： David B. Smathers , Melvin K. Holcomb , Eric Land
IPC分类号： B23K20/00 , B21D22/16 , C23C14/32
CPC分类号： C23C14/3407 , H01J37/3423 , H01J37/3491
摘要： A variable thickness sputtering target which increases the target material thickness at strategic locations to greatly improve the yield of usable wafers per target, and a method of manufacturing such target comprising forming a generally flat and circularly shaped target blank so that a thickness dimension between the top and bottom surfaces decreases as a function of radius of the target blank. The variable thickness target blank is then formed into a variable thickness dome shaped target member having a bottom portion and a sidewall portion, wherein a wall thickness of said variable thickness dome-shaped target member is thickest proximate a center portion of said bottom portion. In one embodiment of the invention, the variable thickness target blank is formed by clock rolling (or compression rolling) the target blank with crowned rolls to obtain a variable thickness target blank.
摘要翻译：一种可变厚度溅射靶，其在战略位置增加目标材料厚度，以大大提高每个靶材的可用晶片的产量，以及制造这种靶材的方法，包括形成大致平坦且圆形的靶坯料，使得顶部之间的厚度尺寸并且底面随目标空白半径的函数而减小。然后将可变厚度目标坯料形成为具有底部和侧壁部分的可变厚度的圆顶形目标构件，其中所述可变厚度的圆顶形目标构件的壁厚在所述底部的中心部分附近最厚。在本发明的一个实施例中，可变厚度目标坯料通过用加盖辊轧制（或压缩）目标坯料来形成，以获得可变厚度目标坯料。

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