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1. 发明授权

US06931284B2 Implantable medical device with air core antenna assembly 有权
标题翻译：具有气芯天线组件的植入式医疗设备
公开(公告)号：US06931284B2
公开(公告)日：2005-08-16
申请号：US10280944
申请日：2002-10-25
申请人： David B. Engmark , John E. Nicholson , Brian S. Child , David M. Reinker
发明人： David B. Engmark , John E. Nicholson , Brian S. Child , David M. Reinker
IPC分类号： A61N1/372 , A61N1/375
CPC分类号： A61N1/375 , A61N1/372 , A61N1/37229 , A61N1/3758
摘要： An implantable medical device that includes an enclosure, an electrical module for the desired stimulation, sensing and communications functions, a power source, an air-core antenna, and supporting structures therefore. The antenna includes a quarter-elliptical shape that maximizes the antenna area to facilitate transmission of electromagnetic waves through the enclosure. A support structure is provided so that the antenna, the module and the battery self-align with each other and the enclosure. The support structure contains contacts to facilitate electrical connection of the antenna to the module and positions the module so that contacts thereon are in close proximity in plan and elevation to external electrical feed-throughs in the housing and the antenna contacts on the support structure. The support structure positions the antenna between the module and the housing, separated therefrom by a predetermined minimum distance to facilitate efficient coupling of electromagnetic waves to and/or from the antenna.
摘要翻译：因此，包括外壳，用于期望的刺激的电气模块，感测和通信功能，电源，空芯天线和支撑结构的可植入医疗装置。该天线包括四分之一椭圆形形状，其使天线面积最大化以促进电磁波通过外壳的传输。提供了支撑结构，使得天线，模块和电池彼此对准和外壳。支撑结构包括触点，以便于天线与模块的电连接并且定位模块，使得其上的触点在平面图和高度上与壳体中的外部电馈通和支撑结构上的天线接触紧密接近。支撑结构将天线定位在模块和壳体之间，与之隔开预定的最小距离，以便有效地将电磁波耦合到天线和/或从天线耦合。

2. 发明授权

US5745631A Self-aligning optical beam system 失效
标题翻译：自对准光束系统
公开(公告)号：US5745631A
公开(公告)日：1998-04-28
申请号：US592691
申请日：1996-01-26
申请人： David M. Reinker
发明人： David M. Reinker
IPC分类号： G02B6/42 , G02B6/43 , G02B6/10
CPC分类号： G02B6/42 , G02B6/4228 , G02B6/4231 , G02B6/43 , G02B6/4232
摘要： A self-aligning optical beam system is disclosed in which optical alignment of two beam-carrying portions, such as a laser beam generated by a chip, and a light guide formed as a waveguide in a polymeric material, is precisely controlled by plug-and-socket connection between a substrate and a chip. Plugs in the form of solder bumps are formed on one surface of a laser chip, and are inserted in sockets provided in a substrate. The optical alignment is precisely controlled in three axes, two of which guarantee alignment for laser beam transmission into a waveguide, and one of which minimizes the gap across which the beam travels. A powerful waveguide division multiplexer may be provided by having numerous converging waveguides on a single substrate, and by stacking a number of substrates, all of whose waveguides feed into a single optical output channel.
摘要翻译：公开了一种自对准光束系统，其中两个光束承载部分（例如由芯片产生的激光束）和在聚合物材料中形成为波导的光导的光学对准被精确地由插头和 - 衬底和芯片之间的环形连接。在激光芯片的一个表面上形成焊料凸块形式的插头，并插入到设置在基板中的插座中。光学对准精确地控制在三个轴上，其中两个保证激光束传输到波导中的对准，并且其中一个使得光束行进的间隙最小化。可以通过在单个衬底上具有多个会聚波导，并且通过堆叠多个衬底，将所有波导馈送到单个光输出通道中来提供强大的波导分路复用器。

3. 发明授权

US5406701A Fabrication of dense parallel solder bump connections 失效
标题翻译：密集平行焊料凸点连接的制造
公开(公告)号：US5406701A
公开(公告)日：1995-04-18
申请号：US120675
申请日：1993-09-13
申请人： Angel A. Pepe , David M. Reinker , Joseph A. Minahan
发明人： Angel A. Pepe , David M. Reinker , Joseph A. Minahan
IPC分类号： H05K3/36 , H01L21/60 , H01L21/98 , H05K3/34
CPC分类号： H01L24/16 , H01L24/75 , H01L24/81 , H01L25/50 , H01L2224/131 , H01L2224/13109 , H01L2224/16237 , H01L2224/75 , H01L2224/81141 , H01L2224/81191 , H01L2224/81801 , H01L27/14634 , H01L27/1465 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , Y10T29/49144 , Y10T29/49149
摘要： A method and product are disclosed in which multiple solder bumps on a first planar surface are guided into engagement with terminals on a second planar surface by means of holes formed (by a photolithographic process) in a dielectric layer, which has been added to the second surface to provide the holes (or sockets) through which the solder bumps (or plugs) extend. The perforated (hole-providing) layer may be formed of one of several materials. The preferred perforated layer material is a photo-definable polyimide, which is hardened by heating after the holes have been formed. Small solder bumps may be formed inside the holes on the second surface, in order to facilitate bonding between the solder bumps on the first surface and the terminals on the second surface.
摘要翻译：公开了一种方法和产品，其中在第一平面表面上的多个焊料凸块通过在电介质层中形成（通过光刻工艺）的孔被引导到与第二平面表面上的端子接合，该介质层已被添加到第二平面以提供焊料凸块（或插头）延伸通过的孔（或插座）。穿孔（空穴提供）层可以由几种材料之一形成。优选的穿孔层材料是可光限定的聚酰亚胺，其在形成孔之后通过加热而硬化。可以在第二表面上的孔内部形成小的焊料凸起，以便于在第一表面上的焊料凸点与第二表面上的端子之间的接合。

4. 发明授权

US5635010A Dry adhesive joining of layers of electronic devices 失效
标题翻译：电子器件层的干胶粘合
公开(公告)号：US5635010A
公开(公告)日：1997-06-03
申请号：US421848
申请日：1995-04-14
申请人： Angel A. Pepe , David M. Reinker , Paul Wojtuszewski
发明人： Angel A. Pepe , David M. Reinker , Paul Wojtuszewski
IPC分类号： B32B7/12 , H05K3/36 , H05K3/46
CPC分类号： B32B7/12 , B32B37/12 , B32B2457/08 , Y10T156/1075 , Y10T156/1092 , Y10T29/49126
摘要： There is disclosed an efficient, cost effective production method to bond layers of electronic devices into an integral stack, or for joining electronic devices to other devices or substrates with use of an adhesive material, preferably an appropriate polyimide, to provide, in effect, a two-stage bonding process. In the first stage, the electronic device is coated, preferably at the wafer level, with a liquid solution of the adhesive material, the coated device is heated to remove solvent, forming a dry adhesive coating of sufficient thickness to fill all spaces between metal traces on the electronic device. Coated wafers can be stacked and bonded, or preferably diced to yield individual chips, which are cut and stacked in a suitable fixture, and heat and pressure are applied in a second stage, to cause viscous flow of the adhesive, filling all voids, and to cure the adhesive, creating an integral, adhesively bonded stack. The adhesive selected for use in the process is one which can be dried to a solvent free layer, which has good B stage properties, exhibits viscous flow at temperatures below its curing temperature, and which is substantially free of volatile release during curing to form a substantially void-free adhesive bond having high film strength, high adhesion, chemical resistance and good dielectric properties.
摘要翻译：公开了一种有效的，成本有效的制造方法，用于将电子器件的层结合成整体堆叠，或者使用粘合剂材料（优选适合的聚酰亚胺）将电子器件连接到其它器件或衬底，实际上提供了一种两阶段接合工艺。在第一阶段中，电子器件优选地在晶片级上用粘合剂材料的液体溶液涂覆，涂覆的器件被加热以除去溶剂，形成足够厚度的干燥粘合剂涂层以填充金属迹线之间的所有空间在电子设备上。涂覆的晶片可以堆叠和粘合，或优选切割以产生单个切屑，其切割并堆叠在合适的夹具中，并且在第二阶段中施加热和压力，以引起粘合剂的粘性流动，填充所有空隙，以及固化粘合剂，形成整体的，粘合的叠层。选择用于该方法的粘合剂是可以干燥成无溶剂层的粘合剂，其具有良好的B阶级性能，在低于其固化温度的温度下显示粘性流动，并且其在固化期间基本上不含挥发性的释放以形成具有高膜强度，高粘合性，耐化学性和良好介电性能的基本上无空隙的粘合剂粘结。

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