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    • 3. 发明授权
    • Socket for a tape carrier package
    • 插座用于磁带载体封装
    • US5647750A
    • 1997-07-15
    • US565350
    • 1995-11-30
    • Mai Loan Thi TranEdward John BrightAttalee Snarr Taylor
    • Mai Loan Thi TranEdward John BrightAttalee Snarr Taylor
    • G01R31/26G01R1/04H01L23/32H01R33/76H05K1/18H05K7/10H01R9/09
    • H05K7/1023G01R1/0408
    • A socket is disclosed for a tape carrier package (10) having a plurality of leads (6) extending across an aperture (8) in a tape carrier (2). The socket includes a cover (14) having a tape mounting surface (44) and a plurality of ribs (30) protruding from the tape mounting surface. The ribs are arranged to extend through the aperture (8) and to straddle the leads (6) when the tape carrier package (10) is disposed on the tape mounting surface (44). The cover (14) is matable with a housing (12) holding a plurality of contacts (20). The ribs (30) straddle and guide the leads (6) into engagement with respective contacts (20) as the cover is mated with the housing. A socket for a tape carrier package (110) is also disclosed. The socket includes a cover (114) having a tape mounting surface including an undersurface (144) and an inclined surface (148). A plurality of ribs (130) which protrude from the inclined surface (148) are arranged to straddle leads (106) of the tape carrier package (110) and to guide the leads into engagement with respective contacts (120) in a housing (112). A ring member (150) mounts to the cover (114) and is securable by latches to hold the tape carrier package on the cover.
    • 公开了一种用于带状载体封装(10)的插座,其具有穿过带状架(2)中的孔(8)延伸的多个引线(6)。 插座包括具有带安装表面(44)的盖(14)和从带安装表面突出的多个肋(30)。 当带状载体包装(10)设置在带安装表面(44)上时,肋布置成延伸穿过孔(8)并跨越引线(6)。 盖(14)可与容纳多个触点(20)的壳体(12)配合。 当盖与壳体配合时,肋(30)跨过并引导引线(6)与相应的触头(20)接合。 还公开了一种用于载带封装(110)的插座。 插座包括具有包括下表面(144)和倾斜表面(148)的带安装表面的盖(114)。 从倾斜表面(148)突出的多个肋(130)被布置成跨过带载包装(110)的引线(106)并且引导引线与壳体(112)中的相应触点(120)接合 )。 环构件(150)安装到盖(114)并且可通过闩锁固定以将带载体封装保持在盖上。
    • 4. 发明申请
    • CONNECTOR ASSEMBLY HAVING A FLOATING MATING ARRAY
    • 连接器总成具有浮动电源阵列
    • US20110250773A1
    • 2011-10-13
    • US12757835
    • 2010-04-09
    • Richard Elof HamnerRobert Neil MulfingerJason M'Cheyne ReisingerAttalee Snarr Taylor
    • Richard Elof HamnerRobert Neil MulfingerJason M'Cheyne ReisingerAttalee Snarr Taylor
    • H01R13/64
    • H01R13/6315H01R12/724
    • A connector assembly includes a housing, a mating array, and a self-alignment subassembly. The housing is joined to a first circuit board and includes a header portion that moves in a mating direction toward a second circuit board. The mating array is joined to the header portion and includes a terminal. The mating array is moveable in the mating direction to couple the terminal with a mating terminal of the second circuit board. The self-alignment subassembly is disposed between the header portion and the mating array. The self-alignment subassembly applies a floating force on the mating array that permits alignment of the terminal of the mating array with the mating terminal while the mating array is moved in directions oriented approximately perpendicular to the mating direction. The self-alignment subassembly also applies a loading force on the mating array in the mating direction that couples the terminal of the mating array with the mating terminal.
    • 连接器组件包括壳体,配合阵列和自对准子组件。 壳体接合到第一电路板并且包括沿配合方向朝向第二电路板移动的集管部分。 配合阵列连接到头部并且包括终端。 配合阵列可以在配合方向上移动以将终端与第二电路板的匹配端子耦合。 自对准子组件设置在头部部分和配合阵列之间。 自对准子组件在配合阵列上施加浮动力,允许配合阵列的端子与配合端子对准,同时配合阵列在大致垂直于配合方向定向的方向上移动。 自对准子组件还在配合方向上将匹配阵列上的加载力施加到将配合阵列的端子与配合端子耦合的配合方向上。
    • 7. 发明授权
    • Apparatus for applying solder rings to terminal posts
    • 用于将焊锡环施加到端子柱的装置
    • US3978569A
    • 1976-09-07
    • US587750
    • 1975-06-17
    • Robert Franklin CobaughJames Ray CollerAttalee Snarr Taylor
    • Robert Franklin CobaughJames Ray CollerAttalee Snarr Taylor
    • B23K3/06B23K1/20
    • B23K3/06Y10T29/49915Y10T29/53235Y10T29/53361
    • An apparatus consisting of a pair of rollers with tangentially meeting perimeters for crimping successive portions of a continuous strip of solder into rings around a strip of terminal posts carried in parallel manner upon a common carrier strip. The roller perimeters each contain a circumferential track of crimping ridges which are both axially and angularly positioned to coincide with corresponding ridges on the other roller to crimp said solder strip around each post on the strip of terminal posts, both strips being simultaneously passed between the crimping tracks on said rollers. Each roller also comprises a circumferential track of spur-type gear teeth, the two tracks being axially offset on opposite sides of said crimping tracks and having bottom lands (the troughs of the teeth) which coincide when the teeth pass through the common tangential or pitch plane of the rollers.
    • 一种由一对切向会合的辊组成的装置,用于将连续的焊料条的连续部分压接成围绕在公共载体条上并行运送的端子柱的环的环。 滚筒周边各自包含压接脊的周向轨道,其两个轴向和角度地定位成与另一个辊上的对应脊重合,以将端子柱上的每个柱的每个柱压接所述焊料条,两条条同时在压接 所述滚筒上的轨迹。 每个滚子还包括一个正齿轮齿轮的圆周轨道,两个轨道在所述压接轨道的相对侧上轴向偏移,并且具有当齿通过公共切向或间距时的重合的底部平台(齿槽) 辊的平面。
    • 10. 发明授权
    • Land grid array interconnect
    • 土地格栅阵列互连
    • US08382487B2
    • 2013-02-26
    • US12973071
    • 2010-12-20
    • Myoungsoo JeonAttalee Snarr TaylorCraig Warren Hornung
    • Myoungsoo JeonAttalee Snarr TaylorCraig Warren Hornung
    • H01R12/00
    • H01R12/52H01R12/57
    • A land grid array interconnect has a substrate that has a first surface and a second surface. The substrate has a plurality of vias extending therethrough. The substrate has first pads on the first surface electrically connected to corresponding vias and has second pads on the second surface electrically connected to corresponding vias and corresponding first pads. A contact array is coupled to the first surface of the substrate. The contact array has a metal plate that defines a carrier and a plurality of contacts formed from the metal plate and held by the carrier. The contacts have contact heels and beams extending from corresponding contact heels. The contact heels are soldered to corresponding first pads. The contacts are singulated from the carrier after the contact heels are soldered to the first pads. The carrier is removed from the substrate after the contacts are singulated leaving the individual contacts soldered to corresponding first pads.
    • 地面阵列互连具有具有第一表面和第二表面的基底。 衬底具有穿过其中延伸的多个通孔。 衬底在第一表面上具有电连接到对应的通孔的第一焊盘,并且在第二表面上具有电连接到对应的通孔和对应的第一焊盘的第二焊盘。 接触阵列耦合到衬底的第一表面。 接触阵列具有限定载体的金属板和由金属板形成并由载体保持的多个触点。 触点具有从相应的接触脚跟延伸的接触脚跟和梁。 接触脚跟被焊接到相应的第一垫。 在将接触脚跟焊接到第一衬垫之后,将触头从载体上分离出来。 在将触点分开之后,将载体从基板上移除,使各个触点焊接到相应的第一焊盘。