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1. 发明授权

US07703991B2 Flip-chip mountable optical connector for chip-to-chip optical interconnectability 失效
标题翻译：用于芯片到芯片光学互连的倒装芯片安装光学连接器
公开(公告)号：US07703991B2
公开(公告)日：2010-04-27
申请号：US11124033
申请日：2005-05-06
申请人： Daoqiang Lu , Gilroy J. Vandentop , Henning Braunisch
发明人： Daoqiang Lu , Gilroy J. Vandentop , Henning Braunisch
IPC分类号： G02B6/36
CPC分类号： G02B6/4232 , G02B6/4214 , G02B6/4292 , G02B6/43 , H01L2224/16225 , H05K1/0274 , H05K3/3436
摘要： An optical connector comprises a housing having a cavity extending there through to accept a mating connector. The connector comprises no optical components. Dummy solder bonding pads positioned on the connector allow the connector to be automated flip-chip bonded over a substrate waveguide.
摘要翻译：光学连接器包括壳体，该壳体具有在其上延伸以容纳匹配连接器的空腔。连接器不包括光学部件。定位在连接器上的虚拟焊接焊盘允许连接器在衬底波导上自动倒装芯片结合。

2. 发明授权

US06792179B2 Optical thumbtack 失效
标题翻译：光学图钉
公开(公告)号：US06792179B2
公开(公告)日：2004-09-14
申请号：US10334749
申请日：2002-12-31
申请人： Daoqiang Lu , Gilroy J. Vandentop , Steven N. Towle , Henning Braunisch
发明人： Daoqiang Lu , Gilroy J. Vandentop , Steven N. Towle , Henning Braunisch
IPC分类号： G02B632
CPC分类号： G02B6/43 , H05K1/0274 , H05K1/181
摘要： An optical or optoelectroronic component is mounted to a substrate, and an optical thumbtack is inserted into a through-hole of the substrate. The optical thumbtack is positioned to receive light from or send light to the optical or optoelectronic component and provide a conditioned, for example collimated or focused, beam. The optical thumbtack comprises a lens portion, a spacer portion, and a foot portion. Light may enter the thumbtack from either direction.
摘要翻译：将光学或光电元件安装到基板上，并将光学图钉插入基板的通孔中。光学图钉被定位成从光学或光电子部件接收光或发光，并提供经调理的例如准直或聚焦的光束。光学图钉包括透镜部分，间隔部分和脚部分。光可以从任一方向进入图钉。

3. 发明授权

US07507604B2 Breakable interconnects and structures formed thereby 有权
标题翻译：可破坏的互连和由此形成的结构
公开(公告)号：US07507604B2
公开(公告)日：2009-03-24
申请号：US12044239
申请日：2008-03-07
申请人： Daoqiang Lu , Henning Braunisch
发明人： Daoqiang Lu , Henning Braunisch
IPC分类号： H01L21/50 , H01L21/48 , H01L23/52 , H01L23/48
CPC分类号： H01L23/49827 , H01L21/485 , H01L23/5382 , H01L24/28 , H01L24/83 , H01L2224/2919 , H01L2224/838 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H05K3/323 , H05K3/365 , H05K2201/0221 , H05K2201/0233 , H05K2201/0314 , H01L2924/00
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.
摘要翻译：描述形成微电子结构的方法。这些方法的实施例包括将包括至少一个顺应性导电球的各向异性导电层放置在设置在第一衬底上的至少一个互连结构上，施加压力以使柔性导电球接触至少一个互连结构，各向异性导电层以暴露柔性导电球体中的至少一个; 然后将第二基板附着到各向异性导电层。

4. 发明申请

US20060251360A1 Flip-chip mountable optical connector for chip-to-chip optical interconnectability 失效
标题翻译：用于芯片到芯片光学互连的倒装芯片安装光学连接器
公开(公告)号：US20060251360A1
公开(公告)日：2006-11-09
申请号：US11124033
申请日：2005-05-06
申请人： Daoqiang Lu , Gilroy Vandentop , Henning Braunisch
发明人： Daoqiang Lu , Gilroy Vandentop , Henning Braunisch
IPC分类号： G02B6/36
CPC分类号： G02B6/4232 , G02B6/4214 , G02B6/4292 , G02B6/43 , H01L2224/16225 , H05K1/0274 , H05K3/3436
摘要： An optical connector comprises a housing having a cavity extending there through to accept a mating connector. The connector comprises no optical components. Dummy solder bonding pads positioned on the connector allow the connector to be automated flip-chip bonded over a substrate waveguide.
摘要翻译：光学连接器包括壳体，该壳体具有在其上延伸以容纳匹配连接器的空腔。连接器不包括光学部件。定位在连接器上的虚拟焊接焊盘允许连接器在衬底波导上自动倒装芯片结合。

5. 发明授权

US07720337B2 Wafer based optical interconnect 有权
标题翻译：基于晶圆的光互连
公开(公告)号：US07720337B2
公开(公告)日：2010-05-18
申请号：US12004541
申请日：2007-12-20
申请人： Daoqiang Lu , Henning Braunisch
发明人： Daoqiang Lu , Henning Braunisch
IPC分类号： G02B6/36
CPC分类号： G02B6/4231
摘要： In general, in one aspect, a method includes forming conductive layers on a wafer. A through cavity is formed in alignment with the conductive layers. The through cavity is to permit an optical signal from an optical waveguide within an optical connector to pass therethrough. Alignment holes are formed on each side of the through cavity to receive alignment pins. The wafer having the conductive layers, the through cavity in alignment with the conductive layers, and the alignment holes on each side of the through cavity forms an optical-electrical (O/E) interface. An O/E converter is mounted to the metal layers in alignment with the through cavity. The alignment pins and the alignment holes are used to passively align the optical waveguide and the O/E converter.
摘要翻译：通常，一方面，一种方法包括在晶片上形成导电层。形成与导电层对准的通孔。通孔是允许光连接器内的光波导的光信号通过。对准孔形成在通孔的每一侧以接收对准销。具有导电层的晶片，与导电层对准的通孔和通孔的每一侧上的对准孔形成光电（O / E）界面。 O / E转换器安装到与通孔对准的金属层上。对准引脚和对准孔用于被动对准光波导和O / E转换器。

6. 发明申请

US20080153207A1 BREAKABLE INTERCONNECTS AND STRUCTURES FORMED THEREBY 有权
标题翻译：断开的互连和结构形成
公开(公告)号：US20080153207A1
公开(公告)日：2008-06-26
申请号：US12044239
申请日：2008-03-07
申请人： Daoqiang Lu , Henning Braunisch
发明人： Daoqiang Lu , Henning Braunisch
IPC分类号： H01L21/00
CPC分类号： H01L23/49827 , H01L21/485 , H01L23/5382 , H01L24/28 , H01L24/83 , H01L2224/2919 , H01L2224/838 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H05K3/323 , H05K3/365 , H05K2201/0221 , H05K2201/0233 , H05K2201/0314 , H01L2924/00
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.
摘要翻译：描述形成微电子结构的方法。这些方法的实施例包括将包括至少一个顺应性导电球的各向异性导电层放置在设置在第一衬底上的至少一个互连结构上，施加压力以使柔性导电球接触至少一个互连结构，各向异性导电层以暴露柔性导电球体中的至少一个; 然后将第二基板附着到各向异性导电层。

7. 发明授权

US07344318B2 Optical interconnect with passive optical alignment 有权
标题翻译：具有无源光学对准的光学互连
公开(公告)号：US07344318B2
公开(公告)日：2008-03-18
申请号：US11386149
申请日：2006-03-22
申请人： Daoqiang Lu , Henning Braunisch , Bram Leader , Mark B. Trobough
发明人： Daoqiang Lu , Henning Braunisch , Bram Leader , Mark B. Trobough
IPC分类号： G02B6/30 , G02B6/26
CPC分类号： G02B6/4292 , G02B6/3885 , G02B6/423 , H01L2224/16225
摘要： A coupler is passively aligned over a substrate, wherein the coupler is laterally aligned to an optoelectronic (OE) device coupled to the substrate. The coupler is placed on the substrate, wherein the coupler is vertically aligned to the OE device. The coupler is fixed to the substrate.
摘要翻译：耦合器在衬底上被动对准，其中耦合器横向对准耦合到衬底的光电子（OE）器件。耦合器被放置在基板上，其中耦合器垂直对准OE设备。耦合器固定在基板上。

8. 发明申请

US20070126118A1 Mounting flexible circuits onto integrated circuit substrates 有权
标题翻译：将柔性电路安装到集成电路基板上
公开(公告)号：US20070126118A1
公开(公告)日：2007-06-07
申请号：US11292893
申请日：2005-12-02
申请人： Daoqiang Lu , Henning Braunisch
发明人： Daoqiang Lu , Henning Braunisch
IPC分类号： H01L23/12 , H01L21/48
CPC分类号： H05K3/301 , H01L23/49833 , H01L23/4985 , H01L24/16 , H01L24/73 , H01L2224/13 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/01079 , H01L2924/14 , H01L2924/15192 , H05K3/341 , H05K3/361 , H05K3/365 , H05K2201/10393 , H05K2203/048 , H01L2924/014
摘要： A substrate may receive an integrated circuit and a flex circuit on the same side in the same vertical direction. In addition, in some embodiments, a flex circuit adapter and the integrated circuit may be surface mounted in one operation.
摘要翻译：衬底可以在同一垂直方向上的同一侧上接收集成电路和柔性电路。此外，在一些实施例中，柔性电路适配器和集成电路可以在一个操作中被表面安装。

9. 发明申请

US20060067609A1 Optical package 失效
标题翻译：光学包装
公开(公告)号：US20060067609A1
公开(公告)日：2006-03-30
申请号：US10954903
申请日：2004-09-30
申请人： Daoqiang Lu , Henning Braunisch , Gilroy Vandentop
发明人： Daoqiang Lu , Henning Braunisch , Gilroy Vandentop
IPC分类号： G02B6/26 , G02B6/12 , G02B6/42
CPC分类号： G02B6/1228 , G02B6/24 , G02B2006/12147
摘要： Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first waveguide and a second end, a first thickness of a cladding material disposed between the second end and the surface, and a second thickness of a cladding material disposed between the first end and the first waveguide. The first thickness may be greater than the second thickness. Methods of making the optical packages are also disclosed. Apparatus and methods of aligning operations on optical packages are also disclosed.
摘要翻译：公开了光学封装。在一个方面，光学封装可以包括表面，与表面耦合的微电子器件，与微电子器件耦合的第一波导，具有与第一波导ev逝地耦合的第一端和第二端的第二波导，设置在第二端和表面之间的包层材料的第一厚度，以及设置在第一端和第一波导之间的包层材料的第二厚度。第一厚度可以大于第二厚度。还公开了制造光学封装件的方法。还公开了在光学封装上对准操作的装置和方法。

10. 发明授权

US08230589B2 Method of mounting an optical device 有权
标题翻译：安装光学装置的方法
公开(公告)号：US08230589B2
公开(公告)日：2012-07-31
申请号：US12054777
申请日：2008-03-25
申请人： Daoqiang Lu , Johanna Swan , Henning Braunisch
发明人： Daoqiang Lu , Johanna Swan , Henning Braunisch
IPC分类号： H05K3/34
CPC分类号： H01S5/0261 , H01L24/13 , H01L24/16 , H01L25/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/01019 , H01L2924/01078 , H01L2924/10253 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , H01L2924/00012 , H01L2924/00
摘要： A method for aligning at least two photonic components over an interposer, and an optical package that may align such components. The method may include providing an interposer; fabricating electrical conductors passing from one surface of the interposer to an opposite surface of the interposer at selected contact positions; soldering the photonic components over the selected contact positions on the first surface, while allowing solder self-alignment. Other embodiments are described and claimed.
摘要翻译：一种用于使插入器上的至少两个光子分量对准的方法，以及可以对准这些部件的光学封装。该方法可以包括提供插入器; 制造从所述插入件的一个表面到选定的接触位置处的所述插入件的相对表面的电导体; 将光子组件焊接在第一表面上所选择的接触位置上，同时允许焊料自对准。描述和要求保护其他实施例。

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