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    • 5. 发明授权
    • Surface micromachining process for manufacturing electro-acoustic transducers, particularly ultrasonic transducers, obtained transducers and intermediate products
    • 用于制造电声换能器,特别是超声换能器,获得的换能器和中间产品的表面微加工工艺
    • US07074634B2
    • 2006-07-11
    • US10476254
    • 2002-05-09
    • Vittorio FogliettiElena CianciDaniele MemmiGiosué CalianoMassimo Pappalardo
    • Vittorio FogliettiElena CianciDaniele MemmiGiosué CalianoMassimo Pappalardo
    • H01L21/00
    • H04R19/00
    • A surface micromachining process for manufacturing Electro-acoustic transducers, particularly ultrasonic transducers, the transducers comprising a silicon semiconductor substrate (1), on an upper surface of which one or more membranes (18) of resilient materials are supported by a structural layer (11) of insulating material, rigidly connected to the semiconductor substrate (1), the resilient material having a Young's modulus not lower than 50 GPa, the membranes (18) being metallised, the transducers including one or more lower electrodes (23, 25), rigidly connected to the semiconductor substrate. The process is characterised in that the structural layer (11) includes silicon monoxide. The invention further relates to an Electro-acoustic transducer, particularly an ultrasonic transducer, characterised in that the insulating material of the structural layer (11) is silicon monoxide. The invention also relates to an intermediate product for utilisation in the process for realising Electro-acoustic transducers, particularly ultrasonic transducers.
    • 一种用于制造电声换能器,特别是超声换能器的表面微加工方法,包括硅半导体衬底(1)的换能器在其上表面上,一个或多个弹性材料膜(18)由结构层(11 )绝缘材料,刚性地连接到所述半导体衬底(1),所述弹性材料具有不低于50GPa的杨氏模量,所述膜(18)被金属化,所述换能器包括一个或多个下电极(23,25), 刚性地连接到半导体衬底。 该方法的特征在于结构层(11)包括一氧化硅。 本发明还涉及一种电声换能器,特别是超音波换能器,其特征在于结构层(11)的绝缘材料是一氧化硅。 本发明还涉及用于实现电声换能器,特别是超声换能器的过程中的中间产品。