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1. 发明申请

US20130190742A1 SYSTEM AND METHOD FOR MODIFICATION AND/OR SMOOTHING OF TISSUE WITH LASER ABLATION 审中-公开
标题翻译：用于激光消融的组织修饰和/或吸收的系统和方法
公开(公告)号：US20130190742A1
公开(公告)日：2013-07-25
申请号：US13640588
申请日：2011-04-12
申请人： Daniel Patrick Connors , Jerome Felsenstein , Robert E. Trzcinski , James J. Wynne , Donna S. Zupanski-Nielsen
发明人： Daniel Patrick Connors , Jerome Felsenstein , Robert E. Trzcinski , James J. Wynne , Donna S. Zupanski-Nielsen
IPC分类号： A61B18/20
CPC分类号： A61B18/20 , A61B2018/207
摘要： Disclosed is an improved system and method for efficiently removing tissue using laser ablation. A first laser emits a first laser beam with a variable first integrated fluence sufficient to ablate tissue. The first laser beam is movably positioned over one or more surfaces of the tissue and the first integrated fluence varies over different levels with position, so different thicknesses of tissue are ablated at different surface positions in order to modify the contour of the surface of the tissue. Modifications include tissue smoothing, removing, feathering, sharpening, and roughening. In one preferred embodiment the tissue is eschar that is removed, unveiling viable tissue. In alternate preferred embodiments, one or more additional lasers beams with different wavelengths, with integrated fluence sufficient to ablate tissue, are moved over the surface of the tissue until a second ablation reaches a second self-termination point, e.g., determined by affects of chemicals below the termination point that absorb the second laser beam without producing the temperature increase necessary for ablation to continue.
摘要翻译：公开了一种使用激光烧蚀有效去除组织的改进的系统和方法。第一激光器发射具有足以消融组织的可变的第一积分能量密度的第一激光束。第一激光束可移动地定位在组织的一个或多个表面上，并且第一集成能量密度在具有位置的不同水平上变化，因此不同厚度的组织在不同的表面位置被消融，以便修改组织表面的轮廓。修改包括组织平滑，去除，羽化，磨锐和粗糙化。在一个优选实施方案中，组织是被除去的焦痂，揭开活组织。在替代优选实施例中，具有足以消融组织的积分能量密度的具有不同波长的一个或多个附加激光束在组织的表面上移动，直到第二消融达到第二自终止点，例如由化学物质的影响确定低于吸收第二激光束的终止点，而不产生消融所需的温度升高。

2. 发明申请

US20080203585A1 INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS 有权
公开(公告)号：US20080203585A1
公开(公告)日：2008-08-28
申请号：US12113108
申请日：2008-04-30
申请人： Keith E. Fogel , Balaram Ghosal , Sung K. Kang , Stephen Kilpatrick , Paul A. Lauro , Henry A. Nye , Da-Yuan Shih , Donna S. Zupanski-Nielsen
发明人： Keith E. Fogel , Balaram Ghosal , Sung K. Kang , Stephen Kilpatrick , Paul A. Lauro , Henry A. Nye , Da-Yuan Shih , Donna S. Zupanski-Nielsen
IPC分类号： H01L23/52
CPC分类号： H01L24/05 , H01L24/03 , H01L24/11 , H01L24/12 , H01L2224/03912 , H01L2224/0401 , H01L2224/05 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/13023 , H01L2224/13099 , H01L2224/131 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/30107 , H01L2924/00014
摘要： An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.

3. 发明申请

US20080038913A1 METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED 审中-公开
标题翻译：形成无铝线焊盘和垫片的方法
公开(公告)号：US20080038913A1
公开(公告)日：2008-02-14
申请号：US11463642
申请日：2006-08-10
申请人： Mukta G. Farooq , Robert Hannon , Ian D. Melville , Kevin S. Petrarca , Donna S. Zupanski-Nielsen
发明人： Mukta G. Farooq , Robert Hannon , Ian D. Melville , Kevin S. Petrarca , Donna S. Zupanski-Nielsen
IPC分类号： H01L21/44
CPC分类号： H01L24/02 , H01L24/45 , H01L2224/04042 , H01L2224/45144 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2224/48
摘要： Methods of forming an aluminum-free wire bond pad and the pad so formed are disclosed. In one embodiment, the method includes forming an opening through a dielectric layer to a last metal of a chip; forming a tantalum nitride (TaN) layer over the chip and over the opening; removing the tantalum nitride (TaN) layer outside of the opening; forming a passivation mask layer over the chip including a passivation mask opening over the last metal; forming a titanium tungsten (TiW) layer and a copper (Cu) layer over the chip; forming a mask layer over the chip including a mask opening to the copper (Cu) layer over the last metal; forming a nickel (Ni) layer and a copper (Cu) layer and then a gold (Au) layer in the mask opening; and removing the mask.
摘要翻译：公开了形成无铝线接合焊盘和如此形成的焊盘的方法。在一个实施例中，该方法包括通过电介质层形成开口至芯片的最后一个金属; 在芯片上并在开口上形成氮化钽（TaN）层; 去除开口外面的氮化钽（TaN）层; 在所述芯片上形成钝化掩模层，其包括在最后一个金属上的钝化掩模开口; 在芯片上形成钛钨（TiW）层和铜（Cu）层; 在所述芯片上形成掩模层，所述掩模层包括在最后金属上的铜（Cu）层的掩模开口; 在掩模开口中形成镍（Ni）层和铜（Cu）层，然后形成金（Au）层; 并取下面罩。

4. 发明申请

US20070166992A1 METHOD FOR FABRICATING LAST LEVEL COPPER-TO-C4 CONNECTION WITH INTERFACIAL CAP STRUCTURE 有权
标题翻译：用于制作最终级铜对C4连接的方法
公开(公告)号：US20070166992A1
公开(公告)日：2007-07-19
申请号：US11306983
申请日：2006-01-18
申请人： Timothy H. Daubenspeck , William F. Landers , Donna S. Zupanski-Nielsen
发明人： Timothy H. Daubenspeck , William F. Landers , Donna S. Zupanski-Nielsen
IPC分类号： H01L21/44
CPC分类号： H01L21/288 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05147 , H01L2224/05575 , H01L2224/05599 , H01L2224/1148 , H01L2224/13007 , H01L2224/13022 , H01L2224/13111 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/01015
摘要： The present invention relates to a method for fabricating a semiconductor device with a last level copper-to-C4 connection that is essentially free of aluminum. Specifically, the last level copper-to-C4 connection comprises an interfacial cap structure containing CoWP, NiMoP, NiMoB, NiReP, NiWP, and combinations thereof. Preferably, the interfacial cap structure comprises at least one CoWP layer. Such a CoWP layer can be readily formed over a last level copper interconnect by a selective electroless plating process.
摘要翻译：本发明涉及一种用于制造具有基本上不含铝的最后一级铜对C4连接的半导体器件的方法。具体地说，最后一级的铜对C4连接包括含有CoWP，NiMoP，NiMoB，NiReP，NiWP及其组合的界面盖结构。优选地，界面帽结构包括至少一个CoWP层。这种CoWP层可以通过选择性无电镀方法容易地在最后一级铜互连上形成。

5. 发明申请

US20120012642A1 INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS 审中-公开
标题翻译：使用无铅焊盘和具有反应障碍层的片芯互连
公开(公告)号：US20120012642A1
公开(公告)日：2012-01-19
申请号：US13244576
申请日：2011-09-25
申请人： Keith E. Fogel , Balaram Ghosal , Sung K. Kang , Stephen Kilpatrick , Paul A. Lauro , Henry A. Nye, III , Da-Yuan Shih , Donna S. Zupanski-Nielsen
发明人： Keith E. Fogel , Balaram Ghosal , Sung K. Kang , Stephen Kilpatrick , Paul A. Lauro , Henry A. Nye, III , Da-Yuan Shih , Donna S. Zupanski-Nielsen
IPC分类号： B23K35/14 , B23K35/24
CPC分类号： H01L24/05 , H01L24/03 , H01L24/11 , H01L24/12 , H01L2224/03912 , H01L2224/0401 , H01L2224/05 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/13023 , H01L2224/13099 , H01L2224/131 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/30107 , H01L2924/00014
摘要： An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components. With a two-layer ball-limiting composition comprising an adhesion/reaction barrier layer, wherein the adhesion/reaction barrier layer serves both as an adhesion layer and a reaction barrier layer, the adhesion/reaction barrier layer can be comprised of a material selected from the group consisting of Zr and ZrN
摘要翻译：一种适于将微电子器件芯片倒装连接到封装的互连结构，包括二层，三层或四层限球组合物，包括粘附/反应阻挡层，并且具有与含锡的组分反应的焊料可湿性层无铅焊料，使得可焊接层在焊接期间可以完全消耗，但在焊接期间与无铅焊料接触后，阻挡层保持不变。一个或多个无铅焊料球选择性地位于焊料润湿层上，该无铅焊球包含锡作为主要成分和一种或多种合金成分。使用包含粘合/反应阻挡层的双层球限制组合物，其中粘附/反应阻挡层既用作粘合层又用作反应阻挡层，粘合/反应阻挡层可以由选自由Zr和ZrN组成的组

6. 发明授权

US08487304B2 High performance compliant wafer test probe 有权
标题翻译：高性能兼容晶圆测试探头
公开(公告)号：US08487304B2
公开(公告)日：2013-07-16
申请号：US12771697
申请日：2010-04-30
申请人： S. Jay Chey , Dustin M. Fregeau , Donna S. Zupanski-Nielsen , Aparna Prabhakar , Pavan Samudrala , Mohammed S. Shaikh
发明人： S. Jay Chey , Dustin M. Fregeau , Donna S. Zupanski-Nielsen , Aparna Prabhakar , Pavan Samudrala , Mohammed S. Shaikh
IPC分类号： H01L23/58 , H01L23/48 , H01L23/52
CPC分类号： G01R1/06716 , G01R1/06733 , G01R1/06755 , H01L2224/16225 , H01L2924/15311
摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.
摘要翻译：电连接包括由导电材料制成的第一电接触。第一电触点在其中形成凹陷。还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。

7. 发明申请

US20110266539A1 High Performance Compliant Wafer Test Probe 有权
标题翻译：高性能合格晶圆测试探头
公开(公告)号：US20110266539A1
公开(公告)日：2011-11-03
申请号：US12771697
申请日：2010-04-30
申请人： S. Jay Chey , Dustin M. Fregeau , Donna S. Zupanski-Nielsen , Aparna Prabhakar , Pavan Samudrala , Mohammed S. Shaikh
发明人： S. Jay Chey , Dustin M. Fregeau , Donna S. Zupanski-Nielsen , Aparna Prabhakar , Pavan Samudrala , Mohammed S. Shaikh
IPC分类号： H01L23/544 , H01L23/58
CPC分类号： G01R1/06716 , G01R1/06733 , G01R1/06755 , H01L2224/16225 , H01L2924/15311
摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.
摘要翻译：电连接包括由导电材料制成的第一电接触。第一电触点在其中形成凹陷。还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。

8. 发明授权

US07923849B2 Interconnections for flip-chip using lead-free solders and having reaction barrier layers 有权
标题翻译：使用无铅焊料并具有反应阻挡层的倒装芯片的互连
公开(公告)号：US07923849B2
公开(公告)日：2011-04-12
申请号：US12113152
申请日：2008-04-30
申请人： Keith E. Fogel , Balaram Ghosal , Sung K. Kang , Stephen Kilpatrick , Paul A. Lauro , Henry A. Nye, III , Da-Yuan Shih , Donna S. Zupanski-Nielsen
发明人： Keith E. Fogel , Balaram Ghosal , Sung K. Kang , Stephen Kilpatrick , Paul A. Lauro , Henry A. Nye, III , Da-Yuan Shih , Donna S. Zupanski-Nielsen
IPC分类号： H01L21/00
CPC分类号： H01L24/05 , H01L24/03 , H01L24/11 , H01L24/12 , H01L2224/03912 , H01L2224/0401 , H01L2224/05 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/13023 , H01L2224/13099 , H01L2224/131 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/30107 , H01L2924/00014
摘要： An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.
摘要翻译：一种适于将微电子器件芯片倒装连接到封装的互连结构，包括二层，三层或四层限球组合物，包括粘附/反应阻挡层，并且具有与含锡的组分反应的焊料可湿性层无铅焊料，使得可焊接层在焊接期间可以完全消耗，但在焊接期间与无铅焊料接触后，阻挡层保持不变。一个或多个无铅焊料球选择性地位于焊料润湿层上，该无铅焊球包含锡作为主要成分和一种或多种合金成分。

9. 发明授权

US09335346B2 High performance compliant wafer test probe 有权
公开(公告)号：US09335346B2
公开(公告)日：2016-05-10
申请号：US13608706
申请日：2012-09-10
申请人： S. Jay Chey , Dustin M. Fregeau , Donna S. Zupanski-Nielsen , Aparna Prabhakar , Pavan Samudrala , Mohammed S. Shaikh
发明人： S. Jay Chey , Dustin M. Fregeau , Donna S. Zupanski-Nielsen , Aparna Prabhakar , Pavan Samudrala , Mohammed S. Shaikh
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , G01R1/067
CPC分类号： G01R1/06716 , G01R1/06733 , G01R1/06755 , H01L2224/16225 , H01L2924/15311
摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

10. 发明申请

US20120329295A1 High Performance Compliant Wafer Test Probe 有权
标题翻译：高性能合格晶圆测试探头
公开(公告)号：US20120329295A1
公开(公告)日：2012-12-27
申请号：US13608706
申请日：2012-09-10
申请人： S. Jay Chey , Dustin M. Fregeau , Donna S. Zupanski-Nielsen , Aparna Prabhakar , Pavan Samudrala , Mohammed S. Shaikh
发明人： S. Jay Chey , Dustin M. Fregeau , Donna S. Zupanski-Nielsen , Aparna Prabhakar , Pavan Samudrala , Mohammed S. Shaikh
IPC分类号： H05K1/02
CPC分类号： G01R1/06716 , G01R1/06733 , G01R1/06755 , H01L2224/16225 , H01L2924/15311
摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.
摘要翻译：电连接包括由导电材料制成的第一电接触。第一电触点在其中形成凹陷。还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。

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